TRAD, Tests & Radiations 13/09/2011 LHC POWER CONVERTER Radiation analysis.

Slides:



Advertisements
Similar presentations
Design and Testing of a Radiation Hardened 13-bit 80 MS/s Pipeline ADC Implemented in a 90nm Standard CMOS Process B. Vaz, N. Paulino *, J. Goes *, M.
Advertisements

SAAB SPACE 1 The M2 ASIC A mixed analogue/digital ASIC for acquisition and control in data handling systems Olle Martinsson AMICSA, October 2-3, 2006.
C3 / MAPLD2004Lake1 Radiation Effects on the Aeroflex RadHard Eclipse FPGA Ronald Lake Aeroflex Colorado Springs.
Analog-to-Digital Converter (ADC) And
Challenges of Single Event Upset and Transient Testing and Characterization of Mixed Signal Products Kirby Kruckmeyer.
Hardware Pace Using Slope Detection Tony Calabria 10/22/2012.
Future beyond CTF3: ESA/Electron testing January 27 th 2015 CLIC Workshop 2015: Future tests beyond CTF3 January 27 th 2015 Radiation Testing with CALIFES.
Analog to Digital Converters (ADC) 2 ©Paul Godin Created April 2008.
MDT-ASD PRR C. Posch30-Aug-01 1 Radiation Hardness Assurance   Total Ionizing Dose (TID) Change of device (transistor) properties, permanent   Single.
Radiation Effects in Microelectronics EE-698a Course Seminar by Aashish Agrawal.
CMOS VLSIAnalog DesignSlide 1 CMOS VLSI Analog Design.
CELeSTA CERN LATCHUP STUDENT SATELLITE TEST BOARD DEVELOPMENT AND CHARM PRELIMINARY RESULTS Raffaello Secondo ESA/ESTEC CERN Visit - DECEMBER 9 th 2014.
5 th LHC Radiation Day Radiation response of RADMON sensors T. Wijnands (TS/LEA), C. Pignard (TS/LEA) Acknowledgements : UCL Louvain-La-Neuve, PSI Villingen,
Mechanical and fluidic integration of scintillating microfluidic channels into detector system 1 Davy Brouzet 10 th September 2014.
LECC 2006 Ewald Effinger AB-BI-BL The LHC beam loss monitoring system’s data acquisition card Ewald Effinger AB-BI-BL.
COMPONENT TEST H4IRRAD 15 TH NOVEMBER 2011 G. Spiezia, P. Peronnard, G. Foucard, S. Danzeca, P. Gander, E. Fadakis (EN/STI/ECE)
A radiation-tolerant LDO voltage regulator for HEP applications F.Faccio, P.Moreira, A.Marchioro, S.Velitchko CERN.
2012 H4IRRAD test campaigns Summary of results S. Uznanski CERN, Geneva, Switzerland Radiation Working Group meeting Oct 16, 2012.
12004 MAPLD: 141Buchner Single Event Effects Testing of the Atmel IEEE1355 Protocol Chip Stephen Buchner 1, Mark Walter 2, Moses McCall 3 and Christian.
Oct, 2000CMS Tracker Electronics1 APV25s1 STATUS Testing started beginning September 1 wafer cut, others left for probing 10 chips mounted on test boards.
News from ESA-CNES Final Presentation Days 2013 A Masi, News from ESA-CNES Final Presentation Days 2013 News from ESA-CNES Final Presentation Days 2013.
4/27 Radiation Effects in Active Optical Components Robert A. Reed, Ken LaBel, Janet Barth, Henning Leidecker, Allan Johnston, Paul Marshall and Cheryl.
I n t e g r a t e d D e s i g n C e n t e r / M I s s I o n D e s I g n L a b o r a t o r y N A S A G O D D A R D S P A C E F L I G H T C E N T E R Do.
Total Dose Effects on Devices and Circuits - Principles and Limits of Ground Evaluation-
Pierpaolo Valerio.  CLICpix is a hybrid pixel detector to be used as the CLIC vertex detector  Main features: ◦ small pixel pitch (25 μm), ◦ Simultaneous.
Data Acquisition Systems
Total Ionizing Dose Effects in 130-nm Commercial CMOS Technologies for HEP experiments L. Gonella, M. Silvestri, S. Gerardin on behalf of the DACEL – CERN.
1 Passive components and circuits - CCP Lecture 4.
Presented by Anthony B. Sanders NASA/GSFC at 2005 MAPLD Conference, Washington, DC #196 1 ALTERA STRATIX TM EP1S25 FIELD-PROGRAMMABLE GATE ARRAY (FPGA)
Online Radiation Dose Measurement System for ATLAS experiment I. Mandić a, V. Cindro a, I. Dolenc a, A. Gorišek a, G. Kramberger a, M. Mikuž a,b, J. Hartert.
SEE effects in deep submicron technologies F.Faccio, S.Bonacini CERN-PH/ESE SEE TWEPP2010.
ATMEL ATF280E Rad Hard SRAM Based FPGA SEE test results Application oriented SEU Sensitiveness Bernard BANCELIN ATMEL Nantes SAS, Aerospace Business Unit.
Radiation Tolerant Electronics New Policy? Ph. Farthouat, CERN.
7/2/2003Ivan Hruska,Francisca Calheiros1 Radiation test of components for LV power supply design  Test done in PSI verification and selection.
On-Chip Reliability Monitor for Measuring Frequency Degradation of Digital Circuits Department of Electrical and Computer Engineering By Han Lin Jiun-Yi.
Radiation Damage in Bipolar Transistors Caused by Thermal Neutrons I. Mandić, V. Cindro, G. Kramberger, E. S. Krištof, M. Mikuž, D. Vrtačnik Jožef Stefan.
SLHC Proposal B Status Optical Readout System Irradiation Guidelines K.K. Gan, Karl Gill, Jan Troska, Francois Vasey, Todd Huffman, Cigdem Issever, Tony.
Apr, 2014 TE-EPC-CCE Radiation Tests
1 st AMICSA Workshop – 2 & 3 October Evaluation of a 12 bits Video Processor for Space Application J.-Y. Seyler, F. Malou, G. Villalon ( CNES, Toulouse.
Radiation Tolerant Electronics Expected changes Ph. Farthouat, CERN.
Valerio Re, Massimo Manghisoni Università di Bergamo and INFN, Pavia, Italy Jim Hoff, Abderrezak Mekkaoui, Raymond Yarema Fermi National Accelerator Laboratory.
65 nm CMOS analog front-end for pixel detectors at the HL-LHC
MPPC status M.Taguchi(kyoto) T2K ND /7/7.
Experiment Electronics UMC 0.18µm radiation hardness studies Progress since last Collaboration Meeting Sven Löchner GSI Darmstadt 15 th CBM Collaboration.
LHC Beam Loss Monitors, B.Dehning 1/15 LHC Beam loss Monitors Loss monitor specifications Radiation tolerant Electronics Ionisation chamber development.
RD53 Analog IP blocks WG : developments and plans at CPPM M. Barbero, L. Gallin Martel (LPSC), Dzahini (LPSC), D. Fougeron, R. Gaglione (LAPP), F. Gensolen,
Analog/Digital Conversion
DAQMB Status – Onward to Production! S. Durkin, J. Gu, B. Bylsma, J. Gilmore,T.Y. Ling DAQ Motherboard (DMB) Initiates FE digitization and readout Receives.
Numerical signal processing for LVDT reading based on rad tol components Salvatore Danzeca Ph.D. STUDENT (CERN EN/STI/ECE ) Students’ coffee meeting 1/3/2012.
1 Giuseppe G. Daquino 26 th January 2005 SoFTware Development for Experiments Group Physics Department, CERN Background radiation studies using Geant4.
1 Single event upset test of the voltage limiter for the ATLAS Semiconductor tracker TSL Experiment Number: F151 distance between power supplies and modules.
(1/16) 08/05/12 – RadWG meeting G. Spiezia, P. Peronnard, E. Lefteris, P. Oser, J. Mekki PSI tests - Comparator Results Devices under test and beam conditions.
Xilinx V4 Single Event Effects (SEE) High-Speed Testing Melanie D. Berg/MEI – Principal Investigator Hak Kim, Mark Friendlich/MEI.
RadMon thermal neutron cross-section calibration D.Kramer for the RadMon team L.Viererbl, V.Klupak NRI Rez 1.
CODES: component degradation simulation tool ESA Project 22381/09/NL/PA.
3/FEB/2015G. Blanchot, F. Faccio, S. Michelis1 FEASTMP DCDC Converters G. Blanchot On behalf of the PH-ESE Power Project Team.
1 ECAL/HCAL FEB and CROC. FEB serialisers Serialiser tests GANIL Irradiation test. CROC bit flip error modifications and tests Calorimeter Detector/Electronics.
Qualification of components (Electronics)
Comparison Study of Bulk and SOI CMOS Technologies based Rad-hard ADCs in Space Feitao Qi , Tao Liu , Hainan Liu , Chuanbin Zeng , Bo Li , Fazhan Zhao.
Irradiation test results for SAMPA MPW1 and plans for MPW2 irradiation tests Sohail Musa Mahmood
EI205 Lecture 13 Dianguang Ma Fall 2008.
Geant4 and Microelectronics – Recent Successes, Looming Concerns
GLAST Large Area Telescope:
EMC problems of DSOI device and circuits
Created by Luis Chioye Presented by Cynthia Sosa
BESIII EMC electronics
R2E workshop B. Dehning B.Dehning.
The pros and cons of in-situ testing – going beyond the test standards
MSP432™ MCUs Training Part 6: Analog Peripherals
Rad Hard Products for Satellites and Space
Presentation transcript:

TRAD, Tests & Radiations 13/09/2011 LHC POWER CONVERTER Radiation analysis

TRAD, Tests & Radiations 2 13/09/2011Introduction  The aim : to use TRAD experience in spatial applications and to apply existing literature to propose test recommendation for radiation characterization compliant with LHC environment  search of radiation tests data on the different types performed on public data base  references chosen by CERN designers : radiation data analysis & complementary radiation tests needed.  Then we propose radiation characterization recommendations and priority for the different component families : High, medium, low.  Irradiation facilities.

TRAD, Tests & Radiations 3 13/09/2011 LHC RADIATION ENVIRONMENT  Maximum radiation level for 10 years LHC operation

TRAD, Tests & Radiations 4 13/09/2011 Total Ionizing Dose  100 Gy for 10 years : level rather low but some devices are excpected to show degradation  ELDRS has to be taken into account  Based on specifications for spatial application Margin

TRAD, Tests & Radiations 5 13/09/2011 TID Statistical approach  Delta XL = +/- K(n,C,P) σ  There is a probability P with a confidence limit C that a given electrical parameter will not exceed the following limits Delta XL  is the mean shift among tested population of n samples, σ is the standard deviation of the shift, K is the one sided tolerance limit factor.  A 3-sigma (K=3) approach is often used in spatial applications, with n=5 (samples) it will yield a probability of success P>0.9 with a confidence level C>0.9  90% of parts from a given lot have a failure level above the type TIDS, with a confidence level of 90%.

TRAD, Tests & Radiations 6 13/09/2011 Displacement Damage  Tunnel : 3 e11 1MeV neutron/cm² for 10 years  Devices concerned : Optocouplers, bipolar transistors, operational amplifiers, comparators, voltage reference,…  shielded area : 6 e10 1MeV neutron/cm2  only a few high precision components may show a significant degradation.

TRAD, Tests & Radiations 7 13/09/2011 Single Event Effects: Single Event Effects: Thermal neutrons  10B loacted near the sensitive nodes of the devices.  The two recoils (Li and He) ions  BPSG in CMOS devices for technology nodes of 0.15µm and older.  P+ zones doped with boron give sensitivity to thermal neutrons.  So thermal neutrons effects need to be evaluated on digital devices (FPGA, SRAM,..)  in priority : technology node >150nm.  The observed SEU sensitivity ratio is about two decades (typically 5E-14 cm2/bit with BPSG and 5E- 16 cm2/bit without BPSG).  Thermal neutron effects have been studied mostly on digital devices. analog devices considered to be immune, to be checked for devices very sensitive to SET with High Energy neutrons  facilities,  ILL in Grenoble  LLB in CEA/Saclay  other reactors with a moderator to enhance the thermal/high energy ratio can also be used.

TRAD, Tests & Radiations 8 13/09/2011 Single Event Effects: High Energy Hardrons  The variation of sensitivity of the different devices to the energy of the incident hadrons is complex.  the cross-section is considered in a first approximation as constant for energy>20MeV  But for some particular effects such as SEL, SEB, MCU and ASET (Analog Single Event Transients) this assumption is probably not sufficient.  Both LET and range (related to energy) of the secondary recoils are important parameters to induce these SEEs.

TRAD, Tests & Radiations 9 13/09/2011 Heavy Ions testing approach  Heavy ions testing is proposed to obtain the LET threshold to trigger SEL.  If LETth<15 MeV*cm2/g there is a high probability that SEL will be observed with HEH.  This approach will not give the SEL cross- section for the LHC environment but will indicate if SEL tests are needed in an environment representative of the LHC environment.

TRAD, Tests & Radiations 10 13/09/2011 OP27 : bipolar technology, high precision operational amplifier  Radiation data :  Testing recommendation  OP27 operational amplifier can be used for LHC tunnel environment.  A proton test (both TID and DD) should be performed to evaluate the degradation of the most sensitive parameter Ibias.

TRAD, Tests & Radiations 11 13/09/2011 LM139 : precision voltage comparators  Radiation data :  Total dose: Input bias current 20krad  SET: cross-section and Threshold LET related to the voltage difference between inputs.  dV=12mV: sigma=4E-9 cm2  Testing recommendation  A proton test (TID-DD) is needed to evaluate input current, gain, output current.  A high energy proton test to evaluate SET in worst case condition (Input voltage difference=10mV) should be performed

TRAD, Tests & Radiations 12 13/09/2011UC1842  Radiation data  No LETth >85 MeV.cm2/mg (Warren)  TID:  Vref: 15 krad  Other parameters >50krad  ASET  Protons: Cross-section 5E-10 cm2  Testing recommendation  UC1842 can probably be used in the application: Verify the effect of a variation of Vref, on the output voltages in the application.  TID: H4Irrad.  ASET: protons

TRAD, Tests & Radiations 13 13/09/2011 LTC bits DAC  Radiation data  SEL LET threshold of about 10 MeV-cm2/mg  cross section relatively small at low LETs, gradually increasing to about 10e-4 at high LET  factor of 1.5 to 2 increase in latchup cross section for the heated device.  Testing recommendation  SEL: static test  Electrical conditions: Vdd= Vddmax Vref=Vref nom.  Effects of input state on SEL sensitivity: LD, CLK, SRI will be put at 0 and then at 1.  Out1 at Gnd,  Total dose:  Bias under irradiation: Vdd nom, Vref nom :External high stable power supply, CLK (at a given frequency), 0 is stored in the register (Power On Reset),  Control: Power supply current, Output current (OUT1)  Detail test at several steps.  SET test  Room temperature test  Codes input: all0 or all1  Observation of output with an Operational Amplifier.  Measurement of SET amplitude and duration related to switches and register bits upset.

TRAD, Tests & Radiations 14 13/09/2011 AD768 AD 16 bits DAC  Radiation data  TID : tested biased at high dose rate within specifications up to 50 krads.  SEU LETth of about 15 MeV-cm2/mg  All of these SEU occur in the standby mode.  A simple reclocking of the data reset the device.  The device was tested at constant oscillation frequencies of 0.5, 1, and 12 MHz. No SEUs were seen at these frequencies.  The device is apparently immune to SEU effects at frequencies over 0.5 MHz.  Testing recommendation  SEL test  The SEU rate is related to the refreshing frequency of the device. At high frequency (>0.5 MHz) the probability of upset can be neglected  TID and DD: The technology of AD768 is ABCMOS1 from Analog Devices. So ELDRS effects can exist.  Test to be performed at H4IRRAD in active mode.  Bias: nominal on VDD and VEE.

TRAD, Tests & Radiations 15 13/09/2011 AD7846SQ AD  Radiation data  TID  DNL exceeds specification limit at 10krads(Si).  Functional failure at 15krads(Si), recovered after 168 hour annealing., parametric degradation continues.  Devices were taken to 20krads(Si) and no functional failure was observed. After 25krads(Si), functional failures were again observed.  SEL threshold > 110  Testing recommendation  SEL test is not mandatory because SEL was not observed with heavy ions at maximum LET.  SET: The output is a voltage output (A3 is the inside output amplifier). Output transients and outputs voltage variation will be monitored during irradiation.  Total Dose and DD  Test performed at H4IRRAD  Use of an external low noise high stability voltage reference  Parameters monitored: output voltage, power supplies Vcc, VDD, Vss current  Detailed linearity test before and after irradiation.

TRAD, Tests & Radiations 16 13/09/2011 LTC bits ADC  Radiation data  14 MeV neutrons  No SEL events were detected after a fluence of 2e10 neutrons per cm2. The limiting cross section 1.9 e-10 cm2  HI  At room temperature, SEL LETth between 8.0 and 11.7 MeV-cm2/mg.  For the heated device, SEL LETth between 5.3 and 8.0 MeV-cm2/mg.  Testing recommendation  SEL to be performed at high temperature at maximum values of Vdig and Vana.  Total dose and DD:  Tests to be performed at H4IRRAD to study simultaneously DD and Total dose.  SET and SEU  Output binary code modifications to analyze for a stable input condition.  First the stability of the code values to evaluate without radiation in the facility. A window of coding is defined that take into account of all sources of noise (Example + or -2bits around the code value). Only codes outside this window are considered as SET.

TRAD, Tests & Radiations 17 13/09/2011 Tests recommendations and priorities  Discrete devices

TRAD, Tests & Radiations 18 13/09/2011  Linear devices  Mixed devices

TRAD, Tests & Radiations 19 13/09/2011  Digital devices

TRAD, Tests & Radiations 20 13/09/2011 SEE Irradiation facilites

TRAD, Tests & Radiations 21 13/09/2011 SEE Irradiation facilites

TRAD, Tests & Radiations 22 13/09/2011 SEE Irradiation facilites

TRAD, Tests & Radiations 23 13/09/2011Conclusion  radiation characterization recommendations can be used as a guideline for the test campaign phase.  The radiation effects on the different families have been identified in WP2 and the radiation test priorities are evaluated with three criteria: high, medium, low.  All the testing recommendations, derating rules are given as a guideline and have to be used with precaution.  In some particular cases (application, very sensitive parts…) this recommendation could be not applicable and radiation testing remains the only way to characterize the part sensitivity.