Back-End Bonding H&K 710 bonder Glue Pitch Adaptors Robot I&J2500 Glue Beetle Chip to Hybrid.

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Presentation transcript:

Back-End Bonding H&K 710 bonder Glue Pitch Adaptors Robot I&J2500 Glue Beetle Chip to Hybrid

Mike Wormald Robot I&J2500 The I&J2500 has a work area of 510 x 510mm. We mount a turn plate to the work holder that allows us to hold the hybrid for accurate dispensing of the glue.

Mike Wormald Requirements Glue pitch adaptors to LHCB hybrids. Making sure all the bond pads are supported with glue, as bonding is impossible with bounce under the pads. Even spread of glue for planarity. (Bonding jigs vacuum this area down) Ensure no overspill of glue that would hinder the position of the sensors or cover bond pads for the chips Correct location of the pitch adaptors.

Mike Wormald Process Dispense GluePlace pitch adaptors

Mike Wormald Process Apply Weights Leave to cure In oven at 40c for 1hour. Visually inspect. Remove any excess or fill unsupported areas. Chips can be mounted at this stage Place back in oven for further two hours

Mike Wormald Glue chips to Hybrid Requirements Planarity, 710 bonder only has one touchdown per reference system but chips are bonded on all three faces. No overspill of conductive glue that may cause shorts on the hybrid Accurate placement –ease of bonding front end-

Mike Wormald Dispense Glue

Mike Wormald Place Chips

Mike Wormald Accurate Position

Mike Wormald Back End Bonding

Mike Wormald Screen shot of bonds with overlay

Mike Wormald The End