High-Speed Track-and-Hold Circuit Design October 17th, 2012 Saeid Daneshgar, Prof. Mark Rodwell (UCSB) Zach Griffith (Teledyne)

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Presentation transcript:

High-Speed Track-and-Hold Circuit Design October 17th, 2012 Saeid Daneshgar, Prof. Mark Rodwell (UCSB) Zach Griffith (Teledyne)

2 Outline 250 nm InP HBT technology review Applications and Motivation Key design features and contributions Review of circuit design and layout Measurement results and comparison

3 TSC 250nm InP HBT Process Four metal interconnect stack Peak bandwidth of f max = 700 GHz & f t =400 GHz MIM caps of 0.3 fF/μm 2 Thin-film resistors 50 Ω/square Plot courtesy Zach Griffith, UCSB 250nm InP HBT, 2007

4 Wideband Sample & Hold Applications Sub-sampling applications: automated test equipment (ATE), oscilloscope, jitter measurement … Slide courtesy MJC Teledyne Undersampling applications: undersampling receivers Direct conversion receiver: Problems such as DC offset, noise, distortion, I/Q mismatch, etc Undersampling receiver: T/H replaces downconversion mixer Elimintaes IF filter, IF gain stages, mixer and high frequency LO DC offset, IQ mismatch problem goes away Noise folding is a problem

5 Motivation: Sample & Hold vs Track & Hold

6 High Frequency Sampling Techniques Diode bridge: [1] Wide bandwidth  Linearity  Dynamic Range Switched Emitter Follower (SEF): [2] Good linearity Better dynamic range  Stability issues with EF Base-collector diode: Widest bandwidth Good linearity Highest dynamic range No stability issues Flat AC response [1] J. C. Jensen and L. E. Larson, “A broadband 10-GHz track-and-hold in Si/SiGe HBT technology,” IEEE JSSC, Mar [2] S. Shahramian, A. C. Carusone and S. P. Voinigescu, “Design Methodology for a 40-GSamples/s Track and Hold Amplifier in 0.18-μm SiGe BiCMOS Technology,” IEEE JSSC, Oct

7 Key Design Features Track & hold switch: base-collector diode lower R on, lower C off than HBT e-b junction minority carrier storage time approximately equal to base transit time Common reports in the literature: switch voltage swings set very small and fast, but high IP3 only for f signal <<f Nyquist Real-world design requires: switch voltages set for high IP3 with Nyquist-frequency input Linearization of input buffer for high IP3 cubic feedforward path cancels IM3 from differential pair

8 Input Buffer & TH Switch

9

10 Nonlinearity Derivation - I [1] W. Sansen, “Distortion in Elementary Transistor Circuits,” IEEE TCAS-II: Analog and Digital Signal Processing, vol. 46, no. 3, pp , Mar [1]

11 Nonlinearity Derivation-II

12 Nonlinearity Derivation - III

13 Output Buffer & Output Driver

14 Output Buffer & Output Driver Output buffer should always be on in Sample & Hold circuit Output stage needs to be designed linear enough not to affect total nonlinearity of the circuit

15 Layout (Signal path) I.B. O.D. TH Switch O.B. TH Switch

16 S-parameters measurement

17 Clock Distribution Circuit

18 Clock Distribution Circuit I tail =6 mA I tail =12 mA

19 Clock Distribution Circuit - layout LPB HPB C-H Amp.

20 Transient and Linearity Measurements 10 GHz RF input signal with a 50 GHz clock IIP3 & OIP3 vs Fin for Fclk = 50GHz

21 THD and Beat test Measurements Measured HD 2 and HD GHz input signal is being sampled by 40 GSamples/s sampling rate. P1dB

22 Comparison with the State of the Art Works

23 Questions?

24 T&H Chip layout

25 S&H Chip layout

26 Sample & Hold Transient waveforms 10 GHz RF input signal is being sampled by a 50 GHz clock DifferentialSingle-ended

27 Sample & Hold Beat frequency test Fin=20.5 GHz, Fclk=20 GHzFin=20.5 GHz, Fclk=10 GHz Simulation Experiment

28 Sample & Hold Linearity Measurements Calculated ENOB using simulated noise figure of 20dB is more than 6bits.

29 Base-Collector Diode modeling - I

30 Base-Collector Diode modeling - II I-V Characteristic Forward biased I-V Characteristic Reverse biased Linear Scale Log Scale