Development of a DHCAL with Resistive Plate Chambers ECFA/DESY Workshop at NIKHEF, Amsterdam, Netherlands April 1 - 4, 2003 José Repond Argonne National.

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Presentation transcript:

Development of a DHCAL with Resistive Plate Chambers ECFA/DESY Workshop at NIKHEF, Amsterdam, Netherlands April 1 - 4, 2003 José Repond Argonne National Laboratory

Collaboration Argonne National Laboratory I Ambats, G Drake, V Guarino, J Repond, D Underwood, B Wicklund, L Xia Boston University J Butler, M Narain University of Chicago K Anderson, E Blucher, J Pilcher, M Oreglia, H Sanders, F Tang Fermilab (M Albrow), C Nelson, R Yarema, (A Para, V Makeeva) I. Introduction

Design considerations Multi-gap smaller signals less streamers improved longevity reduced cross-talk better rate capability Avalanche mode smaller signals improved longevity reduced cross-talk no multiple-streamers better rate capability High-resistive graphite layer reduced cross-talk

Test chamber design and construction Name of chamberAIR0AIR1AIR2 Date of construction 11/20021/2003 Active area 20x20 cm 2 Number of gas gaps 222 Glass thickness 0.85 mm1.1 mm Thickness of gas gap 0.64 mm Resistive layer GraphiteInk Surface resistivity ~300 kΩ/□~200 kΩ/□~1200 kΩ/□ Streamer signal starting point 7.5 kV6.7 kV6.6 kV Pedestal width ~15 fC~8 fC Gas mixture Freon/Argon/IsoButane = 62:30:8

Cosmic Ray test set-up Trigger Cosmic ray telescope with 4 layers of scintillator Rate ~1Hz Data acquisition Charge integration Gate between 700 ns and 20 μs Readout up to ~40 channels Alternative tests Amplifier, shaper, discriminator

II. Tests with single pads Total charge of signal increases with HV At 7.4 kV Signal ~ 0.2 pC Avalanche mode

…and streamer mode Total charge of signal increases with HV At 8.0 kV Signal ~ 10 pC Significant amount of multi-streamers and of avalanches

Measurements of efficiencies Counting charges above Q 0 Counting events above V 0 Efficiency greater than 90% in avalanche mode (plateau ~200V) Small fraction of streamers Efficiency greater than 90% in avalanche mode (plateau ~300V) Small fraction of streamers Noise rate ~50Hz for avalanche mode

III. Analysis of Multi-pad Data Pad structure Data sets AIR2 38 kEvents 2 gaps of 0.64 mm glass of 1.1 mm R □ ~ 1.2 MΩ AIR1 24 kEvents same as above R □ ~ 200kΩ Readout system and analysis RABBIT system Records charges Calibration: 1.1fC/ADC count Pedestal subtracted Negative values set to zero Big pad 19 x 19 cm 2 All 1 x 5 cm2 Pads added together Central pad 1 x 1 cm 2 Default

Summing up all charges Clear avalanches and streamers Significant charge outside pad with highest charge

Neighbors… Pad hit sees more charge than any neighbor Charge in neighbor correlated with charge of pad hit Only central 9 pads Much worse for AIR1 with low R □

Central pad with maximum charge Avalanches Streamers Zeros: cut out

Central pad with maximum charge: select avalanches All pads at a given distance added up Suppression of negative charges disabled Similar results for streamers Charges go negative Error bars are RMS of distributions

Central pad with maximum charge: select avalanches Looking at individual pads Suppression of negative charges disabled Charge on neighboring pads small!

Central pad with maximum charge: select avalanches Mostly direct neighbors No counts in second ring Probably ok for 2x2 cm 2 pads Will look better with discriminators Important to suppress streamers

IV. Design work on the electronic readout System overview I RPC ASIC located on the chambers II Data concentrators funnels data from several FE chips III VME data collector funnels data from several data concentrators IV External timing and trigger system

Conceptual design of readout pad Minimize cross-talk Overall thickness mm One ASIC for 64 or 128 channels Will need 3125 – 6250 ASICs for 1 m 3 prototype First version of boards being laid out

Design of ASIC: Front End Amplifier Each ASIC serves 64 or 128 detector channels Each channel has a preamplifier Needed for avalanche mode Can be bypassed (if operating in streamer mode) Provides pulse shaping Provides polarity inversion

Considering 3 options I Trigger-less operation Timestamp counter running inside chip Store timestamp and channel number when hit II Triggered operation Provide pipeline for temporary data storage Provide trigger input to capture data of interest Provide trigger output Timestamp to identify event III Self-triggered operation Like triggered operation, but allow internal hits to capture data Like trigger-less operation, but only one timestamp per event Design of ASIC: Digital Processing Functions

Data concentrator Receive serial data streams and provide buffering Send single data stream to back ends Can be realized in an FPGA

Data collection Essential functions Receive serial data streams from Front Ends Form ‘Time Frames’ blocks of data corresponding to ~1 sec Send data to storage Provide clock and controls Realization Use VME crates for infrastructure need 2 crates to house 35 cards

I. Resistive paint Investigated over 50 paints and mixtures many mixtures not stable over time Found 2-3 (acrylic) with over 1 MΩ/□ Developing methods to control thickness V. Plans for the next few months II. Effect of distance to ground plane and capacitance Multipad boards with two different thicknesses on hand III. Reading off on ground versus HV side So far reading off HV side (risk of breakdown) Signals reading off ground side inverted in charge Study effect on cross-talk

IV. Single gap versus multigap V. Discriminators versus charge integration Will build chamber with single gap with same gas volume study effect on cross-talk Readout of multi-channel with discriminators in preparation Digital readout VI. Geometrical acceptance Construction of scintillator hodoscope at ANL Re-commissioning of Cosmic ray test stand with tracking at Chicago

VI. Plans for the next 15 months Finalize chamber design by 6/03 Develop application procedure for paint by 6/03 Complete tests with prototype readout systems by 6/03 Specify characteristics of FE ASIC by 7/03 Initiate production of chambers by 10/03 Evaluate pre-production of readout boards and ASIC by 3/04 Initiate production of readout boards by 4/04 Initiate production of data collections systems by 4/04 Ready for test beams in Summer 2004?