, T. Tischler, CBM Collaboration Meeting, Split Status MVD Demonstrator: System Integration T.Tischler, S. Amar-Youcef, M. Deveaux, D. Doering, J. Heuser, I. Fröhlich, J. Michel, C. Müntz, C.Schrader, S. Seddiki, J. Stroth, C. Trageser and B. Wiedemann

, T. Tischler, CBM Collaboration Meeting, Split Status MVD Demonstrator: Mechanics & Integration Outline:  MVD Demonstrator  Design  Material overview  Mechanical support  Bonding and DemoAux-Board  Demonstrator in the Lab  Demonstrator for the Beam test  Summary and Outlook Demonstrator Prototype Final MVD

, T. Tischler, CBM Collaboration Meeting, Split MVD Demonstrator: Design 2x MIMOSA-20 Sensors ZIF connector Flex-rigid R/O Demo-Aux board Liquid cooled Cu heat sink TPG/RVC/TPG sandwich Flexprint Cable

, T. Tischler, CBM Collaboration Meeting, Split MVD Demonstrator: Material overview MIMOSA x 640 pixels - 30 µm pixel pitch µm thickness - ~ 2 ms time resolution - ~ 2 cm² active surface - 2 serial analogue outputs - Differential output lines FlexPrint Cable - 36 µm copper in 3 layers - minimized set of lines for 2 MIMOSA-20 - individiual readout for two sensors with one cable - 60 pads for chip bonding % X 0

, T. Tischler, CBM Collaboration Meeting, Split MVD Demonstrator: Mechanical support – setting up Structure of the support: TPG (Thermal Pyrolytic Graphite) ultra high heat conduction ( 1500 W/mK in two dimensions = 4x value of copper ) RVC (Reticulated Vitreous Carbon foam) ultra light and stiff material Thickness [μm] 1xSplicing tape glue 35 ± 5 2xTPG (C)‏ 500 ± 10 2xLiquid glue 100 ± 20 1xRVC (C foam)‏ 3000 ± 100 Sum 4235 ± 102 2x Currently 0.6 % X 0 plus sensors TPG RVC Glue Currently : schematic view: Glue: 2-component Araldite 2011 Huntsman

, T. Tischler, CBM Collaboration Meeting, Split MVD Demonstrator: Mechanical support – setting up Glueing TPG to RVC, TPG-RVC to TPG. Accurate knowledge of the thickness and surface is needed. Several thickness measurements were accomplished. Measurements were used to select good samples for the support needed.

, T. Tischler, CBM Collaboration Meeting, Split MVD Demonstrator: Mechanical support – setting up Comparisons between TPG-RVC-TPG plate surface before and after cutting out the “stripe” were done. Cutting does not trigger relevant effects on the surface in terms of damage or bending. Cutted “stripes” ready for bending and cooling tests as well as for integration into experimental setup. before cutting after cutting Area without chips fittet radius mm

, T. Tischler, CBM Collaboration Meeting, Split MVD Demonstrator: Mechanical support – bending schematic view: No load ??? g / kg Load range 10 – 100 gramms Bending tests with the support (Sandwich) and 1mm TPG (for comparison) were arranged to gain knowledge on the maximum load which can be handled by the support without lasting damages. In addition a value for the Young Modulus was calculated based on measured data. TPG gauge

, T. Tischler, CBM Collaboration Meeting, Split MVD Demonstrator: Mechanical support – bending manufacture specification for TPG Fit pol0 => 550Fit pol0 => 61233

, T. Tischler, CBM Collaboration Meeting, Split MVD Demonstrator: Mechanical support – vibration With the measured effective Youngs Modulus it is possible to calculate the vibration modes of the Sandwich. The knowledge of the vibration modes of the support is important to be sure that vibration modes due to the vacuum pumps will have no effect on our Support ( microphony). The first five modes are Mode k Frequency [kHz] To be compared with vacuum pumps and liquid cooling

, T. Tischler, CBM Collaboration Meeting, Split MVD Demonstrator: Bonding and DemoAux-Board Chips were bonded to the FPC and connected to the DemoAux-Board for testing the whole readout chain. Data transfer to PC for storage and analysis Bonding support MIMOSA20 sensors FPC

, T. Tischler, CBM Collaboration Meeting, Split MVD Demonstrator: in the Lab Demonstrator in Lab ( in PVC-Box ) for first series of test mesurements. Allows  readout of maximal 2 MIMOSA20 senors through FPC and DemoAux-Board  readout with a Fe55 source  readout with a running cooling system  search for the best calibration of the MIMOSA20 sensors  tests related to the heat conductivity of the whole Demonstrator  temperature monitoring DemoAux FPC sensors Sandwich cooling schematic view:

, T. Tischler, CBM Collaboration Meeting, Split sensors glue TPG copper RVC Cooling system - 40 °C - 20 °C glue MVD Demonstrator: in the Lab Cooling transport through the Demonstrator - 10,3 °Cwith running sensors - 12,6 °Cwithout running sensors Measured temperatures within the PVC-Box show no big differences on the TPG with and without running sensors. Nevertheless temperature transport between cooling system and the copper support as well as between the TPG and the copper support has to be improved further. All measurements in the PVC-Box were taken under normal pressure.

, T. Tischler, CBM Collaboration Meeting, Split MVD Demonstrator: for the beam test Beam CERN, 120 GeV Pions, together IPHC Strasbourg from November the 5 th till the 13 th. Using their beam telescope TAPI, which is equipped with 2 Scintillators, one left, one right, for trigger 4 MIMOSA18 planes, two left, two right, for reference measurements variable keep in volume ( 75 to 105 mm ) in the middle for the DUT. Intention for the beam test is testing the full Demonstrator including mechanics, electronics and analysis with a moveable structure in plane orthogonal to the beam axis, which is electrically isolated and operates under normal pressure.

, T. Tischler, CBM Collaboration Meeting, Split MVD Demonstrator: for the beam test Two mechanical setups are constructed, one with single sided readout for two MIMOSA20 sensors one with double sided readout for four MIMOSA20 sensors Assembled are two Aluminium frames for holding and cooling the Demonstrator. In addtion two cases are build to minimize condensation and to open the possibility of N 2 -flow. Autodesk Inventor 10 Double sided Single sided

, T. Tischler, CBM Collaboration Meeting, Split MVD Demonstrator: for the beam test From the CAD-model to a real support structure for the beam test:

, T. Tischler, CBM Collaboration Meeting, Split Summary and Outlook Summary: Global design of the MVD Demonstrator adapted for the test in the Lab. Mechanical support was build and tested focused on material characterisation and quality checks. Tests in the Lab under controlled environment show promising results e.g. in respect to noise. Global design was changed due to given constrains for the beam test. For the upcoming beam test an one sided and a double sided version were constructed and build. Outlook: This phase: building the MVD Demonstrator will be concluded with a hopefully successful beam test. ( Demonstrator++ versions under debate with improved support (CVD), different sensors, optimized FPC )