Design Win Replication: FX3 Solution for 3-D Imaging Simplify Your 3-D Imaging Design With a Flexible, One-Chip, USB 3.0 Solution Presentation: To provide an engineering overview to customers for a Cypress solution. Title slide: To define what the presentation will cover. The subtitle is a short sentence stating the key opportunity. 001-88003 Rev. *B

3-D Imaging: Next Killer App for USB 3.0 3-D Imaging is changing the way consumers interact with content 3-D video cameras create the perception of depth, offering a more immersive viewing experience 3-D game consoles track body movements, eliminating the need for game controllers 3-D motion sensors track finger gestures, eliminating the need for keyboards and mice 3-D Imaging requires high data bandwidth Uses two image sensors instead of one, doubling the image data Requires higher frame rates to enable precise motion sensing and fast-action games 3-D Imaging is the trend in video, gaming and motion-sensing products 3-D Video Camera by Panasonic XBOX 360 Game Console by Microsoft 3-D Motion Sensor by Leap Motion Market Vision: To define the market opportunity. Presents compelling data and end product photos relevant to the local market.

Terms You Will Hear Today 3-D Imaging Uses two image sensors to capture three-dimensional images or to track movements Requires more bandwidth – up to 3.0 Gbps Bandwidth Bandwidth = # pixels per frame (resolution) x frames per second (frame rate) x # color bits per pixel (color depth) For example, Bandwidth required by 3-D video = Two image sensors x 2.07 megapixels per frame x 30 fps x 24-bit color = 3.0 Gbps USB 3.0 (SuperSpeed USB) Operates at 5 Gbps—10x faster than USB 2.0 (Hi-Speed USB) Distributes 1.8x more power to bus-powered devices than USB 2.0 Provides backward compatibility with USB 2.0 USB 3.0 Host, USB 3.0 Device, USB 3.0 Hub The USB 3.0 Host (e.g., a PC) directs traffic flow and distributes power over the bus The USB 3.0 Device (e.g., a hard disk drive) is a peripheral on the bus The USB 3.0 Hub directs data traffic between a USB 3.0 Host and multiple USB Devices Common Image Sensor Configurations for 3-D Imaging (Two Sensors) Application Column Pixels Row Pixels Resolution Frame Rate Color Depth Bandwidth Video 1,920 1,080 2.07 megapixels 30 fps 24 bits (RGB) 3.0 Gbps Gaming 1,280 720 0.92 megapixels 120 fps 8 bits (B&W) 1.8 Gbps Motion Sensing 640 480 0.31 megapixels 60 fps 0.3 Gbps Terms of Art (ToA): To clearly define for engineers all ToAs used in the presentation. To carefully and fully define Cypress-proprietary ToAs needed to explain our system solution.

Additional Terms USB Camera Controller USB 3.0 Peripheral Controller A microcontroller that converts an image sensor data stream into USB traffic USB 3.0 Peripheral Controller A microcontroller in a USB 3.0 Device that handles USB 3.0 protocol and communicates with the USB Host USB 3.0 Driver A software program in the host system that operates or controls the USB 3.0 Device attached to it Firmware A set of instructions programmed on a USB 3.0 Peripheral Controller USB Video Class (UVC) A specification that defines the standard behavior of a USB video camera, known as a “UVC camera” Widely adopted in consumer cameras supported by major PC operating systems Terms of Art (ToA): To clearly define for engineers all ToAs used in the presentation. To carefully and fully define Cypress-proprietary ToAs needed to explain our system solution.

FX3 Terms EZ-USB® FX3™ Controller Cypress’s programmable USB 3.0 Peripheral Controller with integrated USB 3.0 transceiver Includes a powerful on-chip ARM9 processor and 512KB RAM for firmware storage and data buffering Supports additional peripheral connectivity via I2C, I2S, SPI and UART Includes a Software Development Kit (SDK) with example code to reduce your design effort GPIF™ II: Second-Generation General Programmable Interface Programmable 100-MHz, 32-bit interface that allows FX3 to communicate with systems that have a parallel interface GPIF II Designer Design software that installs on your PC Contains simple graphical user interface (GUI) to configure the GPIF II GPIF II Descriptor A set of commonly predefined GPIF II configurations used to program FX3 more quickly FX3 Application Programming Interface (API) A software interface in the SDK library that enables firmware programs to interact with each other to create specialized USB functions Cypress Control Center A part of the FX3 SDK that installs on your PC A simple GUI used to configure the FX3 Development Kit (DVK) Terms of Art (ToA): To clearly define for engineers all ToAs used in the presentation. To carefully and fully define Cypress-proprietary ToAs needed to explain our system solution.

Design Problems Engineers Face 1. 3-D Imaging requires up to 3-Gbps bandwidth USB 2.0 provides only 480-Mbps bandwidth 2. 3-D Imaging requires multiple ICs Two image sensors to capture a 3-D image Two camera controllers and a hub to send image data to a PC Multiple ICs cost more and need more PCB area 3. 3-D Imaging designs must be flexible, to support Different image sensors with various resolutions, frame rates and bus widths Different USB data types to transfer captured images Standard UVC or custom USB cameras FX3 solves these problems FX3 provides 5-Gbps bandwidth – 10x the bandwidth of USB 2.0 FX3 is a one-chip solution that reduces cost and PCB area FX3 has programmable GPIF II and on-chip ARM9 for design flexibility Cypress’s ultra-compact, one-chip FX3 solution provides high bandwidth and design flexibility for 3-D Imaging USB 2.0 Multichip Solution for 3-D Imaging 8 USB 2.0 USB 2.0 PC 8 USB 2.0 hub Image sensors Camera controllers FX3 One-Chip Solution for 3-D Imaging 8-16 16-32 USB 3.0 PC 8-16 FX3 Image sensors Traditional Approach and Challenges: To present the traditional approach and the challenges engineers will face when using it to realize the Market Vision. Ends with a one-sentence segue clearly stating the benefit of the Cypress solution.

FX3 Solution: 3-D Imaging Made Easy GPIF II connector The GPIF II is programmed to match the interface A USB 2.0 multi-chip solution costs more and requires more PCB area The state diagram of an image sensor interface USB 3.0 connector Upgrading a complex USB 2.0 3-D Imaging design to use USB 3.0… Is simplified by FX3 with programmable GPIF II… Prototyped quickly using the FX3 Development Kit… To get started, you should: Buy the FX3 DVK online (CYUSB3KIT-001) Choose your image sensors Download and install the FX3 SDK on your PC Read App Note: How to Implement an Image Sensor Interface with FX3 in a UVC Framework Configure the GPIF II interface for two sensors with the GPIF II Designer software Write FX3 3-D Imaging firmware using the FX3 SDK Prototype your firmware design quickly with the FX3 DVK And miniaturized into a small 3-D motion sensor by Leap Motion. 1 inch 0.5 inch 3 inches Cypress Solution: To introduce CY products and show compellingly how they solve the challenges highlighted on the previous slide. To provide a short, clear list of what to do to get started.

Configuring GPIF II for Two Sensors FX3 Example Project Demonstrating GPIF II Interface Customization for Two Image Sensors Initiate a new project using Cypress-supplied interfaces, or start from scratch Select the type, bus width, and I/Os of the desired interface Create a state machine that matches interface timing by adding state blocks and transitional conditions Visualize state transitions and associated output signals Generate GPIF II descriptor to be used in the next step: Design FX3 firmware 1 2 4 3 5 Cypress Solution: To introduce CY products and show compellingly how they solve the challenges highlighted on the previous slide. To provide a short, clear list of what to do to get started.

Write Firmware Quickly Using FX3 SDK FX3 Example Project Demonstrating 3-D Imaging Firmware Design in FX3 SDK Use the UVC example code as a reference to write your FX3 3-D Imaging firmware in C code. Insert the GPIF II descriptor into the project directory. Compile the firmware by clicking the “Build All” button under the “Project” tab Use the App Note “How to Implement an Image Sensor Interface with FX3 in a UVC Framework” for complete design guidelines Learn about FX3 functionality by reading the “FX3 Programmers Manual” and the “Firmware API Guide” included in the SDK 1 2 3 4 Cypress Solution: To introduce CY products and show compellingly how they solve the challenges highlighted on the previous slide. To provide a short, clear list of what to do to get started.

Prototype Quickly with FX3 DVK Prototype 3-D Imaging designs quickly with FX3 DVK Build a custom dual-image-sensor daughter board based on your image sensor of choice Connect the daughter board to the FX3 DVK using the GPIF II connector Connect your DVK to the PC using a USB 3.0 cable and install the Cypress USB 3.0 driver Program the FX3 DVK with 3-D Imaging firmware using the Cypress Control Center The FX3 DVK will reconnect to the PC as a UVC camera Run video-capture software (e.g., AMCap or equivalent) to watch the live video from two image sensor sources Example: 3-D Motion Sensor Prototype by Leap Motion FX3 DVK + Dual-Image-Sensor Daughter Board FX3 DVK (CYUSB3KIT-001) 5-V Power Jack Two Aptina Image Sensors (MT9V024) JTAG Headers USB 3.0 Connector FX3 GPIF II Connector RS232 Connector I2S Headers SPI Headers Cypress Solution: To introduce CY products and show compellingly how they solve the challenges highlighted on the previous slide. To provide a short, clear list of what to do to get started.

Example End-Product Design 3-D Motion Sensor by Leap Motion Factory Debug Connector USB Connector Image Sensor #1 19.2-MHz Crystal FX3 SPI Flash Image Sensor #2 For a quick 3-D Imaging demonstration, buy a Leap Motion 3-D Motion Sensor Cypress Solution: To introduce CY products and show compellingly how they solve the challenges highlighted on the previous slide. To provide a short, clear list of what to do to get started.

EZ-USB® FX3™ Solution Example: 3-D Motion Sensor EZ-USB FX3 Value Block Diagram Design Challenges Deliver 3-D Imaging without bandwidth limitations Eliminate need for multiple ICs to reduce BOM Provide flexibility to meet customer design requirements Shrink PCB to achieve smaller form factor EZ-USB FX3 Solution 5-Gbps bandwidth enables high-bandwidth 3-D Imaging GPIF II connects FX3 directly to two image sensors Powerful on-chip ARM9 CPU and 512KB RAM provided 4.7-mm x 5.1-mm, 131-ball wafer-level chip-scale package EZ-USB® FX3™ One-Chip Solution JTAG 512KB RAM (32 End Points) Image Sensor #1 ARM 9 8-16 32 32 GPIF II 32 USB 3.0 Image Sensor #2 8-16 32 USB 3.0 Enabled Host UART SPI I2C I2S Suggested Collateral App Notes: Getting Started with FX3 FX3 Hardware Design Guidelines How to Implement an Image Sensor Interface with FX3 in a UVC Framework Videos: FX3 3-D Imaging Demo Documents: FX3 Programmers Manual (included in SDK) FX3 Firmware API Guide (included in SDK) Control 3-D Motion Sensor by Leap Motion Boards and Software Kit: EZ-USB FX3 DVK (CYUSB3KIT-001) Software: EZ-USB FX3 Software Development Kit GPIF II Designer Solution Examples: To give detailed one-page Solution Examples from the field in the specified format.

FX3 Solution vs. Competition’s 8 mm 6 mm 5.1 mm 6 mm 6 mm 4.7 mm Feature FX3 Two USB Camera Controllers + USB 2.0 Hub One-Chip Solution Yes No Design Miniaturization 24 mm2 150 mm2, including layout space USB 3.0 Data Rate (5 Gbps) Yes, 10x USB 2.0 No, USB 2.0 only (480 Mbps) Programmability 32-bit ARM9 8-bit MCU (8051 or home brew) Software Development Kit On-Chip Memory 512KB SRAM 1KB SRAM Competitive Comparison: To define key features of the Cypress solution and demonstrate its superiority over the Next Best Alternatives (NBA’s). Must be credible and objective to the salesperson and customer.

FX3 3-D Imaging Solution Value Competitor Two USB 2.0 Camera Controllers: OmniVision OV538 Price: $1.75 x 2 = $3.501 BOM Integration USB 2.0 Hub: Microchip USB2512B Price: $1.332 Additional Value Design Miniaturization: FX3 = 24 mm2 CSP enables smaller enclosure size vs. competition = 150 mm2 (Savings = $0.02 per mm2) Value added: $2.52 USB 3.0 Data Rate: FX3 5-Gbps bandwidth supports higher resolution and higher frame rate vs. USB 2.0 480-Mbps competition Value added: $2.253 Programmability: 32-bit ARM9 CPU enables encryption, vendor-specific device class, and other customization vs. 8-bit 8051 competition Value added: $3.114 SDK: FX3 provides industry standard tools, saving up to 30 man-weeks of engineering effort at $5k per man-week; amortized over 100ku Value added: $1.50 On-Chip Memory: FX3 512KB SRAM allows large buffers (8 x 16KB) for higher data throughput vs. 1KB competition (Savings = $0.01 per KB) Value added: $5.11 Competitor $3.50 USB 2.0 Hub $1.33 BOM Integration Value $1.33 Design Miniaturization $2.52 USB 3.0 Data Rate $2.25 Programmability $3.11 SDK $1.50 On-Chip Memory $5.11 Justification: OmniVision OV538, $2.25*2=$5.00 datasheet, http://www.yuanxinfeng.com/upload/OV538-B88.pdf C-temp (0 – 70C) 8 x 6 mm = 48mm2 Microchip USB2512B, $1.62 datasheet, http://media.digikey.com/pdf/Data%20Sheets/SMSC/USB2512,13,14,17(A,B).pdf Extended C-temp (0 – 85C) 6 x 6 mm = 36mm2 Design Miniaturization, $2.52 Total PCB saving times $0.20 per mm2, (150-24)*0.20 = $2.52 USB 3.0 Data Rate, $2.92 We find the price difference in ASP between equivalent USB 2.0 vs. USB 3.0 hubs from TI and Microchip TI USB 3.0 hub (TUSB8040, $4.56), TI USB 2.0 hub (TUSB2036, $1.61), delta = $2.95 Microchip USB 3.0 hub (USB5534, $4.36), Microchip USB 2.0 hub (USB2512B, $1.47), delta = $2.89 Assumption: The delta in USB 3.0 vs. USB 2.0 hubs is how much a customer is willing to pay for USB 3.0 bandwidth. Programmability, $2.51 FX3 has a on-chip 32-bit ARM9 processor, whereas competition solution has 8-bit processor (either 8051 or homebrew). The value added is calculated by comparing price difference between 8-bit and 32-bit microcontrollers ARM: LPC3130FET180,551, $3.78 @ 1ku, http://www.digikey.com/product-search/en?WT.z_header=search_go&lang=en&site=us&keywords=LPC3130&x=0&y=0 8051: P89LPC916FDH,118, $1.27 @ 1ku, http://www.digikey.com/product-detail/en/P89LPC916FDH,118/568-4337-1-ND/1833612 Delta: $2.51 SDK, $1.50 FX3 comes a number of open source tool to reduce customer engineering effort GPIF II Designer – simplify the configuration of GPIF II interface to connect to any image sensors Industry standard tools like Eclipse IDE and GNU compiler/debugger to empower customers to write their own FW This saves a total of 30 man-weeks. Considering typical NRE is $5k per man-week, customers save $150k by choosing FX3. If amortized over 100ku, it adds a value of $1.50 On-chip Memory, $5.33 - Cost of 512KB SRAM is $5.33 ==== FX3 SKU, DBC, 1ku Web Price - CYUSB3011-BZXC (16-bit, 256kB, C-temp), $16.00, $16.80 CYUSB3012-BZXC (32-bit, 256kB, C-temp), $17.75, $18.64 CYUSB3013-BZXC (16-bit, 512kB, C-temp), $18.50, $19.43 CYUSB3014-BZXC (32-bit, 512kB, C-temp), $20.00, $21.00 CYUSB3014-BZXI (32-bit, 512kB, I-temp), $26.00, $27.30 Total Additional Value $14.49 Total Value Delivered $19.32 Target Cypress Solution: CYUSB3014-FBXCT Total Cost: $13.94 28% Total Savings: $5.38 1 Estimated1ku pricing per customer input on 2/25/2015 3 1ku pricing from Microchip Direct: price delta between USB 3.0 Hub (USB5532B) and USB 2.0 Hub (USB2512B) on 2/25/2015 2 1ku pricing from Microchip Direct (USB2512B) on 2/25/2015 4 1ku pricing from TI: price delta between ARM9-based MCU (AM1802) and 8051-based MCU (TUSB3210) on 2/25/2015 EVC Slide: To clearly define the value of the Cypress solution, including BOM integration and unique functionality.

Here’s How to Get Started 1. Watch our demo video: FX3 3-D Imaging Demo 2. Read the Getting Started with EZ-USB FX3 App Note: AN75705 3. Buy the $397 EZ-USB FX3 Development Kit: CYUSB3KIT-001 3-D Motion Sensor by Leap Motion Call to Action: To tell customers how to start their design process.

References and Links FX3 3-D Imaging Demo Video: FX3 3-D Imaging Demo Machine Vision Camera Demo Video: FX3 MV Camera Demo FX3 HD 720p Camera Kit Demo Video: FX3 Camera Kit Demo EZ-USB FX3 App Note: Getting Started with EZ-USB FX3: AN75705 Gives highlights of USB 3.0 technology and an overview of the FX3 architecture, software, and collateral Shows FX3 SDK setup, Cypress USB driver installation, firmware download, and USB 3.0 traffic verification EZ-USB FX3 Hardware Design Guidelines and Schematic Checklist: AN70707 Shows how to design a board with 5-Gbps USB 3.0 traces How to Implement an Image Sensor Interface with FX3 in a UVC Framework: AN75779 Describes a UVC video streaming application in which FX3 streams images from an image sensor to a USB Host EZ-USB FX3 Development Kit: CYUSB3KIT-001 EZ-USB FX3 HD 720p Camera Kit: FX3 Camera Kit Software Development Kit: EZ-USB FX3 Software Development Kit Provides Eclipse IDE, ARM GCC, Cypress USB 3.0 driver, example code, FX3 Programmers Manual, and API Guide GPIF II Designer: GPIF II Designer References and Links: Provide comprehensive view of resources to assist in learning about and adapting the solution.