Information Society Technologies Micro - and Nano- electronics in FP6 call 1 Georg Kelm European Commission DG Information Society Unit C1 : Micro-, nano- and opto-electronics

  Framework Programme 6 : IST Micro- and Nano-electronics in FP6 call 1 Presentation Outline

Budgets for the Specific Programmes Integrating & strengthening Integrating & strengthening –Genomics 2,255 B –Genomics 2,255 B€ –IST3,625 B –IST3,625 B€ –Nanotechnologies, int.. 1,300 B –Nanotechnologies, int.. 1,300 B€ –Aeronautics and space1,075 B –Aeronautics and space1,075 B€ –Food safety0,685 B –Food safety0,685 B€ –Sustainable development2,120 B –Sustainable development2,120 B€ –Citizens in knowledge 0,225 B –Citizens in knowledge 0,225 B€ –Anticipation of S&T needs SMEs0,430 BSMEs0,430 B€ Specific InCo0,315 BSpecific InCo0,315 B€ Anticipating needs0,555 BAnticipating needs0,555 B€ –Reinforcing ERA basis0,320 B –Reinforcing ERA basis0,320 B€ Structuring ERA Structuring ERA –Research and Innovation0,290 B –Research and Innovation0,290 B€ –Human resources1,580 B –Human resources1,580 B€ –Research Infrastructures0,655 B –Research Infrastructures0,655 B€ –Science/Society0,080 B –Science/Society0,080 B€ Joint Research Centre 0,760 B Joint Research Centre 0,760 B€ 12,905 B€ 2,605 B€ 16, 270 B€ 760 B€ Euratom: 1,230 B€

‘anywhere, anytime, any service, for all’ core technologies & “pull-through” applications Components & microsytems Knowledge & interface technologies Communication, computing & software technologies - - mobile: beyond 3G - broadband access - networked audio- visual systems - - software & services development - embedded systems - [post-]CMOS - optical, opto-el., photonics - - micro & nano systems - displays - - semantic-based knowledge - cross-media content - - multi-modal interfaces Applied IST research for major societal and economic challenges - - dependability & security - - eHealth - eInclusion - eSafety of transport - environmental risk mgmt - learning & culture - - networked organisations - services for mobile user - service & product engineering - - GRID-based systems & complex pb solving - cognitive systems IST Strategic Objectives

Reinforce leadership where Europe has demonstrated strengths, e.g. – – mobile communications and services, broadband communications – – micro-, opto-electronics & µsystems, – – networked audiovisual systems... – – Security and dependability,… Seize new opportunities that arise from the ‘AmI’ vision and address weaknesses / threats critical for its realisation, e.g. – – multimodal interfaces, semantic-based knowledge handling,.. – – embedded systems, integration of sensing & actuating devices,... – – Knowledge and computing GRIDs Defining the Strategic Objectives (1)

Defining the Strategic Objectives (2) Continued support to leading / challenging applications, responding to emerging needs, e.g. – – eHealth, eInclusion, eLearning and culture, – – Entertainment and leisure content – – business support tools, networked organisations,... Support to research at the frontier of knowledge – – FET open – – FET proactive – – Cognitive science Support to infrastructure development – – Research networking test beds – – Open development platforms – – IST for safety in transport, risk management,..

Time Table for calls Call 1 – –opened 17 December 2002, – –closing 24 April 2003 at 17:00 Call 2 – –opening 15 June 2003 – –closing 15 October 2003

FP6: Six instruments for “Priority Areas” Integrated Projects Integrated Projects –Objective driven Networks of Excellence Networks of Excellence –Exploratory research Article 169 Article 169 –Member states initiative Specific Targeted Research Projects Specific Targeted Research Projects –Address specific issues Co-ordination actions Co-ordination actions Support Actions Support Actions No longer available ….. No longer available ….. - Individual Take-up Actions - SME Exploratory Awards New instruments

Framework Programme 6 : IST   Micro- and Nano-electronics in FP6 call 1 Presentation Outline

Expressions of Interest Expressions of Interest 161 EoIs in Micro-, Nano- and Opto-electronics (analysis see Opto µElectronics Technology Design IP NoE µElectronics Technology 34% Design 18% Opto 48% 52% Topics : devices CMOS limits SoC components compound semic. (IP re-use, material alternative devices RF, MS) (+ applicat.) lithography low power

IST Workprogramme Pushing CMOS, Preparing post-CMOS Micro & nano systems Broadband access for all Mobile & wireless systems beyond 3G Towards a global dependability & security framework Multimodal interfaces Semantic-based knowledge systems Networked AV systems & home platforms Networked businesses & governments eSafety of road & air transports eHealth eLearning & access to cultural heritage Call 1 Advanced displays Optical, opto-electronic & photonic functional components Open development platforms for software & services Cognitive systems Embedded systems Applications & services for the mobile user & worker Cross-media content for leisure & entertainment GRID-based systems for solving complex problems Improving risk management eInclusion Products & services engineering 2010 FET Call 2

International Technology Roadmap for Semiconductors FP6 IST

International Technology Roadmap for Semiconductors FP6 IST

Topics for WP (call 1) Pushing the limits of CMOS and preparing for post-CMOS Prepare for electronic components of 2010 and beyond Focus on: Technology (down to 5nm) Pushing the limits of CMOS and preparing for post-CMOS Prepare for electronic components of 2010 and beyond Focus on: Technology (down to 5nm) –nano CMOS : integration of advanced and non-CMOS devices, on-chip wiring –high frequency : facilitating ultra high frequency and power applications silicon-based or compound semiconductors including packaging –lithography : pushing the limits of lithography (including maskless) –alternative technologies and devices for post-CMOS: emerging nanoelectronics technologies for future applications –IPs may include equipment assessment activities

ITRS’99 Transistors/Chip (M) Transistor/PM (K) IC Design “Productivity Gap” IC Production Design productivity Grand Challenge = Multiply productivity by 10 Grand Challenge = Multiply productivity by 10 Escalating Design Costs ! Escalating Design Costs ! Skill Shortage ! Skill Shortage ! 1,600my Can we design what we can produce? Can we design what we can produce?

Topics for WP (call 1) Pushing the limits of CMOS and preparing for post-CMOS Improve design productivity by a factor of 10 by 2010 Focus on: Design : reliable 1 billion gate systems Pushing the limits of CMOS and preparing for post-CMOS Improve design productivity by a factor of 10 by 2010 Focus on: Design : reliable 1 billion gate systems –system level : novel approaches to design better and faster improve system performance / reliability, specify / verify at system level, stimulate IP re-use, enhance flexibility / reconfigurability, optimize power consumption –improve the use of large systems (redundancy), improve testability –specific design challenges : mixed-signal, low power, RF, packaging –support change from board electronics to system-on-chip : develop, demonstrate and standardize architectures, design productivity –complement with education and training in design

Websites for information General FP6 Site: (Legal texts etc). Instrument fiches: Contracts: contract/index_en.html contract/index_en.html Expressions of Interests: Micro-, nano- and opto-electronics components (Unit C1): KEEP YOURSELF UPDATED