© Pearson & GNU Su-Jin Kim MEMS Manufacturing Processes MEMS Devices The MEMS(Microelectromechanical systems) devices can be made through the IC Process:

Slides:

Advertisements

Similar presentations

MICROELECTROMECHANICAL SYSTEMS ( MEMS )

Advertisements

Design and Simulation of a Novel MEMS Dual Axis Accelerometer Zijun He, Advisor: Prof. Xingguo Xiong Department of Electrical and Computer Engineering,

Copyright © MDIS. All rights reserved.

MICROFLEX S Beeby, J Tudor, University of Southampton Introduction to MEMS What is MEMS? What do MEMS devices look like? What can they do? How do we make.

MEMS Tuning-Fork Gyroscope Group 8: Amanda Bristow Travis Barton Stephen Nary.

Fabrication of p-n junction in Si Silicon wafer [1-0-0] Type: N Dopant: P Resistivity: Ω-cm Thickness: µm.

NOVEL PROCESSES FOR SOI-BASED MEMS AT VTT

New Trends and Technologies for (N)MEMS

Applications: Pressure Sensors, Mass Flow Sensors, and Accelerometers CSE 495/595: Intro to Micro- and Nano- Embedded Systems Prof. Darrin Hanna.

For the exclusive use of adopters of the book Introduction to Microelectronic Fabrication, Second Edition by Richard C. Jaeger. ISBN © 2002.

Chapter 14: Fundamentals of Microelectromechanical Systems

Bulk Micromachining of Silicon for MEMS Mustafa G. Guvench, Ph.D. University of Southern Maine.

Applications: Angular Rate Sensors (cont’d)

Microelectronics & Device Fabrication. Vacuum Tube Devices Thermionic valve Two (di) Electrodes (ode)

YoHan Kim  Thin Film  Layer of material ranging from fractions of nanometer to several micro meters in thickness  Thin Film Process 

INTEGRATED CIRCUITS Dr. Esam Yosry Lec. #5.

MEMs Fabrication Alek Mintz 22 April 2015 Abstract

HOW SMALL CAN WE TAKE THIS? - ART OF MINIATURIZATION.

RF MEMS devices Prof. Dr. Wajiha Shah. OUTLINE  Use of RF MEMS devices in wireless and satellite communication system. 1. MEMS variable capacitor (tuning.

MEMS Fabrication and Applications Brought to you by: Jack Link & Aaron Schiller Date delivered on: Friday the third of May, 2013 ABSTRACT: Taking a brief.

Surface micromachining

MEMS Fabrication By Thomas Szychowski.

NANO-ELECTRO-MECHANICAL SYSTEM(NEMS)

Manufacturing, Engineering & Technology, Fifth Edition, by Serope Kalpakjian and Steven R. Schmid. ISBN © 2006 Pearson Education, Inc.,

Bulk Micromachining of Silicon for MEMS

ES 176/276 – Section # 2 – 09/19/2011 Brief Overview from Section #1 MEMS = MicroElectroMechanical Systems Micron-scale devices which transduce an environmental.

TOPICS IN (NANO) BIOTECHNOLOGY Microfabrication techniques I PhD Course.

Simple piezoresistive pressure sensor

© Pearson & GNU Su-Jin Kim MEMS Manufacturing Processes Micro Fabrication Associate Professor Su-Jin KimSu-Jin Kim School of Mechanical Engineering Gyeongsang.

Manufacturing Processes

SEMINAR ON MICRO-ELECTRO-MECHANICAL SYSTEMS (MEMS) A.RADHAKRISHNAN MECHANICAL ENGINEERING, CPT COLLEGE THIRUVANANTHAPURAM PART-1.

Why do we put the micro in microelectronics?. Why Micro? 1.Lower Energy and Resources for Fabrication 2.Large Arrays 3.Minimally Invasive 4.Disposable.

Figure 15.1: Two examples of MEMS/MST devices, the Analog Devices accelerometer (a), a sensor, and the Texas Instruments Digital Light Projector (DLP),

NANOMETER SCALE LITHOGRAPHY DANIEL BERNARD – BENJAMEN STROBELAPRIL 29, 2013 EE 4611 – STANLEY G. BURNS NANOMETER SCALE LITHOGRAPHY, ALSO KNOWN AS NANOLITHOGRAPHY,

SEMINAR ON IC FABRICATION MD.ASLAM ADM NO:05-125,ETC/2008.

Case Studies in MEMS Case study Technology Transduction Packaging Pressure sensor Bulk micromach.Piezoresistive sensing Plastic + bipolar circuitryof diaphragm.

Chapter Extra-2 Micro-fabrication process

Copyright Prentice-Hall Chapter 29 Fabrication of Microelectromechanical Devices and Systems (MEMS)

EE235 Presentation I CNT Force Sensor Ting-Ta YEN Feb Y. Takei, K. Matsumoto, I. Shimoyama “Force Sensor Using Carbon Nanotubes Directly Synthesized.

INTEGRATED CIRCUITS Dr. Esam Yosry Lec. #3. Diffusion  Introduction  Diffusion Process  Diffusion Mechanisms  Why Diffusion?  Diffusion Technology.

ISAT 436 Micro-/Nanofabrication and Applications

What is MEMS Technology?. What is MEMS ? What is MEMS ? Micro Electro Mechanical Systems – micro scale dimensions (1mm = 1000 microns) – electrical and.

Are mechanical laws different at small scales? YES! If we scale quantities by a factor ‘S’ Area  S 2 Volume  S 3 Surface tension  SElectrostatic forces.

1 3 MEMS FABRICATION Ken Gilleo PhD ET-Trends LLC 24%

Spencer/Ghausi, Introduction to Electronic Circuit Design, 1e, ©2003, Pearson Education, Inc. Chapter 3, slide 1 Introduction to Electronic Circuit Design.

IC Fabrication/Process

Micro/Nanofabrication

ROCHESTER INSTITUTE OF TECHNOLOGY MICROELECTRONIC ENGINEERING

Fabrication Process for Micro Structures

EE141 © Digital Integrated Circuits 2nd Manufacturing 1 Digital Integrated Circuits A Design Perspective Manufacturing Process Jan M. Rabaey Anantha Chandrakasan.

CMOS FABRICATION.

Fab - Step 1 Take SOI Wafer Top view Side view Si substrate SiO2 – 2 um Si confidential.

MEMS Microelectromechanical Systems NEMS Nanomechanical Systems and NanoDevices.

MICROMACHINING TECHNOLOGY. Introduction Micromachining is used to create parts of size in the order of meters. Materials on a micrometer-scale possess.

(Chapters 29 & 30; good to refresh 20 & 21, too)

Micro Electro Mechanical Systems (MEMS) Device Fabrication

1 Device Fabrication And Diffusion Overview 5 and 8 February 2016 Silicon Wafer Production-Refer to Chapter “0” Prologue Raw material ― Polysilicon nuggets.

UV-Curved Nano Imprint Lithography

Fabrication By Thomas Szychowski.

Chapter 1 & Chapter 3.

MEMS, Fabrication Cody Laudenbach.

its methods and applications

Silicon Wafer cm (5’’- 8’’) mm

MEMS TECHNOLOGY By Rogerio Furlan.

MEMS TECHNOLOGY.

Process flow part 2 Develop a basic-level process flow for creating a simple MEMS device State and explain the principles involved in attaining good mask.

MicroElectroMechanical Systems

(2) Incorporation of IC Technology Example 18: Integration of Air-Gap-Capacitor Pressure Sensor and Digital readout (I) Structure It consists of a top.

SILICON MICROMACHINING

Presentation transcript:

© Pearson & GNU Su-Jin Kim MEMS Manufacturing Processes MEMS Devices The MEMS(Microelectromechanical systems) devices can be made through the IC Process: Bulk micromachining: Pressure sensor Surface micromachining: Accelerometer

© Pearson & GNU Su-Jin Kim MEMS Manufacturing Processes Bulk micromachining Mask pattern by SiO 2 or Si 3 N 4 Etching silicon substrate

© Pearson & GNU Su-Jin Kim MEMS Manufacturing Processes Acceleration and Pressure sensor

© Pearson & GNU Su-Jin Kim MEMS Manufacturing Processes Pressure Fabrication steps for pressure sensor

© Pearson & GNU Su-Jin Kim MEMS Manufacturing Processes Thermal Ink-jet printer

© Pearson & GNU Su-Jin Kim MEMS Manufacturing Processes Surface micromachining Micro-cantilever 1.Silicon substrate, Si 2.Deposit silicon nitride, Si 3 N 4 3.Grow silicon oxide, SiO 2 4.Pattern by Lithography 5.Deposit polysilicon 6.Remove SiO 2 by Etching

© Pearson & GNU Su-Jin Kim MEMS Manufacturing Processes Accelerometer for airbags Acceleration  Displacement of beam  Capacitive change  Turn on the airbag

© Pearson & GNU Su-Jin Kim MEMS Manufacturing Processes Micromirror Device

© Pearson & GNU Su-Jin Kim MEMS Manufacturing Processes Comb Drive / Capacitive Parallel Plate Capacitor C = ε A/d Electrostatic Force Fe = ½ ε (A/d 2 )V 2

© Pearson & GNU Su-Jin Kim MEMS Manufacturing Processes Nanoscale Manufacturing Parts are produced at nanometer(10 -9 ) length scales. Integrated circuits are at this length scale. Carbon nanotubes have high strength and electrical current-carrying capability. Carbon nanotubes: Nano tech: (10min)