26 June 2001VELO-Overview VELO Overview T. Bowcock University of Liverpool
26 June 2001VELO-Overview Post-TDR Hardware Software Critical Issues Summary
26 June 2001VELO-Overview Hardware Sensors Hybrids Thermo-Mechanical Module Testbeam Production Facilities
26 June 2001VELO-Overview Hardware: Sensors (1) Two types of sensors produced –Hamamatsu (n+n) –Micron (p+n)2000 In fabrication (mask design at Lpool) –Micron (n+n)2001
26 June 2001VELO-Overview Hardware: Sensors (2) Laboratory –High precision tests with 1060nm lasers for both sets of detectors (LHCb note) Testbeam at CERN –Under preparation for 2001
26 June 2001VELO-Overview
26 June 2001VELO-Overview
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26 June 2001VELO-Overview
26 June 2001VELO-Overview Hardware: Sensors (3) Additional test equipment –Cosmic ray facility – now commissioned Shorter wavelength laser (900nm) –Ordered Automated Scanning x-y stage
26 June 2001VELO-Overview Hardware: Sensors (4) Simulation complete –First principle analysis of leakage currents and charge collection as a function voltage Agreement with data –Note low voltage phenomena <20V Q/I amplifiers.
26 June 2001VELO-Overview Hardware: Sensors (5) Identify manufactures for Production –Hamamatsu (withdrawn n+n option) –Micron (n+n, p+n) –CSEM, Eurysis, SEIKO, SINTEF, ST Technical discussions Price Enquiry
26 June 2001VELO-Overview Hardware: Hybrids(1) Hybrid Design&Production to IDE –Delivered –Bonded and mounted with chips –Fan-ins produced –Under test 4 chips r/o (26/6)
26 June 2001VELO-Overview Hardware: Hybrids(2) Kapton version to be ordered early 7/01 SCT-VELO design (Liverpool) –improved cable connections –Viable pre-production prototype Beetle design
26 June 2001VELO-Overview Hardware: Module(1) Thermal models for TDR Cooling system –Safety issues addressed
26 June 2001VELO-Overview
26 June 2001VELO-Overview
26 June 2001VELO-Overview Power Delta(T) (from nominal) Calibration Model
26 June 2001VELO-Overview Chip glue kapton sensor ceramic TPG Chip glue kapton sensor TPG CF weave CF(UD)
26 June 2001VELO-Overview
26 June 2001VELO-Overview Hardware: Module (2) Prototype and testing of adjustment Re-engineering –Carbon fibre base –O CTE materials including adjustment screws
26 June 2001VELO-Overview Electronics Cooling Bracket & Fixings Carbon Fiber Paddle Micrometer Adjusters Paddle Base Flat Spring Location Base Substrates Silicon Detectors x y y z z x (pitch) (roll) (slew)
26 June 2001VELO-Overview
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26 June 2001VELO-Overview Hardware: Module (3) Curvature of the sensors measured We may need to survey (cold?) the modules
26 June 2001VELO-Overview Hardware: Module (4) Measurement points
26 June 2001VELO-Overview
26 June 2001VELO-Overview
26 June 2001VELO-Overview Hardware: Testbeam Module for October 2001 –See also software
26 June 2001VELO-Overview Hardware: Production Facilities Clean rooms Bonding equipment Jigs and Assembly –Vacuum compatible glue dispensing
26 June 2001VELO-Overview Production Facilities LHCb R&D
26 June 2001VELO-Overview
26 June 2001VELO-Overview Software TDR analysis and optimisation Monte Carlo simulations of VELO VELO core software (meeting 5/6 July) Alignment Testbeam
26 June 2001VELO-Overview Software: Optimisation We generated and analysed over 10m bb events generated and analysed for different configurations: Physics Section Optimisation paper (for TDR) huge effort impossible without substantial effort
26 June 2001VELO-Overview Software: Silicon Other (non GEANT software) for optimisation of operating conditions
26 June 2001VELO-Overview
26 June 2001VELO-Overview
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26 June 2001VELO-Overview Software: Alignment(1) Alignment: Underway –From HERA code used by H1 –Fast determination of global parameters –Reduced to linear problem
26 June 2001VELO-Overview Software: Alignment(2) Curvature of detectors
26 June 2001VELO-Overview Residuals
26 June 2001VELO-Overview Software: Other LHCb production LHCb Grid –Testbeam as testbed
26 June 2001VELO-Overview Critical Issues Electronics Manufacturers for Silicon Grid
26 June 2001VELO-Overview Summary Sensors Hybrid Module Software