ATLAS Preparations for LHC Phase-I Upgrade G. Darbo – INFN / Genova ATLAS Week, 8 July 2009 o ATLAS Preparations for LHC Phase-I Upgrade ATLAS Week CERN, July 6 th G. Darbo - INFN / Genova Indico AGENDA page:

ATLAS Preparations for LHC Phase-I Upgrade G. Darbo – INFN / Genova ATLAS Week, 8 July IBL Status Project formally started: Project Leader endorsed by CB (Feb 2009) IBL Management Board IBL Kick-off meeting – July 8 th – Interested Institutes leaders invited To converge towards a MoU for the IBL project IBL General Meeting June 25 th & 26 th 42 talks – 2 full day technical discussion Whole project covered including software TDR editor K. Einsweiller is the TDR editor, with Mar Capeans looking at the technical implementation of the document. EB Minutes – 3 April 2009

ATLAS Preparations for LHC Phase-I Upgrade G. Darbo – INFN / Genova ATLAS Week, 8 July IBL Project & Organization The IBL (Insertable B-Layer) is an ATLAS Upgrade project: It will deliver a fourth pixel layer, including a new beam-pipe, to the Inner Detector When delivered, it will become a part of the Pixel Detector and of the Inner Detector and the organization will be “absorbed” into the Pixel & ID The organization structure has: IBL MB: Management Board to execute the project IBL IB: Institute Board, which starts today as an extension of the existing Pixel IB and will be chaired by C, Goessling. Module WG IBL MB (Management Board) IBL MB (Management Board) Stave WG Stave WG I&I WG I&I WG Off-det WG Off-det WG IBL IB (Institute Board) IBL IB (Institute Board) Pixel Institutes in IBL Pixel Institutes in IBL New Institutes in IBL New Institutes in IBL ATLAS UPO ATLAS UPO ATLAS UPGRADE IBL IBL PL IBL TC

ATLAS Preparations for LHC Phase-I Upgrade G. Darbo – INFN / Genova ATLAS Week, 8 July Management Board (MB) Module WG (2 coordinators) FE-I4 Sensors Bump-Bonding Modules Test & QC Irradiation Module WG (2 coordinators) FE-I4 Sensors Bump-Bonding Modules Test & QC Irradiation Stave WG (1 Phys + 1 Eng.) Staves Cooling Design & Stave Thermal Management HDI Internal Services Loaded Stave Test & QC Stave WG (1 Phys + 1 Eng.) Staves Cooling Design & Stave Thermal Management HDI Internal Services Loaded Stave Test & QC IBL Integr.-Install. (2 Eng.) Stave Integration Global Sup. Beam Pipe (BP) Ext.services inst. IBL+BP Installation Cooling Plant Test & QC IBL Integr.-Install. (2 Eng.) Stave Integration Global Sup. Beam Pipe (BP) Ext.services inst. IBL+BP Installation Cooling Plant Test & QC Off-detector (1 Phys + 1 E.Eng.) Power DCS ROD Opto-link Ext.serv.design/proc. Test Beam System Test Off-detector (1 Phys + 1 E.Eng.) Power DCS ROD Opto-link Ext.serv.design/proc. Test Beam System Test IBL Management Board Membership: IBL PL + IBL TC 2 coordinators from each WG Plus “extra” members IBL Management Board Membership: IBL PL + IBL TC 2 coordinators from each WG Plus “extra” members Ad-interim membership IBL Project Leader: G. Darbo IBL Technical Coordinator: H. Pernegger “Module” WG (2 Physicists): F. Hügging & M. Garcia- Sciveres “Stave” WG (1 Phy. + 1 M.E.): O. Rohne + D. Giugni “IBL Assembly & Installation” WG (2 M.E. initially, a Phy. Later): N. Hartman + R. Vuillermet “Off-detector” WG (1 Phy. + 1 E.E.): T. Flick + S. Débieux “Extra” members: Ex officio: Upgrade Coordinator (N. Hessey), PO Chair (M. Nessi), Pixel PL (B. Di Girolamo), ID PL (P. Wells), Pixel Chair (C. Gößling) Offline “liaison” Pixel Off-line coordinator: A. Andreazza TDR editor (temporary): K. Einsweiler

ATLAS Preparations for LHC Phase-I Upgrade G. Darbo – INFN / Genova ATLAS Week, 8 July Ref: N. Hartman: Predominant Stave Layouts Several layouts under study: 14 staves at R min =~3.2 cm Single and double staves – One or two (redundant) cooling channels Inverted Sensor Biturbine

ATLAS Preparations for LHC Phase-I Upgrade G. Darbo – INFN / Genova ATLAS Week, 8 July R. Vuillermet The support carbon tube is fixed in 2 point of PP0 and on PP1 walls on side C and A. The structural pipe with a support system is moved out from the support carbon tube.. The new beam pipe (in any configuration with OD up to 82,5 mm) is inserted from A-side. It has 2 supports at PP0 area and 2 floating wall at PP1 on side A and C. Two global support / installation scenarios: IBL support tube (1) / no tube (2): An IBL support tube would have advantage on stiffness and simplicity/safety for IBL installation, but drawback are envelope needs (~1÷1.5 mm) and increase of radiation length Procedure studied on mock-up at bld procedure (1) animation: The beam pipe flange on A-side is to close to the B-layer envelope - Need to be cut on the aluminum section A structural pipe is inserted inside the Beam Pipe and supported at both sides. The support collar at PP0 A-side is disassembled and extracted with wires at PP1. Beam pipe is extracted from the C-side and it pulls the wire at PP1 New cable supports are inserted inside PST at PP0. A support carbon tube is pushed inside the PST along the structural pipe. Started to setup a 1:1 mock-up of Pixel/beampipe/PP1 in Bat 180 A-side C-side Installation Scenarios

ATLAS Preparations for LHC Phase-I Upgrade G. Darbo – INFN / Genova ATLAS Week, 8 July Requirements for Sensors/Electronics Requirements for IBL IBL design Peak Luminosity = 3x10 34 cm- 2 s -1 Integrated Luminosity seen by IBL = 550 fb -1 Total NIEL dose = 2.4 x ± 30% (σ pp ) ± 50% (damage factor) = 4.7 x n eq /cm 2 Total radiation dose > 200 Mrad Fit made for 2 < r < 20 cm for L=1000fb -1 Gives for 3.7 cm (550 fb -1 ):  1MeV =2.4x10 15 (1.2 MGy) Safety factors not included in the computation (pp event generator: 30%, damage factor for 1 MeV fluences: 50%) Ref. Ian Dawson - AUW

ATLAS Preparations for LHC Phase-I Upgrade G. Darbo – INFN / Genova ATLAS Week, 8 July Module Layout - Convergence Decision between Planar and 3D sensors will be done after TDR Need module prototypes with FE-I4 (second half 2010) Diamonds could be another option Common sensor baseline for engineering and system purposes 3D sensors – single chip modules Planar sensors – 2 chip modules Gap between sensors: 100µm for mechanical / high voltage requirements Maximum operating voltage: 1000 V (need more for planar?) Credits: M.Garcia-Sciveres – F. Hügging

ATLAS Preparations for LHC Phase-I Upgrade G. Darbo – INFN / Genova ATLAS Week, 8 July D Sensors Large collaboration 15 Laboratories and 3 processing facilities Thickness 230±15 m Module type single FE-I4 assembly #electrode2 per 250m Edgeactive 5m Edgesguard 200m Signal (5x10 15 ) ~12500 e - Bias (5x10 15 )~150V Wcm -2 ( 5x10 15 ) 33mW at -10 o C Lorentz angle before irr. free Efficiency (3200 e - ) 96% (0 o ) 99% (15 o ) Wafer dim.4” Expected yield ~50% Bias bump-b and pad FBK & CNM SINTEF/Stanford Credits: C. Da Via on behalh of ATLAS 3D Sensor R&D

ATLAS Preparations for LHC Phase-I Upgrade G. Darbo – INFN / Genova ATLAS Week, 8 July Planar Sensor Planar sensor R&D approved by sLHC USG 16 Institutions High dose (also for IBL) Low cost – large sLHC N-on-n & n-on-p For IBL: improve radiation hardening Slim edge (no overlap in Z) Optimize guard-ring vs. Vbias

ATLAS Preparations for LHC Phase-I Upgrade G. Darbo – INFN / Genova ATLAS Week, 8 July Planar Sensors – Slim Edge

ATLAS Preparations for LHC Phase-I Upgrade G. Darbo – INFN / Genova ATLAS Week, 8 July D & Planar – Test Beam (June ‘09) Comparison of 3D and Planar Test beam with magnetic field Planar sensors are sensitive to Lorentz angle: maximize charge at incidence angle = Lorentz angle 3D (electric field parallel to sensor surface) are not. Active edge: ~5 to ~10 µm from edge (see picture at the right) 3D FBK ToT at 15 o 3200e - planar

ATLAS Preparations for LHC Phase-I Upgrade G. Darbo – INFN / Genova ATLAS Week, 8 July Frontend Chip - FE-I4 7.6mm 8mmactive 2.8mm FE-I3 74% active 16.8mm 20.2mm ~2mm ~200 μ m FE-I4 ~89% Chartered reticule (24 x 32) IBM reticule ~19 mm New FE-I4 Pixel size = 250 x 50 µm 2 Pixels = 80 x 336 Technology = 0.13µm Power = 0.5 W/cm 2 FE-I3 Largest Chip in HEP

ATLAS Preparations for LHC Phase-I Upgrade G. Darbo – INFN / Genova ATLAS Week, 8 July FE-I4 Status Prototype blocks in MPW (MOSIS) submitted 3/2008, measurements, irradiation Design review (3/2009): “Design Technical Issues” on full scale design FE-I4 Design Collaboration Meeting - Bonn July 1 st and 2 nd 2009 Very successful to finalize technical details needed for full design integration Target date for having complete chip layout done is still September 09 The technical schedule for each circuit block delivery is being updated Many interfaces have been finalized and documentation of the details is under way Internal communication between circuit blocks data output format headers, configuration read-back, etc. Partitioning of power "planes" and power-up sequence Pinout (being updated)

ATLAS Preparations for LHC Phase-I Upgrade G. Darbo – INFN / Genova ATLAS Week, 8 July FE-I4 Pixel Cell Layout

ATLAS Preparations for LHC Phase-I Upgrade G. Darbo – INFN / Genova ATLAS Week, 8 July Cooling: CO 2 or C 3 F 8 IBL cooling P total =1.5kW Prototyping CO 2 and C 3 F 8 cooling system in cooperation with ATLAS CERN cooling groups and NIKHEF Prototype staves and cooling pipes/heater assemblies ready to start measurements on heat transfer coefficient and thermal performance of stave Pipe material plays important role in thermal gradient: figure of merit is between 16.5  C.cm 2 /W (CF) and 2.4  C.cm 2 /W (Ti), Ti therefore allows for higher sensor power before thermal run- away Choice of coolant influences pipe diameter (CO 2 : ~1.6mm, C3F8 ~3mm) and minimal evaporation temperature (C 3 F 8 min T evap =-30  C, CO2 min T evap = - 45  C) Want redundancy (2 pipes) to avoid this significant “single point failure” in case of leak/blockage of one pipe Very preliminary & conservative material breakdown for different options: Credits: D. Giugni, P. Schwemling, H. Pernegger

ATLAS Preparations for LHC Phase-I Upgrade G. Darbo – INFN / Genova ATLAS Week, 8 July When is IBL Ready to Install? Difficult answer…: In February (AUW) we have been told that the installation date was delayed by one year End of > end to 2013 Today we feel that the 2013 is optimistic Earliest starting date for Phase I is the 2013/2014 shutdown. The availability of LINAC4 (around 2014) will define the shutdown for Phase I, upgrade, when the IBL would be installed. The Upgrade Project Office (May 12 th ) suggests to use 2014/2015 as a guideline for the IBL installation date. We are now working with a schedule that foresee an installation date in 2014/2015 Need to agree with LHC machine on Phase I date -> LHCC The FE-I4 and Sensor/Module are on the critical path, and installing earlier than 2014/2015 would require some compromises in the performance.

ATLAS Preparations for LHC Phase-I Upgrade G. Darbo – INFN / Genova ATLAS Week, 8 July FEI4 drives the schedule for modules -getting the next FEI4 asap is crucial for module qualification Stave 0 plays a crucial to qualify the IBL system (mechanics, staves and off detector electronics) Service installation happens in shutdowns - need definition & procurement of services (USA15->PP2) early on to use shutdown time efficiently Commissioning as part of Pixel system Credits: H. Pernegger

ATLAS Preparations for LHC Phase-I Upgrade G. Darbo – INFN / Genova ATLAS Week, 8 July IBL Software - Migration to Athena/G4 Attilio Andreazza coordinating the activities - mailing list for IBL software development Implement IBL in the existing ATLAS software framework Detector simulation based on Geant 4 Keep up with material updates in the ID and surroundings Use existing ATLAS track reconstruction algorithms Use existing b ‐ tagging algorithms Meeting end of July to discuss progress: G4 geometry implementation (Dmitri Tsybychev) Implementation of different digitizations (Vadim Kostyukhin) Simulation of radiation damage (from current pixel community) Define benchmarks for TDR

ATLAS Preparations for LHC Phase-I Upgrade G. Darbo – INFN / Genova ATLAS Week, 8 July sLHC Phase I Work has started within Level-1 to revisit the performance of current L1 algorithms at and extend to 3x10 34 Understand the benefits of topological information Hardware changes necessary to propagate/use the topological info L1Calo and L1Muon to understand together how L1Calo info can be propagated to L1Muon for muon isolation purposes the max latency available to work within FTK is a hardware track reconstruction system It would work on L1A events and produce tracks in the whole InDet (not RoIs) within 10s of µs to be used by L2 (tracking performance similar to L2) Work has been hampered by difficulty in producing sizable simulation datasets at Asked to explore How FTK deals with 3x10 34 (needs simulation) How FTK can incorporate the IBL How the FTK compares with expanding the L2 farm Planning to submit a TDR by end 2009

ATLAS Preparations for LHC Phase-I Upgrade G. Darbo – INFN / Genova ATLAS Week, 8 July sLHC Phase I Muon detector has large uncertainty (factor 5) on cavern background: Possible performance degradation in the very forward region 2.0<  <2.7 (CSC region) Original Muon Spectrometer Design with 2 layers of CSC (8 precision measurements) but currently only one layer installed. Study the possibility to reinforce the CSC region by inserting a thin (50 mm) detectors to provide more measuring points and possibly pad read-out Current Options: TGC MicroMegas ThinTubes MDT

ATLAS Preparations for LHC Phase-I Upgrade G. Darbo – INFN / Genova ATLAS Week, 8 July BACKUP SLIDES

ATLAS Preparations for LHC Phase-I Upgrade G. Darbo – INFN / Genova ATLAS Week, 8 July New Beam Pipe From Ray’s presentation to PO 10/6 Need beam pipe ready for integration in SR1 1 year before IBL installation Beam pipe production ARO long (2 years at manufacturer + 8mo for preparation at Cern ??? - To be verified) 2009: Aim to have full technical drawing of beam pipe by end of this year (flanges,..) Important: Need to make official request to Beam Pipe group now Start market survey 25mm radius compatible with aperture and mechanics Open question to validate this number larger TAS, smaller VI Machine induced background Impedance requirement & Vacuum

ATLAS Preparations for LHC Phase-I Upgrade G. Darbo – INFN / Genova ATLAS Week, 8 July IBL kick-off Meeting – Draft Agenda 9:00 – Introduction – G.Darbo (20 min) What is IBL project – first project in the upgrade phase I – deliver a 4th layer for the pixel detector – model of resources Scope of the meeting 9:30 – Technical Presentation of IBL project - H. Pernegger (30 min) Where exists a technical baseline Where are open technical options and what are the planned steps for a convergence Where technical solutions have not discussed or are very little developed Manpower figure 10:15 Coffee Break 10:45 Project Cost – G. Darbo (20 min) 11:15 Round table – “Wishes and Interest of Institutes” – Chair C. Gößling 12:45 Lunch 14:15 Sharing of Work – “Interactive Session” G.Darbo, C. Gößling Fill online a table with work sharing – “the big picture” Keep note of inputs from round table 16:45 Coffee Break 17:15 Memorandum of Understanding – M.Nordberg What should be inside – look at ATLAS construction MoU How to map “the big picture” into the MoU 18:00 End of the meeting

ATLAS Preparations for LHC Phase-I Upgrade G. Darbo – INFN / Genova ATLAS Week, 8 July MB & WG Operation IBL organization is starting up: Management Board (IBL MB) Weekly meeting on Monday – closed meeting – issues tracking The 4 Working groups (WG) cover the whole project: WG1 – Module WG2 – Stave WG3 – Integration & Installation WG4 – Off-detector Mailing lists – open subscription to ATLAS active members IBL General: WG1: (alias WG2: (alias (it was the WG3: (alias WG4: (alias To subscribe:

ATLAS Preparations for LHC Phase-I Upgrade G. Darbo – INFN / Genova ATLAS Week, 8 July Collaborative Workspace

ATLAS Preparations for LHC Phase-I Upgrade G. Darbo – INFN / Genova ATLAS Week, 8 July IBL Cost Total cost 9.6 MCH: Use this cost to “shape the project” – revise when better understanding of the design (TDR) Funding Model: M&O-A, M&O-B, New project money