AIDA FEE64 development report August 2010 Progress after Texas CAD work Manufacturing 25th August 20101.

Slides:



Advertisements
Similar presentations
Controller Tests Stephen Kaye Controller Test Motivation Testing the controller before the next generation helps to shake out any remaining.
Advertisements

6 Mar 2002Readout electronics1 Back to the drawing board Paul Dauncey Imperial College Outline: Real system New VFE chip A simple system Some questions.
Motor Control Lab Using Altera Nano FPGA
EXL/R3B Calorimeters- Readout from ASIC to DAQ Ian Lazarus STFC Daresbury Laboratory.
ESODAC Study for a new ESO Detector Array Controller.
20 Feb 2002Readout electronics1 Status of the readout design Paul Dauncey Imperial College Outline: Basic concept Features of proposal VFE interface issues.
RPC Electronics Status Overall system TDC –Digitizing frequency issue (determine the bin size of the TDC value) Discriminator test result Trigger module.
28 August 2002Paul Dauncey1 Readout electronics for the CALICE ECAL and tile HCAL Paul Dauncey Imperial College, University of London, UK For the CALICE-UK.
6 June 2002UK/HCAL common issues1 Paul Dauncey Imperial College Outline: UK commitments Trigger issues DAQ issues Readout electronics issues Many more.
Large Area, High Speed Photo-detectors Readout Jean-Francois Genat + On behalf and with the help of Herve Grabas +, Samuel Meehan +, Eric Oberla +, Fukun.
4 Dec 2001First ideas for readout/DAQ1 Paul Dauncey Imperial College Contributions from all of UK: result of brainstorming meeting in Birmingham on 13.
Development of a 20 GS/s Sampling Chip in 130nm CMOS Technology Jean-Francois Genat On behalf of Mircea Bogdan 1, Henry J. Frisch 1, Herve Grabas 3, Mary.
9th October 2008AIDA FEE progress report P.J.Coleman-Smith 1 AIDA Frontend Electronics progress report. Mezzanine to FEE64 connection. Mezzanine Layout.
CMS Upgrade Workshop November Fermilab POWER DISTRIBUTION SYSTEM STUDIES FOR THE CMS TRACKER Fermilab,University of Iowa and University of Mississippi.
Patrick Coleman-Smith CCLRC Daresbury 1 AGATA Digitiser Summary February 2005 Patrick J. Coleman-Smith For the Digitiser Technical Group  I.Lazarus Daresbury.
AIDA design review Davide Braga Steve Thomas ASIC Design Group 9 June 2009.
Electronics for PS and LHC transformers Grzegorz Kasprowicz Supervisor: David Belohrad AB-BDI-PI Technical student report.
Leo Greiner IPHC testing Sensor and infrastructure testing at LBL. Capabilities and Plan.
ECE 477 DESIGN REVIEW TEAM 2  FALL 2011 Members: Bo Yuan, Yimin Xiao, Yang Yang, Jintao Zhang.
FEE Electronics progress Mezzanine manufacture progress FEE64 testing and VHDL progress Test mezzanine. Trial mechanical assembly 10th November 2009.
SIGMA-DELTA ADC SD16_A Sigma-Delta ADC Shruthi Sujendra.
David Cussans/Scott Mandry, NIKHEF, October 2008 TLU v0.2.
Readout ASIC for SiPM detector of the CTA new generation camera (ALPS) N.Fouque, R. Hermel, F. Mehrez, Sylvie Rosier-Lees LAPP (Laboratoire d’Annecy le.
12th May 2008AIDA FEE Report1 AIDA Front end electronics Report May 2008 Progress Data compression Plan for prototype delivery.
CMS ECAL End Cap Meeting CERN 19 June to 23 June 2000 A.B.Lodge - RAL 1 ECAL End Cap High Voltage Cards and 2000 Electrical/Thermal Model. Progress on.
1 Programming of FPGA in LiCAS ADC for Continuous Data Readout Week 3 Report Jack Hickish.
HBD FEM the block diagram preamp – FEM cable Status Stuffs need to be decided….
27 th September 2007AIDA design meeting. 27 th September 2007AIDA design meeting.
An Unobtrusive Debugging Methodology for Actel AX and RTAX-S FPGAs Jonathan Alexander Applications Consulting Manager Actel Corporation MAPLD 2004.
11th March 2008AIDA FEE Report1 AIDA Front end electronics Report February 2008.
Hall D Online Meeting 27 June 2008 Fast Electronics R. Chris Cuevas Jefferson Lab Experimental Nuclear Physics Division 12 GeV Trigger System Status Update.
Status and planning of the CMX Wojtek Fedorko for the MSU group TDAQ Week, CERN April , 2012.
FEE Electronics progress PCB layout progress VHDL progress in TBU Prototype fixtures FEE64 commissioning A few of the remaining tasks 16th July 2009.
HBD FEE test result summary + production schedule 16mv test pulse result –5X attenuator + 20:1 resistor divider at input (to reduce the noise on the test.
FED RAL: Greg Iles5 March The 96 Channel FED Tester What needs to be tested ? Requirements for 96 channel tester ? Baseline design Functionality.
Acquisition Crate Design BI Technical Board 26 August 2011 Beam Loss Monitoring Section William Vigano’ 26 August
Jan, 2001CMS Tracker Electronics1 Hybrid stability studies Multi – chip hybrid stability problem when more then ~ 2 chips powered up -> common mode oscillation.
March 9, 2005 HBD CDR Review 1 HBD Electronics Preamp/cable driver on the detector. –Specification –Schematics –Test result Rest of the electronics chain.
Digital Microfluidics Control System II P Previous state - The previous control system is not self contained and uses a class AB amplifier which.
Meteor Receiver Andrew Thoni Charlie Hunter Greg Watkins Nick Nicholson Will Marshall.
ERC - Elementary Readout Cell Miguel Ferreira 18 th April 2012
Front End Board (16 channels) Superlayer Cross Section Frontend Enclosure HV cap board HV cap Board Signals from chamber wires go to HV cap board to be.
Sensor testing and validation plans for Phase-1 and Ultimate IPHC_HFT 06/15/ LG1.
FEE Electronics progress Mezzanine layout progress FEE64 progress FEE64 initial testing Test mezzanine. A few of the remaining tasks 2nd October 2009.
11 October 2002Paul Dauncey - CDR Introduction1 CDR Introduction and Overview Paul Dauncey Imperial College London.
TPC electronics Status, Plans, Needs Marcus Larwill April
Status of MAPMT FEE Electronics Boards Connector board – have 5 boards, 1 assembled Readout board (“MUX” board) – layout completed 12/2, but unfortunately.
1 CPC2-CPR2 Assemblies Testing Status Charge Amplifiers –Attempts to make them work Best voltage single channel 2MHz Cluster finding first.
Electronics Workshop GlueX Collaboration Meeting 28 March 2007 Fast Electronics R. Chris Cuevas Group Leader Jefferson Lab Physics Division Topics: Review.
Notes on visit to Rome 28/04/2014 Christian Joram Szymon Kulis Samir Arfaoui.
FEE Electronics progress PCB layout progress VHDL progress in TBU Prototype fixture for software 9th June 2009.
Vladimir Zhulanov for BelleII ECL group Budker INP, Novosibirsk INSTR2014, Novosibirsk 2014/02/28 1.
DHH Status Igor Konorov TUM, Physics Department, E18 PXD DAQ workshop Münzenberg –June 9-10, 2011.
PHOTOTUBE SCANNING SETUP AT THE UNIVERSITY OF MARYLAND Doug Roberts U of Maryland, College Park.
1 Programming of FPGA in LiCAS ADC for Continuous Data Readout Week 4 Report Tuesday 22 nd July 2008 Jack Hickish.
ECAL electronics schedule JFMAMJJASONDJFMAM Prototype 2 boards Design Layout Fabrication and assembly Testing, including VFE prototype tests Production.
Jinfan Chang Experimental Physics Center , IHEP Feb 18 , 2011
Iwaki System Readout Board User’s Guide
96-channel, 10-bit, 20 MSPS ADC board with Gb Ethernet optical output
KRB proposal (Read Board of Kyiv group)
Christophe Beigbeder PID meeting
CMS EMU TRIGGER ELECTRONICS
FEE Electronics progress
Electronics: Demod + 4Q FE
Assembly order PCB design
University of California Los Angeles
FEE Electronics progress
STAR-CBM Joint Workshop Heidelberg, Physikalisches Institut
FEE Electronics progress
PID meeting Mechanical implementation Electronics architecture
Presentation transcript:

AIDA FEE64 development report August 2010 Progress after Texas CAD work Manufacturing 25th August 20101

Progress after Texas 1.Power supply re-think – Linear or Switch mode. Deferred until the internal power supply structure is redesigned. 2.Readout of ASICS sequence of handshake to stop the slip of data relative to the channel number. Deferred until after the new card manufacture has started. 3.Change the test input system and investigate the problems with saturated inputs feeding back into the test network. No work done on this area. 4.Why does location 0 in the internal peripheral get cleared at power-up. Deferred until after the new card manufacture has started. 5.FADC triggering – more complex options perhaps using a chipscope ILA as the source. Not yet required. 6.HEC + delayed pulser – why are there 2+ peaks from the pulser in the LEC range. Why do they go if the delay is >10mS. No work done on this area. 7.Design the earthing structure into the mechanics. Waiting for the new power supply structure design. Review of the existing grounding structure will be carried out as part of the pcb design. 8.Investigate and propose solutions for the apparent effect of different routing of the buffered preamp outputs having different noise performance. Perhaps change the relative position of the buffers and ADCs. This has been investigated. See the later narrative in this document. 25th August 20102

Progress after Texas 9.Why does the FADC signal range not cover the full ASIC output swing. This has been investigated and a solution is now being implemented. 10.Why does the discriminator readout system stop working at high rates. Deferred until after the new card manufacture has started. 11.What is the true maximum specified input rate for the system. Deferred until after the new card manufacture has started. 12.Send the broken TTi power supply back for repair. Completed – Refund in received. 13.Re-try the water cooling. Also with two modules in place and powered up. Deferred until the internal power supply structure is redesigned. 14.Try out the effect of an isolating transformer as a method of noise reduction in conjunction with Linear and Switch mode supplies. Deferred until the internal power supply structure is redesigned. 25th August 20103

Progress after Texas Problems with synchronising the FADC acquisition clocks No solution is yet found. A new version of the clock cleaning and distribution chip is available with a “0 – delay” option which implies the input and output clocks can be phase locked. This should lead to the ability to align the clocks by using software and FPGA resources. 25th August 20104

Progress after Texas Investigations of the effects of the DC-DC convertors on the multiplex readout. Four of the convertors have been disabled and connected to external linear supplies. The performance of the ASIC multiplex readout has improved. 25th August 20105

Progress after Texas The power supply system redesign. 25th August 20106

Progress after Texas Investigation of the code spread and noise in the FADCs. Detector Development Group, DDG, have been investigating the problems with the buffers that interface to the FADCs. The effect of changes to the buffering are shown as FFTs in a plot of all channels with colour to show relative signal intensity. 25th August 20107

Starting point 25th August 20108

Remove all 10pF capacitors 25th August 20109

Buffer Changes ADC6, ADA4932, R=444R ADC4: R=330R Vref buf removed and output shorted to ground. 25th August

CAD work The update of the schematic and the pcb to Revision A. Redesign: The remaining design work involves the clock distribution system as discussed earlier. The JTAG (FPGA programming) and the console connectors have been amalgamated to one connector which is designed to allow the connections to be made when the module is fully assembled using a small adaptor board with the standard connectors on. Work to simulate the FADC buffers to remove the problems of the feedback capacitor, oscillation and use of only part of the full scale of the FADC has been completed by I.Lazarus. The ASIC multiplex readout system has been simulated and redesigned to increase the conversion rate to 1Mhz and use the full range of the ADC by I.Lazarus. 25th August

CAD Work Schematic: Changes to the schematic are 60% complete in terms of the document detailing the changes to be done. The major changes to the 64 channels of buffering for the FADCs have been completed. The new power supply design is complete. The changes to the ASIC multiplex readout developed to accommodate the full range of the ADC and to increase the conversion speed, and hence the ASIC clock rate, from 500Khz to 1Mhz are complete. 25th August

CAD Work PCB: The layout of the power supply has proceeded to the point where the two uModules and their associated components fit into the existing power supply area. Places for the new LDOs have been identified. The new FADC buffer circuits have been installed. The PCB has not yet been lengthened. 25th August