Fluidic Self Assembly For Active Matrix Displays Alien Technology Corporation.

Slides:



Advertisements
Similar presentations
Lecture 0: Introduction
Advertisements

ECE 6466 “IC Engineering” Dr. Wanda Wosik
EE141 © Digital Integrated Circuits 2nd Manufacturing 1 Digital Integrated Circuits A Design Perspective Manufacturing Process July 30, 2002.
CH. 3 Solar Cell Basic III: Principle Organic Materials for Electronics and Photonics II.
MICROFLEX S Beeby, J Tudor, University of Southampton Introduction to MEMS What is MEMS? What do MEMS devices look like? What can they do? How do we make.
VLSI Design Lecture 2: Basic Fabrication Steps and Layout
Integrated Circuits (ICs)
1 FASwitch Technologies Company and Technology Overview F lexible A rray S witches C hanging H ow Y ou S ee the W orld.
MonolithIC 3D  Inc. Patents Pending 1 The Monolithic 3D-IC A Disruptor to the Semiconductor Industry.
Vernie Everett, Andrew Blakers, Klaus Weber, Evan Franklin Handling, Assembly, and Electrical Interconnection of 2 nd Generation SLIVER Solar Cells.
EE141 © Digital Integrated Circuits 2nd Manufacturing 1 CMOS Process Manufacturing Process.
Lecture #51 Lecture #5 – VLSI Design Review zPhotolithography zPatterning Silicon zProcess steps used are: yStarts with Si wafer yThermal oxidation yPhotoresist.
ECE 424 – Introduction to VLSI Design Emre Yengel Department of Electrical and Communication Engineering Fall 2012.
SEMICONDUCTOR DEVICE FABRICATION AN OVERVIEW Presented to EE 2212 Text Section 2.11 Supplement 24 September 2014.
How engineers in 1954 expected a computer to look like in 2004.
MEMs Fabrication Alek Mintz 22 April 2015 Abstract
3-Dimensional IC Fabrication Dominic DelVecchio Bradley Hensel.
Introduction to Electrical Engineering COMM 486 – Multimedia Literacy Project Benjamin S. Garrett 10 May 2015 Let’s Begin! Let’s Begin!
ES 176/276 – Section # 2 – 09/19/2011 Brief Overview from Section #1 MEMS = MicroElectroMechanical Systems Micron-scale devices which transduce an environmental.
1 Introduction to Organic Electronics Mohammad Agahian Panahi University of Tehran, ECE faculty VLSI Course Presentation Instructor: Dr. S. M. Fakhraie.
1/20 Passive components and circuits - CCP Lecture 13.
Enabling Technologies for the Mass Storage Industry Dr
Organic Semiconductor and its applications
How Chips Are Made? May 21 st, Agenda Introduction How Chips are made? How Transistors are made? How Chips are made? Question and Answers.
MonolithIC 3D Inc., Patents Pending MonolithIC 3D ICs RCAT approach 1 MonolithIC 3D Inc., Patents Pending.
Large Area Processing Research Programme National Science Foundation Manufacturing Energy Workshop 24 – 25 March 2009.
What Is a Computer? How is a computer defined?
Optical Displays Module Thomas D. Anthopoulos EXSS Group Department of Physics and Centre for Plastic Electronics Imperial College London London October.
POLYMER LED Presented By UMAKANTA MOHAPATRO ROLL # EI
How Emerging Optical Technologies will affect the Future Internet NSF Meeting, 5 Dec, 2005 Nick McKeown Stanford University
Lecture 0: Introduction. CMOS VLSI Design 4th Ed. 0: Introduction2 Introduction  Integrated circuits: many transistors on one chip.  Very Large Scale.
EE141 © Digital Integrated Circuits 2nd Manufacturing 1 Chapter 2 Manufacturing Process March 7, 2003.
Semiconductor Manufacturing Technology Michael Quirk & Julian Serda © October 2001 by Prentice Hall Chapter 9 IC Fabrication Process Overview.
Text Book: Silicon VLSI Technology Fundamentals, Practice and Modeling Authors: J. D. Plummer, M. D. Deal, and P. B. Griffin Class: ECE 6466 “IC Engineering”
Organic Electronics Presented By: Mehrdad Najibi Class Presentation for Advanced VLSI Course.
Lecture 24a, Slide 1EECS40, Fall 2004Prof. White Lecture #24a OUTLINE Device isolation methods Electrical contacts to Si Mask layout conventions Process.
1 CHM 585/490 Chapter 19 Semiconductors. 2 The market for imaging chemicals – photoresists, developers, strippers, and etchants – for the combined semiconductor.
What is MEMS Technology?. What is MEMS ? What is MEMS ? Micro Electro Mechanical Systems – micro scale dimensions (1mm = 1000 microns) – electrical and.
Conformal Computing Program July 26, 2007 NDSU Center for Nanoscale Science & Engineering Center for Bits and Atoms MIT Media Lab.
Present – Past -- Future
MonolithIC 3D Inc., Patents Pending MonolithIC 3D ICs November MonolithIC 3D Inc., Patents Pending.
VLSI INTERCONNECTS IN VLSI DESIGN - PROF. RAKESH K. JHA
45nm Processors & Beyond A Presentation On By Ajaypal Singh Dhillon Kurukshetra university.
EE141 © Digital Integrated Circuits 2nd Introduction 1 Principle of CMOS VLSI Design Introduction Adapted from Digital Integrated, Copyright 2003 Prentice.
Nanometer Technology © Copyright 2002, Fairview Ridge Partners, LLC All Rights Reserved Nanometer Technology AKI Expert Session.
Silicon Design Page 1 The Creation of a New Computer Chip.
By: Christopher Heil November 18, What is OLED? An Organic Light-emitting Diode (OLED) is a light emitting diode (LED) that is made of semiconducting.
EE 4611 INTRODUCTION, 13 January 2016 Semiconductor Industry Milestones Very pure silicon and germanium were manufactured PN junction diodes.
Trieste, 8-10 November 1999 CMOS technology1 Design rules The limitations of the patterning process give rise to a set of mask design guidelines called.
Chieh Chang EE 235 – Presentation IMarch 20, 2007 Nanoimprint Lithography for Hybrid Plastic Electronics Michael C. McAlpine, Robin S. Friedman, and Charles.
EE141 Manufacturing 1 Chapter 2 Manufacturing Process and CMOS Circuit Layout 1 st rev. : March 7, nd rev. : April 10, 2003.
PACKAGE FABRICATION TECHNOLOGY Submitted By: Prashant singh.
1 Device Fabrication And Diffusion Overview 5 and 8 February 2016 Silicon Wafer Production-Refer to Chapter “0” Prologue Raw material ― Polysilicon nuggets.
Winter 2016CISC101 - Prof. McLeod1 Today Take some of the “MAGIC” out of how computers work: How did the technology get to where it is today? –ENIAC movie.
Definition History Fabrication process Advantages Disadvantages Applications.
• Very pure silicon and germanium were manufactured
Basic Planar Processes
Prof. Jang-Ung Park (박장웅)
VLSI Design Methodologies
Solar Panels.
Light Emitting Polymers
Digital Integrated Circuits A Design Perspective
INTRO TO TDM AND BUM TDM – Top Down Manufacturing
INTRODUCTION AND OVERVIEW OF MANUFACTURING
MEMS TECHNOLOGY.
Lecture #25 OUTLINE Device isolation methods Electrical contacts to Si
INTRO TO TDM AND BUM TDM – Top Down Manufacturing
• Very pure silicon and germanium were manufactured
Manufacturing Processes
Presentation transcript:

Fluidic Self Assembly For Active Matrix Displays Alien Technology Corporation

Objective:Change the rules of display manufacturing Objective: Change the rules of display manufacturing 4Simple interface 4Reduced system complexity 4Combined display and electronics manufacturing in one process 4Improved reliability (fewer interconnections) 4Non-breakable plastic 4Result: Reduced costApproach: 4Conventional silicon foundries to fab circuits 4Proprietary etching to form silicon NanoBlock TM IC’s 4Proprietary FSA™ process to distribute NanoBlock IC’s on flexible substrate 4Conventional roll-to-roll (web) display manufacturing. Alien Technology Flexible Displays

Technical Capabilities  Proprietary, patented process to separate electronics fabrication from display fabrication  Allows Alien to leverage existing foundries  Allows Alien to design display electronics in single crystal silicon  Allows Alien to drive any and all display materials  Permits, for the first time, active electronics on plastic substrates  4 patents issued, 1 allowed, 22 more filed/in process  Lowers display factory capital investment from ~$1 billion to under $100 million  Modular factory capacity increase ($25 million increments)

Technology

Flat Display Process Flow CMOS Wafers Micromachine Blocks FSA Glass Panel or Plastic Panel Generate Holes Complete Display (standard)

Manufacturing Flow Form Receptor Sites FSA Fill Receptors Planarize NanoBlocks™ IC Metallize Form Wiring Assemble Display Test Remove from Web Form NanoBlock™ ICs

NanoBlock TM ICs On A Dime Photo by Ron Wilson 185 Micron NanoBlock 77 Micron NanoBlock

Receptor formation High Throughput Accurate Receptor Sites on Flexible Substrate

FSA/Web Process Continuous, fluid assisted in-line FSA FSA Fluid

Connected NanoBlock TM ICs

NanoBlock TM IC on Flexible Substrate Nanoblock™ circuit

Display Cross Section (Concept) SiO 2 / Polyester/ ITO Nanoblock™ IC Aluminum Wiring Electro Optic Material (PDLC, LEP, OLED, etc.) Note: Not to scale Polymer-Based Flexible Substrate Polymer Dielectric/ Planarization Layer

Products

Product Roadmap 2000 Micro Smart Cards Pagers Cellular Phones Palm Pilots PDA Handhelds Personal Videos Transportation Computers 2005 Wall-Hung Display New 2000 Production (300 Mil) (80 Mil) (105 Mil) (15 Mil) (500K)

“Amber” Display with PDLC

First Products – Smart Card Displays Photos Courtesy GEMPLUS

Conclusion Alien is not a niche manufacturer... Alien is going after major display markets... A little bigger, a little more resolution, a little more value-added each year... Alien is not inventing, but combining modern manufacturing with IP... Alien has the cost advantages, the features & the IP protection... Alien has: management experience sustainable advantages and scalable manufacturing processes Alien Technology…….can become the next Intel