1 U. Goerlach, LECC Colmar Sept 2002  Design Considerations and a some History  Technology Choices  First Prototypes on Ceramics and Results  New Developments in Rigid-Flex and Full-Flex Technology  Preparation of Industrial Production and Testing (FHIT)  Conclusions  Design Considerations and a some History  Technology Choices  First Prototypes on Ceramics and Results  New Developments in Rigid-Flex and Full-Flex Technology  Preparation of Industrial Production and Testing (FHIT)  Conclusions Front-End Hybrids for the CMS Silicon Tracker Front-End Hybrids for the CMS Silicon Tracker Laboratories: IReS & LEPSI, Strasbourg UCL-Louvain & RWTH Aachen III Contributing Aachen I, Bari, CERN, IC-London, Karlsruhe, Pisa, Vienna U. Goerlach, LECC Colmar Sept 2002

2  Start in 2000  Definition of functionality  Modularity: hybrid geometries and shapes  Technology choices  Option for fully industrial production   Prototyping in thick-film technology ca. 180 FE-hybrids  Many design changes to adapt to detector-module integration  Electrical system tests  Development of an automatic test-station (FHIT) for industrial production  Identification of industrial partners  2002  Revision of initial technology choice  Start of industrial production planned Design Considerations and some History N.Marinelli, Tuesday: Hybrids need some additional work

3 U. Goerlach, LECC Colmar Sept 2002  Electrical functionality (2002):  Analogue read-out chips 4 or 6 APV25  Power lines, grounding, decoupling  Auxiliary chips: MUX, PLL and DCU  Measurements (with DCU-chip) of :  Supply voltages,  Temperatures on hybrid and detector (with internal and external thermistors)  Detector bias return current  No HV on hybrid  Connector(s) to interconnect-cards and opto-hybrid for analogue read- out Definition of FE Hybrid (I) Detector bias return NAIS 40 pin NAIS 30 pin SAMTEC 20 pin 47 mm 60 mm 25+3 mm APVAPV MUXMUX PLLPLL DCUDCU

4 U. Goerlach, LECC Colmar Sept 2002  Kapton cable  1 or 2 connectors (NAIS and SAMTEC)  Bending radius of mm (180° turn)  SMD components  Minimal height  R and C of type 0402 and 0603  LPCC (since 2002): MUX, PLL, DCU  Naked die ASICs to bond  4 or 6 APVs, alignment  30  m  (MUX-PLL)  (DCU)  Glob-top cover for bonds? (Radiation hardness ?)  Multi-layer board  Mechanical parameters  Two geometries  Heat transport to frame (  3 Watt)  Support of pitch-adapter  Thickness limitations, less than one mm without components  No connector on the hybrid  Rigid and flat within 100  m  Operation at -10° to -20 °C  Radiation hardness  Electrical parameters (2002)  4 metal layers  Via: Ø 100/300  m  Line width: 120  m  Separations (line/via): 180/90  m  Bias line resistance: m  Definition of FE Hybrid

5 U. Goerlach, LECC Colmar Sept 2002 Modularity and Geometries TIB TID TOB TEC TIB TID TECTOB  Need industrial production! (Version 2002)

6 U. Goerlach, LECC Colmar Sept 2002

7 InterConnect Bus InterConnect Cards Module frame Cooling pipe Patch panel 15 cm 110 cm TOB-rod Opto- hybrids

8 U. Goerlach, LECC Colmar Sept 2002 Loaded TOB Rod with Si-Detector Modules Used for double sided modules

9 U. Goerlach, LECC Colmar Sept 2002 TIB Shell loaded with Si-Detector Modules

10 U. Goerlach, LECC Colmar Sept 2002 Technology choices (I)  Industrial availability and price  Xo budget of tracker  Radiation safety (no Ag) Technology Candidates (Very approximate figures!)

11 U. Goerlach, LECC Colmar Sept 2002  Thermo-mechanical properties  Heat (max. 3 Watt) has to be transported to detector frame  CTE compatibility with module frame material:  Hybrid will be glued on frame (carbon fibre or graphite)  Deformation  Lift-off  Many simulations and tests to validate concept and substrate-material  Suitable for automatic mounting on Gantry  Flatness  Rigidity  Integration of cable and connector(s) ? Technology choices (II) Material CTE ppm/ o C Thermal Conductivity (W/mK) Xo (mm) Al2O FR4/G Carbon Fibre < || 1  Graphite E Polyimide Cu Au

12 U. Goerlach, LECC Colmar Sept 2002  First Circuits produced at CERN Workshop then  Populated with SMD and ASICs and then  Tested in Strasbourg    APVs need careful bias decoupling on V125  Market survey MS2991 (Spring 2000)  Small via diameters and spacing at industrial technical limit (120  m)  Very few candidates Prototyping in Thick-Film Technology on Ceramic Substrates ( ) MUX_PLL 47 mm 28 mm OptohybridInterconnect card Kapton cable DCU Combined MUX-PLL chip (naked die) Small pitch: Min.: 115  m

13 U. Goerlach, LECC Colmar Sept 2002 Read-Out Chip (APV) Stability on Hybrid Oscillation on V125 power line (across 4.7  F) ca. 80 kHz,  200 mV VSS V125 V nF VSS V125 V  F Common bias lines VSS V125 V nF VSS V125 V nF VSS V125 V nF VSS V125 V nF VSS V125 V nF Decoupling of APV-power rails: Power line resistances on hybrid from connector to APV: m , including 15 m  in cable M.Raymond, IC London

14 U. Goerlach, LECC Colmar Sept 2002  Split V125 line for preamplifier and inverter  Re-generate V125 from V250 by individual 100  resistor  Solution has been tested up to common resistances of up to 5  on the V125 line  Robust solution  New split power pads (bonding!): Solution to APV (In-)Stability M.Raymond, IC London

15 U. Goerlach, LECC Colmar Sept 2002 Dorazil and MIPOT Ceramic Hybrids 150 hybrids 5 hybrids Main Difficulties: Small feature size not suitable for mass production Soldering of kapton cable Main Difficulty: At technical limit of company After a market survey (MS2991) only two companies agreed to produce hybrids for CMS Tracker M200 Milestone at reasonable price

16 U. Goerlach, LECC Colmar Sept 2002  Good APV performance preserved on FE-hybrid!  300 e - Merging all APVs pedestals calibrations Uniformity: Noise: APV 1+2 APV 3+4 APV 5+6 calibration APV Read-Out on Hybrid

17 U. Goerlach, LECC Colmar Sept 2002 Frank Hartmann IEKP - Universität Karlsruhe (TH) Irradiation Test of Ceramic FE-Hybrid Proton current: 2 µA " 26 MeV protons " Irradiation of 120x120mm 2 up to p/ cm 2 takes 20 min Irradiation of Hybrid During irradiation: Clock, Trigger (10Hz), Error Buffer Readout (1Hz), Reset Irradiation with 2 µA protons up to p/ cm² (~ 30years LHC) First verification at cyclotron with over 5m cables and provisional readout ( Hybrid is still activated (2µSv) ) Hybrid still alive! Irradiation of some SMD components and glue has been performed by the Vienna group All final components have to be qualified with irradiation !

18 U. Goerlach, LECC Colmar Sept 2002 Summary on Ceramic Hybrids  In total about 180 ceramic hybrids were produced  Yield about 80% (we did not repair everything)  About half will be used for prototype Si-detector modules until December  Assembly procedure  Performance in test beam  Different electronic and electrical and mechanical system tests for the configurations of TIB TOB and TEC.  Temperature cycles  Irradiation tests  General concept of FE-hybrid validated  Several changes requested (  re-design of layout)  Re-design with larger feature size necessary  Possible with new encapsulated control chips in 0.5mm pitch housings  Now other potentially significant cheaper technologies available  New R&D and industry survey necessary at very late stage of project

19 U. Goerlach, LECC Colmar Sept 2002 Temperature Cycling of FE-Hybrids

20 U. Goerlach, LECC Colmar Sept 2002  With new LPCC Control and Service ASICS  MUX, PLL, DCU  Multi-layer board in “advanced” FR4 printed circuit board technology  Could be very cheap in large quantities  First circuits in January 2002  Boards are correct  Great difficulties to solder cable  Only a few working proto-types  Next step was cable integration:  Rigid-Flex hybrid New Technological Choices Prototyping I FR4 board with connector

21 U. Goerlach, LECC Colmar Sept 2002  Flex-Rigid(FR4) Hybrid:  Different companies with slightly different technologies and quality  2 bottom layers on rigid FR4  2 upper layers on polyimide  Tolerances in thickness up to 100 micron  Non-Flatness in the order of 100 micron before SMD montage, and we have seen more  Extend FR4 part under PA  More prototype boards available soon Promising path, but quite a bit more expensive than a simple FR4 board Polyimide copper Coverlay FR4 FR4- Noflow New Technological Choices Prototyping II Thickness

22 U. Goerlach, LECC Colmar Sept 2002 Coverlay 25 Pi + 25 glue  Flex-Flex (all Kapton) laminated on  Carbon-fibre substrate  FR4-substrate with thermal heat conducts  Mechanical properties  Final rigidity?  Final flatness < 100  m?  Proto-types available soon Polyimide 25 micron Copper 20 micron Lamination 25 micron CICOREL New Technological Choices Prototyping III Carbon fibre or FR4

23 U. Goerlach, LECC Colmar Sept 2002  Large quantities (more than 15000) can only be produced reliably in industry  Numbers will help to achieve uniformity throughout production  Industry will also be charged with the final acceptance test before delivery  Preferably only one manufacturer or consortium, delivering final product  Technical specifications have to be well defined before tendering  Careful evaluation and system tests mandatory!  Qualification of manufacturer by proto-type runs  Quality assurance during production:  In depth test/characterisation of random samples  Some temperature or other cycles in industry before final acceptance test  Relay on industrial standard during mass production  Duration of production will be about one year N.M.: Final results of system test expected in spring 2003 Industrial Production of FE-Hybrids

24 U. Goerlach, LECC Colmar Sept 2002 Front-End Hybrid Industrial Tester (I) Task: Simple acceptance test of hybrid in factory Components: Mechanical structure Transition board (FEHC) FHIT: electronic circuit including switching matrices Active component, a connection to ARC and fast Controllers ARC Read-out system Power supplies PC Barcode reader Software ARC board

25 U. Goerlach, LECC Colmar Sept 2002 Front-End Hybrid Industrial Tester (II) Test sequence:  Power supply control  Barcode scanning, recognition of hybrid type  Continuity test  Electrical test, including I2C scan  Functionality test (read-out of APVs)  Log file creation + error file + hybrid identification file  XML (CMS database) Response (simplified for operator!): green or red light Block diagram

26 U. Goerlach, LECC Colmar Sept 2002 APV current consumption distribution I_250 I_125

27 U. Goerlach, LECC Colmar Sept 2002 DCU ADC calibration Signal amplitude as a function of MUX resistors being switched on

28 U. Goerlach, LECC Colmar Sept 2002  Successful development of FE-hybrids for the CMS-tracker  In total we have produced over 200 hybrids in different technologies  Proto-typing of FE-hybrids in thick film on ceramic  Required performance achieved!  Many modifications implemented to help system integration!  Need for revised layout using ASICs with larger footprint  Now open to new (cheaper) technologies  New technologies (FR4, flex-rigid, full-flex) are being explored  Proto-types in industry in progress  Will determine final technical specification and the choice of substrate  Full industrial production foreseen (duration is about one year)  Industrial tester has been developed for acceptance test  Quality assurance:  Relies on large scale industrial production standards  Extensive characterisation of samples during production Summary and Conclusions

29 U. Goerlach, LECC Colmar Sept 2002 DCU  Digital Test: OK  -1 LSB < DNL < 1 LSB  Transient noise RMS ~ 1/4 LSB  Power dissipation < 40mW  ADC Gain vs. X-ray dose: -0.4 %/Mrad  No evident changes in INL and transient noise RMS during and after X-ray irradiation Gain ~ 2.2 LSB/mV INL < 1LSB

30 U. Goerlach, LECC Colmar Sept 2002 Study of frames deformations and cooling efficiency RWTH Aachen I reflecting surface grid CCD >100  m dummy hybrid at correct temp.