L. Greiner 1IPHC meeting – May 7, 2012 STAR HFT Plans for the next year A short report on HFT/PXL plans for post May 2012 TPC – Time Projection Chamber (main tracking detector in STAR) HFT – Heavy Flavor Tracker SSD – Silicon Strip Detector r = 22 cm LBNL – Jim Thomas IST – Inner Silicon Tracker r = 14 cm MIT – Bernd Surrow PXL – Pixel Detector r = 2.5, 8 cm LBNL – Leo Greiner

2IPHC meeting – May 7, 2012 L. Greiner STAR HFT Outline Existing HFT/PXL status and schedule Testing Goals at IPHC Immediate plans / discussion Possible scenarios for the near term

3IPHC meeting – May 7, 2012 L. Greiner STAR HFT Existing PXL status and schedule CD-2/3 passed September 2011 – we are a fully funded DOE construction project. Many thanks to IPHC group for years of collaboration, support and help including during reviews. Significant management overhead, reports, reviews, etc. The main task for 2012 is the construction and delivery of a three sector prototype detector by January of 2013.

4IPHC meeting – May 7, 2012 L. Greiner STAR HFT Selected HFT Tasks for the next year Installation of the new IDS pieces and new beam pipe in ~ July Production of a prototype PXL detector using complete mechanics, installation tooling, sensors, RDO system, interface to STAR. This will allow for both an in beam test of the PXL design and a measurement of the charged particle environment at low radius. The installation for the PXL prototype detector is scheduled for December The SSD and IST detectors are not scheduled to be installed until summer 2013.

5IPHC meeting – May 7, 2012 L. Greiner STAR HFT PXL tasks for 2012 We have a deliverable of a working prototype detector (3 sectors) to be installed at the end of Thus we need to produce first articles of all of the production stages for the final detector. Tasks for 2012: Production probe testing working for Ultimate sensors Cable design complete with Cu conductors New pre-production RDO (all boards) system working Full firmware and software for data-taking All mechanical designs complete and tested. Mechanical structures fabricated. Ladders => sectors fabricated + full scripted testing. Metrology Slow control system Software for tracking using metrology data Software for cosmic ray / beam testing tracking. etc.

6IPHC meeting – May 7, 2012 L. Greiner STAR HFT Steps to Prototype Detector Fix cable design (width) Fabricate cablesFix mechanical design Fabricate mech pieces Probe test sensors Fabricate ladders Fabricate sectors Testing and metrology Test ladder cable design Deliver to STAR, test and install Sensor and mechanical only. RDO, slow control, etc. not shown. Prototype detector planned to be fabricated with Ultimate 1 sensors.

7IPHC meeting – May 7, 2012 L. Greiner STAR HFT Cable testing Cable design validation is very relevant to many parts of the project; –The hybrid cable design itself is needed to fabricate ladders from a working design. –Mechanical – if additional cable width is needed we will need to re-design the mechanical parts including assembly fixturing. –Ultimate 2 submission – We wish to fully check the functioning of sensors on a ladder before submitting the next version of the sensors. A working hybrid cable design is required for most of the next production steps.

8IPHC meeting – May 7, 2012 L. Greiner STAR HFT Next Steps A design for the final cable has already been prepared assuming successful testing of the existing (one-power) design. Perhaps this is an optimistic scenario PCB shop at CERN will quote cost for initial design and wait to produce final cable design. Produce PCBs Additional testing and design steps will be discussed in MS’s talk.

9IPHC meeting – May 7, 2012 L. Greiner STAR HFT Points to return to Ultimate 2 submission schedule Additional testing plans and schedule Cable submission schedule

10IPHC meeting – May 7, 2012 L. Greiner STAR HFT STAR PXL DETECTOR STRUCTURE STAR PXL Detector 10 sectors PXL Sector 3 outer ladders 1 inner ladder Aluminum conductor Ladder Flex Cable

11IPHC meeting – May 7, 2012 L. Greiner STAR HFT Cable Structure Preliminary Design: Hybrid Copper / Aluminum conductor flex cable There are two cable regions joined by wire bonds Outer ladders have a simple rectangular driver region PCB. Inner ladders have a complex driver region PCB that incorporates a kapton flex region to allow the ladder interface connector to be routed to the top of the sector.

12IPHC meeting – May 7, 2012 L. Greiner STAR HFT STAR PXL Ladder PCBs There are 3 PCBs to produce for the STAR PXL detector ladders. Low Mass Ladder PCB – common for all ladders Outer Ladder Driver PCB – joined to low mass PCB and used for outer ladders. Inner Ladder Driver PCB – joined to low mass PCB and used for inner ladders. There are 3 outer ladders for every 1 inner ladder.

13IPHC meeting – May 7, 2012 L. Greiner STAR HFT Low mass ladder PCB TOP STACKUP BOTTOM Kapton Board material:25 µm kapton Conductor:20 µm copper Solder mask:None Silk screen: None Final thickness:TBD – 150 µm? Finish:ENIG gold plate All low mass ladder PCBs are the same design Prototypes will be copper conductor Production will be Aluminum conductor

14IPHC meeting – May 7, 2012 L. Greiner STAR HFT Outer Ladder Driver PCB TOP STACKUP BOTTOM INNER 1 INNER 2 FR-4 PREPREG FR-4 Board material: FR-4 Conductor: 1 oz. copper Solder mask: both sides Silk screen: TOP only Final thickness: 0.5 mm Finish:ENIG gold plate

15IPHC meeting – May 7, 2012 L. Greiner STAR HFT Inner Ladder Driver PCB This is a composite PCB consisting of a kapton flex PCB with FR-4 PCB additions at each end. Connector End Driver End

16IPHC meeting – May 7, 2012 L. Greiner STAR HFT Inner Ladder Driver PCB Kapton TOP/BOTTOM TOP SECTION A-B STACKUP BOTTOM Kapton SECTION A-BA B Board material:TOP/Bottom – 25 µm kapton Conductor: 1 oz. copper Solder mask: both sides Silk screen: TOP only Final thickness:TBD – 150 um? Finish:ENIG gold plate

17IPHC meeting – May 7, 2012 L. Greiner STAR HFT Inner Ladder Driver PCB Connector End Board material:TOP/Bottom – kapton Inner1/Inner2 - FR-4 Conductor: 1 oz. copper Solder mask:both sides Silk screen: TOP only Final thickness:0.5 mm Finish:ENIG gold plate TOP STACKUP BOTTOM INNER 1 INNER 2 FR-4 PREPREG Kapton

18IPHC meeting – May 7, 2012 L. Greiner STAR HFT Inner Ladder Driver PCB Driver End TOP STACKUP BOTTOM INNER 1 INNER 2 FR-4 PREPREG Kapton Board material:TOP/Bottom – kapton Inner1/Inner2 - FR-4 Conductor: 1 oz. copper Solder mask:both sides Silk screen: TOP only Final thickness:0.5 mm Finish:ENIG gold plate

19IPHC meeting – May 7, 2012 L. Greiner STAR HFT Quantities: We would like to produce a prototype detector with ≥ 3 sectors. Yield arguments suggest that we will need: 40 Low Mass Ladder PCBs 35 Outer Ladder Driver PCBs 15 Inner Ladder Driver PCBs In addition, we would like to start the process of building ladders with Aluminum conductor PCBs so we would also like: 10 Low Mass Ladder PCBs with ~25 µm Aluminum conductor

20IPHC meeting – May 7, 2012 L. Greiner STAR HFT Projected completion dates Order Ultimate sensors: September 2011 First Ladder cable in FR-4: Oct/Nov 2011 First product probe testing: January 2012 Ultimate probe testing complete: February 2012 PXL RDO ready: April 2012 First prototype sectors: August 2012 Install Prototype detector: January 2013