Multi-Level, Multi-Domain Hybrid Network Inter-Operation & Performance Tom Lehman (USC/ISI) Nasir Ghani (Tenn Tech) Chin Guok (ESnet) Nagi Rao (ORNL) John Vollbrecht (Internet2) John Moore (MCNC) US Dept. of Energy Office of Science Joint Techs Winter Meeting February 12, 2007 Minneapolis, Minnesota Hybrid MLN

2 Outline Project Overview Multi-Layer, Multi-Domain Hybrid Network Issues/Investigation Areas Hybrid Network DataPlane(s) Hybrid Network Control Plane(s)

3 Project Overview Hybrid Multi-Layer Network Control Project Funded by DOE Office of Science –Dr. Thomas D. Ndousse, Program Manager Investigating issues associated with Multi-Layer, Multi-Domain Hybrid Networks from an architecture, data plane, and control plane perspective –Design and analysis –Experimentation and data collection –Modeling and simulation

4 Hybrid MLN Participants Tennessee Tech University –Nasir Ghani –Qing Liu Information Sciences Institute East –Tom Lehman –Xi Yang Internet2 –Rick Summerhill –John Vollbrecht –Andrew Lake Oak Ridge National Laboratory –Nagi Rao ESnet LBNL –Chin Guok

5 Hybrid Network Data Planes Basic premise of hybrid networks is the availability of both best effort routed service and deterministic dedicated resource paths, i.e., circuits There are many technologies available over which to construct these circuits –IP router-based Multiprotocol Label Switching (MPLS) Label Switched Paths (LSPs) “circuits” –Ethernet VLAN based “circuits” –SONET/SDH TDM “circuits” –Wavelength Division Multiplexing (WDM) “circuits”

6 What Data Plane Technologies to Use? What do you want to do with your circuits? –Dedicated bandwidth connections for deterministic file transfers? –Dedicated bandwidth & low jitter for instrument control or interactive applications? –Connector backhaul to your IP Network? –Traffic engineering of your IP Network? Dynamic router-to-router circuits for traffic cut thru? –Computer to Computer communications? Processor to memory? block data storage system access? –Setting up application specific topologies to create & optimize distributed application or data storage systems?

7 Data Plane Testing Test characteristics/performances of “circuits” constructed via different technologies; and also “end-to-end paths” constructed via concatenation of individual circuits Questions –What is difference between the different technologies? –How well does the concatenation/stitching work? –How well does policing/shaping work at the edge? –What happens to a flow that is policed/shaped at the ingress edge by the time it exits the egress edge?

8 What are the performance characteristics (jitter, loss, latency) of circuits provisioned using individual data plane technologies? What are the performance characteristics of end-to-end circuits constructed via concatenation of multiple individual circuits (spanning multiple data plane technologies & network domains) What is the performance of an end-to-end circuit constructed via the hierarchical nesting of circuits at different technology levels? How to quantify and characterize the performance of data plane technologies so that network designers and end-users can make decisions as to what is best suited to their needs and objectives? Can analytical and simulation models be built to correlate empirical findings of real world data collection to a reasonably close degree? Can these analytical/simulation models further predict performance in generalized hybrid networks and assist w. design efforts? More Questions

9 Data Plane Testing Circuit Descriptions –Circuit type: network [accessframing:dataplane:accessframing] –Circuit path: network [ingressloc:transitnodes:egressloc] Circuit Type: –network[accessframing:dataplane:accessframing] Where the following values are possible for the above parameters: Network - esnet, sdn, abilene, i2dsn, hopi, usn, dragon Accessframing - ethernet, sonet (not included in this test plan), infiniband (not included in this test plan) Dataplane - psc, pscq, l2sc, tdm, lsc (where pscq is a PSC path with QoS applied to the LSP)

10 Multi-Layer, Multi-Domain LSPs Data Plane Testing

11 An Example Circuit The formal description of this extended inter-network path: –Circuit type: usn [ethernet:tdm:ethernet]:i2dsn [ethernet:tdm:ethernet]:esnet [ethernet:pscq:ethernet]:usn[ethernet:tdm:ethernet] –Circuit path: usn [ORNL:CHIN]:i2dsn [CHIN:WASH]:esnet [WASH:CHIN]:usn [CHIN:STTL:SUNV]

12 Data Paths Across: ESnet USN Abilene Internet2 Network DRAGON Initial Testing Configuration, using Spirent AX4000 More testing/paths to follow after this round complete Data Plane Testing

13 Spirent AX Hardware based Traffic Source and Sink External CDMA Clock allows for synchronized timestamps Spirent AX Gbps with OC192 POS / BERT / 10GbE Two Gigabit Ethernet Test Equipment

14 Modeling & Simulation Overview Discrete event simulation GUI interface, high re-use Full C/C++ interface Hierarchical modeling: Subnet-node-link-process “In-House” Development MPLS/GMPLS control: RSVP-TE, OSPF-TE, PCE Layer 2/3 data plane: IP/MPLS, VLAN Full Layer 1 support: DWDM, SONET,GFP Model any networks OPNET Modeler TM Environment

15 Layer 2/3 nodes (IP/MPLS, VLAN) –Generic modeling of T640, E300, others –Advanced I/O buffering design, policing, scheduling Status: MPLS completed (12/06), VLAN nearly done Layer 1 nodes (SONET, DWDM) –SONET TSI, GFP edge mappings (model Ciena CDI) –DWDM cross-connects w. SONET framing Status: Completed (1/07) End-systems & test applications –TCP & UDP file, TCPMON, UDPMON, ICMP-PING, ext. timestamps (SPIRENT tester) Status: All completed except TCPMON (12/06) Models Suite (Data Plane)

16 Current activities –Coding wrap-up, active development/testing of end- to-end delay and jitter scenarios –Corroborating simulations with recent live tests on ESnet-USN, USN-Cheetah, USN-Hopi, etc –Gauge impact of SONET segments in e-2-e path Near term & future activities –Extrapolate out and simulate larger networks & domain mixtures (VLAN-SONET-MPLS) –Generate inputs for subsequent control plane development phase (i.e., TE routing rule-sets) Simulation Test Plan

17 Thank-You Questions & Comments ? Tom Lehman