BepiColombo/MMO: MDP MMO-SWG #3 [March 2006] -1- C. Noshi/RASC, Kyoto Univ. MMO Mercury Magnetospheric Orbiter MDP (Mission Data Processor) for BepiColombo.

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Presentation transcript:

BepiColombo/MMO: MDP MMO-SWG #3 [March 2006] -1- C. Noshi/RASC, Kyoto Univ. MMO Mercury Magnetospheric Orbiter MDP (Mission Data Processor) for BepiColombo MMO Y. Kasaba, T. Takashima, H. Hayakawa (MDP Core Team = JAXA/BepiColombo Project Office) [MDP team] Core Members PSU NTS & H. Hayakawa (JAXA) IPDNTS & Y. Kasaba (JAXA) DPU MHI & Y. Kasaba & T. Takashima (JAXA) MPPE (for MDP-1) incl. support to MGF-O T. Takashima, K. Asamura (JAXA) PWI (for MDP-2) incl. support to MGF-I/MSASI/MDM Y. Kasahara, T. Imachi (Kanazawa U) H. Kojima, Y. Ueda (RISH/Kyoto U) Y. Kasaba (JAXA) Supported by ISAS Data Handling Group

BepiColombo/MMO: MDP MMO-SWG #3 [March 2006] -2- [Meetings incl. Payload members] * Large meetings: before the next MMO-Design Meeting & MMO-SWG in May-June. (with the update of “I-ICD FAQ” and “MMO-Payload Action Item List”) [Electrical] * PSU might be independently prepared for the instruments outside of MDP. * Grounding Concept in MDP-2 : It will be fixed based on the EM test by PWI. [Mechanical / Thermal] * Vertical style: It will be studied in detail in 2006FY. [DPU] * SpaceWire I/F : Hardware design is progressed. Test hardware (= E-GSE in future) is in development. * Software :Conceptual design is progressed. [Development Schedule] *Schedule for MDP & Its I/F is updated. Progress from Jan. 2006

BepiColombo/MMO: MDP MMO-SWG #3 [March 2006] -3- PSU [DC/DC Converter] IPD [Switcher/ Limiter] Spacecraft System Mission Data Processor [MDP-1] DPU: 9 clients [CPU+MEM] PSU [DC/DC Converter] Mission Data Processor [MDP-2] MGF-in MDM (elec) Command Telemetry Power Command Telemetry Power MGF-out MEA1 (sensor/elec.) MGF-in (sensor) MDM (sensor) MSASI (sensor/elec.) MGF-out (sensor) PI instrumentsCommon instruments PWI EWO-E/B (+AM2P) MEFISTO-E SORBET MEFISTO (pre/sensor) SC (elec/sensor) IPD [Switcher/ Limiter] MEA2 (sensor/elec.) MIA (sensor/elec.) MSA (sensor/elec.) HEP-ele (sensor/elec.) HEP-i (sensor/elec.) ENA (sensor/elec.) MAST-AC/DC MAST/WPT-E WPT (pre/sensor) (motor/HK) DPU: 10 clients [CPU+MEM] Electrical concept (Old: Jan 2006) 1 Hz sync

BepiColombo/MMO: MDP MMO-SWG #3 [March 2006] -4- Mission Data Processor [MDP-1] Mission Data Processor [MDP-2] PSU [DC/DC Converter] IPD [Switcher/ Limiter] Spacecraft System DPU: 9 clients [CPU+MEM] PSU [DC/DC Converter] MGF-in MDM (elec) Command Telemetry Power Command Telemetry Power MGF-out MEA1 (sensor/elec.) MGF-in (sensor) MDM (sensor) MSASI (sensor/elec.) MGF-out (sensor) PI instrumentsCommon instruments PWI EWO-E/B (+AM2P) MEFISTO-E SORBET MEFISTO (pre/sensor) SC (elec/sensor) IPD [Switcher/ Limiter] MEA2 (sensor/elec.) MIA (sensor/elec.) MSA (sensor/elec.) HEP-ele (sensor/elec.) HEP-i (sensor/elec.) ENA (sensor/elec.) MAST-AC/DC MAST/WPT-E WPT (pre/sensor) (motor/HK) DPU: 10 clients [CPU+MEM] Electrical concept: New (Mar 2006) 1 Hz sync

BepiColombo/MMO: MDP MMO-SWG #3 [March 2006] -5- Mechanical / Thermal MDP Chassis plan (Mar.2006)

BepiColombo/MMO: MDP MMO-SWG #3 [March 2006] -6- MGF-O-E IPD-1 DPU-CPU DPU-I/F IPD-2 MDP-1 PSU 162.5mm(TBD) 25mm(TBD) 179mm(TBD) MDP-2 All: <=A5-size Mechanical / Thermal MDP Chassis plan (Mar.2006) Digital / Power part should be separated & insulated.

BepiColombo/MMO: MDP MMO-SWG #3 [March 2006] -7- MGF-I-E IPD-1 DPU-CPU DPU-I/F IPD-2 SORBET AM2P MEFISTO MAST/WPT-E MDP-2 PSU 30mm(TBD) 25mm(TBD) 334mm(TBD) 162.5mm(TBD) 50mm(TBD) MDP-2 All: <=A5-size Mechanical / Thermal MDP Chassis plan (Mar.2006) Order is free. It will be defined by MHI based on the simplification. Digital / Power part: separated & insulated from PWI/MGF EWO-E-field EWO-B-field

BepiColombo/MMO: MDP MMO-SWG #3 [March 2006] -8- *Action Items in 2006FY 1) Establishment of “MDP-Chassis concept” = “Vertical style” Development & Test of “MDP MTM” & “MDP-STM” in Apr-Sep (No support from each payload team is requested at the moment.) 2) Establishment of “PCB” inside MDP-1 & MDP-2. Following matters will be updated & discussed after the MDP-STM test. - Frame concept - Heat Path concept - Harness & Connector concept Mechanical / Thermal MDP Chassis plan (Mar.2006)