FUJIFILM Electronic Materials Confidential and Proprietary Information FUJIFILM ELECTRONIC MATERIALS Page 1 FUJIFILM Electronic Materials Company Overview Advanced Photoresist ArF, KrF - dry/immersion, SLR/BLR, NTI, e-beam, EUV Core Photoresist g-line, i-line, negative Color Photoresist Resist and ancillaries for image sensor applications Photosensitive Polyimide Negative and positive tone – solvent and aqueous developable materials for buffer coat and ILD applications Dielectric Materials and Delivery Systems Thin film precursors for low-k and high-k applications Formulated Products Mixed-acids, strippers, cleaners, developers, edge-bead removers, custom blends FUJIFILM Planar Solutions – CMP Slurries Slurries for the copper process engineered for customer specific applications Strategic Business Units FUJIFILM ELECTRONIC MATERIALS

FUJIFILM Electronic Materials Confidential and Proprietary Information FUJIFILM ELECTRONIC MATERIALS Page 2 FUJIFILM Electronic Materials Company Overview Global Manufacturing Infrastructure Shizuoka, Japan Rhode Island, USA Arizona, USA Zwijndrecht, Belgium Hsinchu, Taiwan Suzhou, China Developers Resist Edge-bead Removers Photoresists Polyimides Acids / Blends Strippers Thin Films Color Mosaics FUJIFILM ELECTRONIC MATERIALS Negative Resist

FUJIFILM Electronic Materials Confidential and Proprietary Information FUJIFILM ELECTRONIC MATERIALS Page 3 FUJIFILM Electronic Materials Company Overview Chip Silicon Wafer Prepare Pattern and Etch Remove Deposit layer Modify Electrical Properties Dice CMP Post CMP Cleaners Photoresists Edge Bead Removers Developers Cleaners Strippers Dielectrics Low K Barriers Delivery Equipment Photosensitive Polyimides Post CMP Cleaners Protective Coating Photoresists Formulated Products Formulated Products Thin Film Systems Aqueous and Solvent Based Buffer Coat Materials Broad Product Offering Across Semiconductor Manufacturing Chain FUJIFILM ELECTRONIC MATERIALS