A Presentation on “OUM “ “(OVONIC UNIFIED MEMORY)” Submitted by: Aakash Singh Chauhan (CS 05101)

Slides:



Advertisements
Similar presentations
Principles & Applications
Advertisements

Display Systems and photosensors (Part 2)
September 18, A device for storing and retrieving digital information It consists of one or more rigid ("hard") rapidly rotating discs (platters)
FERROELECTRIC RAM.
The Periodic Table.
Integrated Circuits (ICs)
Basic Electricity and Electronics Mr. McClean Concepts of Engineering and Technology Copyright © Texas Education Agency, All rights reserved.
Semiconductor Memories ECE423 Xiang Yu RAM vs. ROM  Volatile  RAM (random access) SRAM (static) SRAM (static) SynchronousSynchronous AsynchronousAsynchronous.
LIQUIDS AND SOLIDS. LIQUIDS: Why are they the least common state of matter? 1. Liquids and K.M.T.  Are particles in constant motion? Spacing? Kinetic.
Solidification and Grain Size Strengthening
MSIS 110: Introduction to Computers; Instructor: S. Mathiyalakan1 Hardware: Input, Processing, and Output Devices Chapter 3.
Applications. Until very recently silicate glasses were the only type of materials commonly used. Until very recently silicate glasses were the only type.
Chapter 4 States of Matter.
Surface micromachining
Distinguish between primary and secondary storage.
The Periodic Table of Elements
Presented by Anas Mazady, Cameron Fulton, Nicholas Williams University of Connecticut Department of Electrical and Computer Engineering Thursday, April.
Materials One of the main priorities of CAMELS is the optimization of the chalcogenide material. The PCM operation and reliability are in fact dictated.
1. Crystal Properties and Growth of Semiconductors
Ovonic Unified Memory.
Phase change memory technology Rob Wolters September 2008.
Principles of Information Systems, Sixth Edition Hardware: Input, Processing, and Output Devices Chapter 3.
Aim: How can we compare metals, non-metals, and metalloids?
General Licensing Class Oscillators & Components Your organization and dates here.
This is. Jeopardy Atomic Science Properties of Matter How Atoms Combine Phase Changes Mixtures and Solutions Mr. Schmidt’s Brain Capture the Chapter.
NOTE: To change the image on this slide, select the picture and delete it. Then click the Pictures icon in the placeholder to insert your own image. NON.
Chapter 12 – Solids and Modern Materials 11
Overview of Physical Storage Media
Chapter 2 part 2. Computer Processing Speeds Milliseconds - thousands of a second Microseconds - millionths of a second Nanoseconds - billionths of a.
+ CS 325: CS Hardware and Software Organization and Architecture Memory Organization.
Matter and Atomic Structure Section 3.3- State of Matter
Liquids & Solids. Objectives 12-1 describe the motion of particles of a liquid and the properties of a liquid using KMT define and discuss vaporization.
Ch. 4 Vocabulary – States of Matter
Welding Inspection and Metallurgy
Principles of Information Systems, Sixth Edition Hardware: Input, Processing, and Output Devices Chapter 3.
OVONIC UNIFIED MEMORY Submitted by Submitted by Kirthi K Raman Kirthi K Raman 4PA06EC044 4PA06EC044 Under the guidance of Under the guidance of Prof. John.
GPS Standards S8P1. Students will examine the scientific view of the nature of matter. C. Describe the movements of particles in solids, liquids, gases,
Storage devices 1. Storage Storage device : stores data and programs permanently its retained after the power is turned off. The most common type of storage.
1 KU College of Engineering Elec 204: Digital Systems Design Lecture 22 Memory Definitions Memory ─ A collection of storage cells together with the necessary.
Submitted To: Presented By : Dr R S Meena Shailendra Kumar Singh Mr Pankaj Shukla C.R. No : 07/126 Final B. Tech. (ECE) University College Of Engineering,
Pengantar Multimedia.  Primary (accessible by CPU, volatile ex ROM) Registers Cache Main Memory ROM (Read Only Memory, but not so)
Personal Computers… …And Their Internal Parts. Table of Contents 1.Motherboard 2.Central Processing Unit (CPU) 3.Power Supply 4.Controller Boards 5.Chipset.
Active Disassembly. Self Disassembly Electronics Labour for disassembly represents a large fraction of recycling electronics Products that can non-destructively.
Battery Models. EMF and voltage What is EMF? – Electro Motive Force What is the difference between EMF and battery voltage? – The battery has internal.
Engr: Sajida Introduction to computing Optical storage The storage devices which use laser to read data from or write data to the reflective surface store.
Magnetic RAM Magnetoresistive Random Access Memory.
MIT Amorphous Materials 4: Phase Change Data Storage Juejun (JJ) Hu 1.
Kintetic Molecular Theory
FERROELECTRIC RAM [FRAM]
Processing Device and Storage Devices
Kintetic Molecular Theory
Welcome Welcome Welcome Welcome Welcome Welcome Welcome Welcome
Welcome.
Information Storage and Spintronics 13
Conventional Silicon Computers Ovonic Cognitive Computer
COMPUTERS IN CRISIS Computers have not changed their basic approach since the beginning (von Neumann binary) Conventional computers are commodity items.
BIC 10503: COMPUTER ARCHITECTURE
PHYSICAL PROPERTIES OF MATERIALS
States of Matter Standard: Students know that in solids, the atoms are closely locked in position and can only vibrate. In liquids the atoms and molecules.
European Conference on Phase Change and Ovonic Science
The Ovonic Cognitive Computer A New Paradigm
MIT Amorphous Materials 4: Phase Change Data Storage
Computer Organization & Architecture 3416
Energy Conversion Devices, Inc.
A review of recent phase change memory developments
Ovonic Cognitive Computer, LLC formed 9/26/2002
States of Matter.
Information Storage and Spintronics 08
Information Storage and Spintronics 11
Matter & Change Chapter 1 Pages
Presentation transcript:

A Presentation on “OUM “ “(OVONIC UNIFIED MEMORY)” Submitted by: Aakash Singh Chauhan (CS 05101)

Memory-information retention Various forms of storage are: o Primary storage o Secondary and off-line storage o Tertiary and database storage o Network storage Characteristics of storage are: o Volatility of information o Ability to access non-contiguous information o Ability to change information Classification of the Memory on the bases of Volatility of information is: o Volatile Memory Non-volatile Memory

Nonvolatile Memory Protection of data in the event of power loss Periodic refreshing Modern Approaches of Nonvolatile Memory FRAM: Technique used- ferroelectricity MRAM: Technique used-ferromagnetism OUM: Technique used- phase changes in the thin-film 3DM: Technique used- multiple layers of active circuitry on the silicon substrate

Comparison of Technologies A AAKASH

Phase Change Memory Technology o Describes a class of non-volatile memory devices o Exploits differences in the electrical resistivity of a material in different phases (solid, liquid, gas, condensate and plasma) Graphical representation of a basic PCM storage element A AAKASH

Relative to the amorphous state, the polycrystalline state shows a dramatic increase in free electron density, similar to a metal. A AAKASH

OUM Ovonic Unified Memory

OUM Definition: o Phase Change Memory o Changes the state o stores information o excellent solid-state memory properties. Ovonyx o microelectronics memory technology o developed by Mr. Stanford Ovshinsky o Energy Conversion Devices (ECD) Inc. Ovonic unified memory – o derived from ''Ovshinsky'' and ''electronic''. o known as phase change memory OUM allows the rewriting of CD & DVDs.

Characteristics of OUM Essentially nondestructive use: Can be read and write to trillionths of times The OUM solid-state memory o Has cost advantages over conventional solid-state memories o very small active storage media, and simple device structure. o OUM requires fewer steps in an IC manufacturing process resulting in :  reduced cycle times,  fewer defects, and  greater manufacturing flexibility. A AAKASH

Chalogenide The PCM technology being developed by Intel uses a class of materials known as chalcogenides (“kal-koj--uh-nyde”). Basically, chalogenide alloy materials use one or more elements from column VI of the Periodic Table. OUM devices use an alloy system of GeSbTe (Germanium-Antimony-Tellurium). Chalcogenides are alloys that contain an element in the Oxygen/Sulphur family of the Periodic Table (Group 16 in the new style or Group VIa in the old style Periodic Table). A AAKASH

OUM Devices use the GeSbTe alloy system. Crystal Structures for GeSbTe Pseudobinary Alloys:

Working Phase change memory also called ovonic unified memory (OUM), Phase states are programmed by the application of a current pulse through a Mosfet, heating a small volume of the material with a current pulse to make the transition.

thermally activated, rapid, reversible change chalcogenide alloy are an amorphous state and a polycrystalline state. polycrystalline state :dramatic increase in free electron density, similar to a metal.

Depending upon the temperature profile applied,

Attributes of OUM o Non volatile in nature o High density ensures large storage of data within a small area o Non destructive read:-ensures that the data is not corrupted during a read cycle. o Uses very low voltage and power from a single source. o Write/erase cycles of 10e12 are demonstrated o Poly crystalline o This technology offers the potential of easy addition of non volatile memory to a standard cmos process. o This is a highly scalable memory Low cost implementation is expected. A AAKASH

Architecture of OUM resistance change is very large-more than a factor of 100. Thermal insulators are also attached to the memory structure in order to avoid data loss due to destruction of material at high temperatures. To write data into the cell, the chalcogenide is heated past its melting point and then rapidly cooled to make it amorphous. To make it crystalline, it is heated to just below its melting point and held there for approximately 50ns, giving the atoms time to position themselves in their crystal locations. A AAKASH

Ovonic materials The chalcogenide glasses (especially those based on Ge, Sb and Te) are key materials o for the electrical switches, o for erasable optical storage. The ground ovonic material is Ge15Te81S2Sb2. This is a memory material. o It isanalogous of Ge15Te85 o it represents a eutectic composition in the binary system Te-Ge (eutectic temp. 375 oC). o Addition of S and Sb changes the crystallization speed when the material is heated in the glassy state. A AAKASH

Data storage mechanism Devices store information through changes in their atomic structures Materials which are multi-element chalcogenide alloys o exist in a stable fashion in amorphous and crystalline structures, and o also in a range of “intermediate” structural states. o These different atomic structures have o different characteristic physical properties, o including different values of electrical conductivity. The ability of a memory device to be programmed to stable intermediate structures allows: storage of multiple bits of information in each memory cell location, A AAKASH

Advantages of OUM reversible structural phase change. Small active storage medium. Simple manufacturing process. Simple planar device structure. Low voltage single supply. Reduced assembly and test costs. Highly scalable- performance Multistates. High temperature resistance. base technology is not affected.

Problems/Concerns of OUM OUM devices as devices decrease in size as the devices are scaled to smaller sizes, reducing programming current for lower voltage and lower power operation.

Application stored as a structural phase impervious to ionizing radiation effects. tolerance of the chalcogenide material A radiation hardened semiconductor technology OUM allows the rewriting of CD & DVDs OUM has direct applications o computers, o cell phones, o graphics-3D rendering, o GPS, o video conferencing, o multi-media, o Internet networking and interfacing, o digital TV, o telecom, o PDA, o digital voice recorders, o modems, o DVD, o networking (ATM), o Ethernet, and pagers. OUM offers a way to realize full system-on-a-chip

Thank You!