Digital Integrated Circuits© Prentice Hall 1995 Interconnect COPING WITH INTERCONNECT.

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Presentation transcript:

Digital Integrated Circuits© Prentice Hall 1995 Interconnect COPING WITH INTERCONNECT

Digital Integrated Circuits© Prentice Hall 1995 Interconnect Impact of Interconnect Parasitics

Digital Integrated Circuits© Prentice Hall 1995 Interconnect Nature of Interconnect

Digital Integrated Circuits© Prentice Hall 1995 Interconnect INTERCONNECT

Digital Integrated Circuits© Prentice Hall 1995 Interconnect Capacitance: The Parallel Plate Model

Digital Integrated Circuits© Prentice Hall 1995 Interconnect Typical Wiring Capacitance Values

Digital Integrated Circuits© Prentice Hall 1995 Interconnect Fringing Capacitance

Digital Integrated Circuits© Prentice Hall 1995 Interconnect Fringing Capacitance: Values

Digital Integrated Circuits© Prentice Hall 1995 Interconnect How to counter Clock Skew?

Digital Integrated Circuits© Prentice Hall 1995 Interconnect Interwire Capacitance

Digital Integrated Circuits© Prentice Hall 1995 Interconnect Interwire Capacitance

Digital Integrated Circuits© Prentice Hall 1995 Interconnect Impact of Interwire Capacitance

Digital Integrated Circuits© Prentice Hall 1995 Interconnect Capacitance Crosstalk

Digital Integrated Circuits© Prentice Hall 1995 Interconnect How to Battle Capacitive Crosstalk

Digital Integrated Circuits© Prentice Hall 1995 Interconnect Driving Large Capacitances

Digital Integrated Circuits© Prentice Hall 1995 Interconnect Using Cascaded Buffers

Digital Integrated Circuits© Prentice Hall 1995 Interconnect t p in function of u and x

Digital Integrated Circuits© Prentice Hall 1995 Interconnect Impact of Cascading Buffers

Digital Integrated Circuits© Prentice Hall 1995 Interconnect Output Driver Design

Digital Integrated Circuits© Prentice Hall 1995 Interconnect How to Design Large Transistors

Digital Integrated Circuits© Prentice Hall 1995 Interconnect Bonding Pad Design Bonding Pad Out In V DD GND 100  m GND Out

Digital Integrated Circuits© Prentice Hall 1995 Interconnect Reducing the swing Reducing the swing potentially yields linear reduction in delay Also results in reduction in power dissipation Requires use of “sense amplifier” to restore signal level

Digital Integrated Circuits© Prentice Hall 1995 Interconnect INTERCONNECT

Digital Integrated Circuits© Prentice Hall 1995 Interconnect Wire Resistance

Digital Integrated Circuits© Prentice Hall 1995 Interconnect Interconnect Resistance

Digital Integrated Circuits© Prentice Hall 1995 Interconnect Dealing with Resistance

Digital Integrated Circuits© Prentice Hall 1995 Interconnect Polycide Gate Mosfet

Digital Integrated Circuits© Prentice Hall 1995 Interconnect Modern Interconnect

Digital Integrated Circuits© Prentice Hall 1995 Interconnect RI Introduced Noise

Digital Integrated Circuits© Prentice Hall 1995 Interconnect Power and Ground Distribution

Digital Integrated Circuits© Prentice Hall 1995 Interconnect Electromigration (1)

Digital Integrated Circuits© Prentice Hall 1995 Interconnect Electromigration (2)

Digital Integrated Circuits© Prentice Hall 1995 Interconnect RC-Delay

Digital Integrated Circuits© Prentice Hall 1995 Interconnect RC-Models

Digital Integrated Circuits© Prentice Hall 1995 Interconnect Reducing RC-delay Repeater

Digital Integrated Circuits© Prentice Hall 1995 Interconnect The Ellmore Delay

Digital Integrated Circuits© Prentice Hall 1995 Interconnect Penfield-Rubinstein-Horowitz

Digital Integrated Circuits© Prentice Hall 1995 Interconnect INTERCONNECT

Digital Integrated Circuits© Prentice Hall 1995 Interconnect Inductive Effects in Integrated Circuits

Digital Integrated Circuits© Prentice Hall 1995 Interconnect L di/dt

Digital Integrated Circuits© Prentice Hall 1995 Interconnect L di/dt: Simulation

Digital Integrated Circuits© Prentice Hall 1995 Interconnect Choosing the Right Pin

Digital Integrated Circuits© Prentice Hall 1995 Interconnect Decoupling Capacitors

Digital Integrated Circuits© Prentice Hall 1995 Interconnect Packaging

Digital Integrated Circuits© Prentice Hall 1995 Interconnect Bonding Techniques

Digital Integrated Circuits© Prentice Hall 1995 Interconnect Tape-Automated Bonding (TAB)

Digital Integrated Circuits© Prentice Hall 1995 Interconnect Flip-Chip Bonding

Digital Integrated Circuits© Prentice Hall 1995 Interconnect Package-to-Board Interconnect

Digital Integrated Circuits© Prentice Hall 1995 Interconnect Package Types

Digital Integrated Circuits© Prentice Hall 1995 Interconnect Package Parameters

Digital Integrated Circuits© Prentice Hall 1995 Interconnect Multi-Chip Modules