GoetzFIELDS iCDR – I&T Solar Probe Plus – FIELDS Integration and Testing Instrument CDR Keith Goetz University of Minnesota 1

GoetzFIELDS iCDR – I&T Requirements Verification 2 Verify Instrument Requirements per IRD –Verify Performance Requirements per FIELDS IRD (SPF_SYS_010) –Meet/Verify Quality Requirements per QA Matrix ( ) –Verify Contamination Requirements per CCP ( ) –Verify Environmental Requirements per ERTRD ( ) –Verify EMC Requirements per EMECP ( ) –Verify Spacecraft Interface Requirements per GI ICD ( ) –Verify Spacecraft Interface Requirements per FIELDS ICD ( ) –Verify SWEAP Interface Requirements per FIELDS-SWEAP ICD (SPF_MEP_105) Approach described in FIELDS Verification and Validation Plan (baselined: SPF_CDRL_TE V&V Plan) Approach described in detail in FIELDS Test and Calibration Plan (in development: SPF_CDRL_TE T&C Plan)

GoetzFIELDS iCDR – I&T Requirements Verification 3 A slice of IRD –Defines subsystem requirements –Flowed from PAY requirements IDTitleL4 RequirementsTBD Parent ID (Level 3) Parent TitleFull TextOwner DCB-01Mission LengthDCB Components shall be selected to withstand the environment of SPP for the duration of the mission PAY-309Payload: Backup Mission LengthAll instruments shall be designed to achieve an operational lifetime of at least 8 years after launch if launched during the 2019 backup launch period. FIELDS SWEAP WISPR ISIS DCB-02Spacecraft Interface Compliance (General)DCB shall implement the spacecraft interface protocol: [a] compliance with UART protocol [b] serial/parallel conversion and transfer to/from DCB Memory [c] detection/flagging of parity and framing errors [d] extraction of the "Virtual 1PPS" from the Command UART [e] selectionof S/C side based on active Command I/F [f] driving of Telemetry to active S/C side; disabling of inactive S/C telemetry driver PAY-276Compliance: General Instrument SpecificationAll instruments shall comply with the requirements and constraints imposed by the General Instrument to Spacecraft ICD, Document FIELDS SWEAP WISPR ISIS DCB-03TimingDCB shall provide latching facility upon detection of the "Virtual 1PPS" S/C timing signal: [a] timing uncertainty not to exceed one bit period of the S/C UART [b] subseconds portion of S/C Time is interpolated to resolution of > minimum internal instrument uncertainty. [c] S/C Time is transferred to the FIELDS instruments at least once/second PAY-113Timekeeping: FIELDS Time Knowledge Accuracy FIELDS shall limit internal instrument timing uncertainty to +/- 2 msec (3-sigma) relative to the most recently received Spacecraft time reference. FIELDS DCB-04Burst Memory ManagementDCB shall include Flash memory and controller that: [a] is capable of storing 300 kbps of instrument data packets for a solar encounter period. [b] provides services required by the FSW for FLASH memory data transfer and management [c] minimum transfer rate of 300kbps to/from DCB SRAM to support the instrument data packet volume PAY-109Payload: Burst Mode ManagementFIELDS shall be responsible for management of its internal burst data buffer. FIELDS

GoetzFIELDS iCDR – I&T Requirements Verification 4 The right hand side of the IRD –Defines requirement verification plans –Tracks verification closure IDTitle Verification Method (T, A, I) Verification Description Who When Due When Complete Rationale DCB-01Mission LengthAnalysisDesign Inspection (DCB Schematics, BOM): EEE Component Specifications and Stress Analysis Report; Parts radiation test reports when applicable FIELDS/UCBBefore ATP to flight Stress Analysis insures that components ratings cover the MEP Thermal Environment; Radiation Specification and/or testing insures that the parts survive the expected mission total dose. DCB-02Spacecraft Interface Compliance (General)InspectionDesign Inspection: (DCB Specification) and board level functional tests to validate FIELDS/UCBBefore instrument I&T DCB-03TimingTestDesign Inspection (DCB Specification) and board level functional tests to validate FIELDS/UCBBefore instrument I&T DCB-04Burst Memory ManagementTestDesign Inspection (DCB Specification);verificat ion of transfer rate during board level validation. FIELDS/UCBBefore instrument I&T

GoetzFIELDS iCDR – I&T Instrument I&T Plans 5 Philosophy –Requirements are verified as early as possible at a low level Verifies subsystems, Retires risk –Requirements are verified at the highest level of assembly possible Often involves verifying a requirement at several levels –Maintain flexibility in test sequencing to maintain schedule Tests on ETU and Flight Units –Subset of tests on ETU to qualify the design where practical and possible Some complete – some continue to 1 March 2015 –Full tests on Flight units Typical Test Levels: –Subassembly (circuit board): functional –Component (e.g. V1, MAG, SCM, MEP): functional, mass properties, vibration, TV, deployments, magnetics –Instrument: functional, comprehensive, calibration, interface, EMC, TV

GoetzFIELDS iCDR – I&T Environmental Test Matrix 6

GoetzFIELDS iCDR – I&T Planned FM I&T Flow 7

GoetzFIELDS iCDR – I&T Validation 8 All instrument requirements are captured in IRD –IRD contains columns detailing how and where the requirement is met IRD doubles as verification cross reference matrix Systems Engineer is responsible for verifying test procedures meet requirements and responsible for verifying that all requirements are met by following test plan

GoetzFIELDS iCDR – I&T Procedures 9 Each test will be documented by a Test Procedure –Test procedure shall identify IRD requirements to be verified by the test –Test procedure shall include pass/fail criteria –System Engineer, QA, Subsystem lead to sign off on procedure before use –System Engineer, QA to sign off on completed as-run procedure –QA to ensure Red-lines to be transferred into procedure before next use Each completed test to be documented by a Test Report –ETU and subassembly test reports may be a combination of the as-run procedure and lab notebook –System Engineer to sign off on test reports, and determine if test adequately verifies associated requirements Discrepancies found during tests to be documented in a Problem Failure Report (PFR) –Starting with first functional tests at FM subassembly level –Includes any problem (including software) not immediately identified as a test setup or operator problem which cannot stress the flight article –QA will track PFRs to closure with concurrence of the Failure Review Board (includes APL)

GoetzFIELDS iCDR – I&T Calibration 10 Co-I hardware institutions will deliver fully calibrated sub- assemblies Once FIELDS instrument is fully integrated –Several verification cals in ambient and at temperature as reference –Timing –SWEAP interface Antennas – as mechanical elements – can be tested separately

GoetzFIELDS iCDR – I&T Interfaces 11 Interface tests verify that interfaces meet requirements from ICD and/or specifications FIELDS ETU well tested with APL S/C mini emulators –FIELDS1 and FIELDS2 FIELDS FM to be tested with APL S/C full emulators –In hand FIELDS TDS ETU/FM to be tested with SWEAP (at UCB) –Tested with emulation in the meantime At other times (prior to Observatory I&T) interfaces simulated with GSE –Board, Component level tests performed with Board Interface Simulation GSE –Instrument-level tests performed with: APL-provided spacecraft emulators Command and Telemetry GSE software Stimulation GSE or internal test signal DCB, TDS and SWEAP simulator (FIG) MAG simulators on FIELDS2 at UMN and UCB Deployment actuator simulators

GoetzFIELDS iCDR – I&T Mechanical Testing 12 Antenna mechanisms can be tested independently of electronics Full functional testing Vibration TV Where appropriate, testing will include whips

GoetzFIELDS iCDR – I&T Thermal Testing 13 Tests per SPP Environmental Spec –1 survival and 6 operational thermal vacuum cycles –Temperature ranges detailed in thermal presentation Per FIELDS V&V and T&C plans –V1-V4 PAs in one range –V5 PA in one range –MAG sensors (at GSFC) –SCM assembly (at LPC2E) –MEP is the simplest Includes all sensors – for the ride –Antenna mechanisms Planned EM Thermal Balance test using EM FIELDS boom and EM/EQM sensors in late 2015 –Verifies thermal models –Determines final heater values Planned FM Thermal Balance test using FM FIELDS boom and flight sensors and harnesses as first step after FIELDS delivery

GoetzFIELDS iCDR – I&T EMC Testing 14 Tests per EMECP Deep Dielectric Discharge Test on EM –Interfaces Only for MEP (Shielded) –All points on sensors outside S/C body DC Magnetics (sniff test) –ETU and Flight Units, Component level Target Is <10nT DC at outer most sensor on MAG boom Results of sniff test reported to Magnetics Working Group for analysis and possible mitigations Test to be performed by UCB or APL personnel –Critical for boom mounted sensors (V5 and SCM)

GoetzFIELDS iCDR – I&T EMC Testing 15 Surface Charging / Electrostatic Cleanliness –Measure resistance between exposed surfaces Requirement <10 5 ohms per square to chassis ground –Some surfaces may be covered with thermal blankets blanket testing needs to be done at Observatory level repeated late in the flow Ground Bonding and Isolation –Chassis bonding < 2.5 milliohms between adjacent chassis elements < 5 milliohms box to chassis –Ground Isolation >1Mohm primary to secondary (chassis) ground –Measured at Instrument-level EMC testing ETU and FM Turn On/Off transients –In-rush and transient current profile limits per EMECP document –In-rush current and transient profile Measured on EM power supplies – ok To be measured on FM as part of instrument-level EMC testing CE, CS, RE, RS tests as detailed in EMECP –ETU will only do CE measurements on the bench –FM will see the full suite

GoetzFIELDS iCDR – I&T Contamination 16 FIELDS Contamination Control Plan documents how FIELDS will meet Project contamination control requirements – compatible with Project CCP The only significant FIELDS contamination sensitivity is the antenna surfaces –Will be in storage through most of I&T –Special handling procedures apply when antennas are exposed Mostly for ESD No purge requirement at any point FM instrument I&T will be in Class 100,000 facility at UCB –Subassemblies / Components delivered to I&T will be inspected and cleaned as needed prior to integration into components –When Instrument is not in a Class 100,000 environment the unit will be bagged Flight units will be baked out per FIELDS bakeout plan prior to delivery to APL –Vacuum bakeout at max survival temp for at least 48 hours with TQCM

GoetzFIELDS iCDR – I&T S/C–Level I&T 17 FIELDS and APL have had discussions w/r/t S/C level I&T –FIELDS has delivered an I&T “inputs” document to outline FIELDS’ plans and requirements FIELDS integration will involve a number of elements (~17 plus harnessing) FIELDS will have external stimuli rack to support CPT functional testing V1234 antenna whips will not usually be installed on S/C –Red-tag protection for PA inputs and for the injection of stimuli V5 will have a red-tag RF shield –For use on or off MAG boom FIELDS magnetic sensors will have protective enclosures –MAGi, MAGo, SCM –µ-metal enclosures with internal 3-axis Helmholtz coils Antenna whips will not be deployed at Spacecraft level –Too hard to implement off-load GSE at spacecraft level –Full deployment without whips can be done in a variety of configurations Actuator simulators will be provided to perform simulated boom deployments –Simulators contain flight-like resettable actuators (or equivalent loads) –Simulators attach to S/C deployment harnessing –Simulators can be used at spacecraft-level TV S/C Timing testing planned – to include SWEAP timing

GoetzFIELDS iCDR – I&T FIELDS Flight Configuration 18

GoetzFIELDS iCDR – I&T FIELDS CPT Configuration 19

GoetzFIELDS iCDR – I&T FIELDS Flight Mates Configuration 20

GoetzFIELDS iCDR – I&T Early Operations 21 FIELDS Payload Operations Center to be built at APL –Based on GSE development –Based on recent RBSP experience –Build real-time command loads –Collect real-time telemetry stream from MOC Archive Distribute to FIELDS team on site –FIELDS team at APL for: Power on Commissioning –With and without TWTA Deployments –MAG boom (day 4) –Electric antennas (day ~30) –FIELDS team at UCB SOC throughout as well Operations will transition to UCB and remote control –Practiced during I&T

GoetzFIELDS iCDR – I&T Mission Operations 22 Science Operations Center to be built here at UCB –Based on GSE development –Based on recent RBSP experience –Will include a full high-fidelity engineering model Testing command loads and sequences Testing FSW loads –Build command loads with GSEOS using command databases being populated now Instrument operations Selection of select data to playback from FIELDS1 internal recorder –Produce FIELDS data products –Serve FIELDS data products to the community –Deliver data products final resting place

GoetzFIELDS iCDR – I&T S/C Autonomy 23 Based on S/C observations of FIELDS1/FIELDS2 health –Communications (timely delivery of critical HK packets to S/C C&DH) –Power consumption (as measured by S/C C&DH) –Temperatures (as measured by S/C C&DH) –Voltages (as provided in FIELDS critical HK) Critical HK packet - ApID 2A2 ItemByte(s)Bits Conversion Values Notes CCSDS Header1080 FIELDS_1 Control1 Unused bits 5 FIELDS_1_REM_Side 1 FIELDS_1 Power Down Request 2 Spare1 8 FIELDS_1 Shared Data CBS1 8 MAGo Action1 8 FIELDS_1 Critical HK DCB FPGA Temp1 8 DCB Temp1 8 LVDS Zener1 8 used by autonomy to determine if LVDS interface has a fault LVDS 3.3V1 8 used by autonomy to determine if LVDS interface has a fault DCB 3.3V1 8 used by autonomy to determine if LVDS interface has a fault AEB1 Temp1 8 DFB Temp1 8 SCM Temp1 8 LNPS1 Temp1 8 LNPS1 6V1 8 used by autonomy to determine if LVDS interface has a fault MAGo Sensor Temp1 8 MAGo PCB Temp1 8 Spare2 16 Critical HK packet - ApID 302 ItemByte(s)Bits Conversion Values Notes CCSDS Header10 80 FIELDS_2 Control1 Unused bits 5 FIELDS_2_REM_Side 1 FIELDS_2 Power Down Request 2 Spare1 8 FIELDS_2 Shared Data TDS Action1 8 MAGi Action1 8 FIELDS_2 Critical HK LVDS 6V1 8 used by autonomy to determine if LVDS interface has a fault LVDS 3.3V1 8 used by autonomy to determine if LVDS interface has a fault LVDS Zener1 8 used by autonomy to determine if LVDS interface has a fault TDS 3.3V1 8 used by autonomy to determine if LVDS interface has a fault TDS FPGA Temp1 8 AEB2 Temp1 8 LNPS2 Temp1 8 MAGi Sensor Temp1 8 MAGi PCB Temp1 8 Spare5 32

GoetzFIELDS iCDR – I&T FIELDS ConOps 24 A typical good SPP orbit Step 1 ~8 days or more before perihelion Step 2 Perihelion science Step 3 Step 4 S/C Downlinks Survey Data Step 5 Step 6 Convene science summit Step 7 Command select data Step 8 S/C Downlinks select data Step 1 Repeat Many orbits will provide telemetry challenges – we’re developing plans Perihelion Science

GoetzFIELDS iCDR – I&T Conclusion 25 Requirements are understood Documentation is in place Instrument I&T plans are in good shape –Practicing with EM now Spacecraft I&T plans are taking shape –Previous APL experience helps – STEREO and RBSP FIELDS is ready to continue into FM development