PMS-003-05-01 Preservation: 1 Year Laser Trim Information Project Name : UP228 Revision: A RD Dept. 2011.06.13.

Slides:



Advertisements
Similar presentations
Oct G. R. Omidi Isfahan University of Technology and IPM.
Advertisements

3 Title Blocks and Part Lists Permission granted to reproduce for educational use only. Describe drawing sheet sizes and formats Identify marginal information.
Hi Repetition Rate MOPA Based Fibre Laser for Micro Machining Applications Bill O’Neill Centre of Industrial Photonics Institute for Manufacturing University.
Z x 725 Sensor Mark 140 x Sensor Coordinates Bump Bond Pad Ø = 12/ FE PAD#2 110 x 210 LM Structure FE Chip Coordinates Bump.
ASE Flip-Chip Build-up Substrate Design Rules
Taegee Co., Ltd. Samheung Bldg Yeoksam-Dong Gangnam-Gu Seoul, Korea Tel: Fax: ) Customer.
Title No. : Company : Contestant :. 2 Content >Contestant Introduction >Company & Product Introduction >Product and Mold Development Process >Product.
Define your customer for this design: (Age, Demographic, Income Level, Activity) ___________________________________________ ___________________________________________.
Permutations and Inverses. Definition Let A be a set. If f : A  A is a 1-1 correspondence then f is called a permutation of A. Notation: S(A): the set.
Name Event Date Name Event Date 1 Animation Effects.
Multiple current exposure without mark detection Possible? Tolerance? Using only the 4 th lens: –1 st exposure: 0.1nA, 2 nd aperture (min. current) –2.
Introduction Purpose To introduce and familiarize Susumu thin film chip resistors Objectives Basic difference between thin film and thick film resistors.
Reporting Aesthetics An ACEware Webinar 1:00-2:00 pm February 14 th, 2008.
Measures of Central Tendency U. K. BAJPAI K. V. PITAMPURA.
Embedded Pitch Adapters a high-yield interconnection solution for strip sensors M. Ullán, C. Fleta, X. Fernández-Tejero, V. Benítez CNM (Barcelona)
Measures of Central Tendency Jan Sands 2007 Mean, Median, Mode, Range.
Recursive Functions, Iterates, and Finite Differences By: Jeffrey Bivin Lake Zurich High School Last Updated: May 21, 2008.
TPAC progress Jamie C 29 th July TPAC1.1 Status Submitted 17 th –Some minor DRC errors found at foundry –Corrected/waived Re-Submitted 23 rd July.
1 The 3-rd Work Meeting of the CBM -MPD STS Consortium “Technical challenges of the CBM and MPD Silicon Tracking Systems 2009” THE CABLES FOR THE CABLES.
© 2005 The McGraw-Hill Companies, Inc. College Writing Skills, 6E and College Writing Skills with Readings, 6E John Langan Writing a Summary Chapter Eighteen.
Wall Frames 2 M. S. Martin Feb Click mouse to bring in each point or item until complete.
Ch 8.5 (part 2) Factoring ax 2 + bx + c using the Grouping method Objective: To factor polynomials when a ≠ 1.
Fabrication Technology(1)
15.3 Fourier Integral. Fourier Integral In ch 12, f(x) defined in (-p,p) f(x)= FS(x) Fourier Series (periodic function) In 15.3, f(x) defined in (-infinity,
Norhayati Soin 05 KEEE 4426 WEEK 12/1 3/13/2005 KEEE 4426 WEEK 12 CMOS FABRICATION PROCESS.
KOBALT UNIVERSAL JSP DATE: 10/09/2014 CONFIDENTIAL.
Informal Description f(x) is continuous at x=c if and only if there are no holes, jumps, skips or gaps in the graph of f(x) at c.
Relations and Functions Intermediate Algebra II Section 2.1.
Layers of the Earth Brittany Vargo Kelly Swindler Kara Eckes.
NOTE: REFERENCE PROJECT MANUAL DATED 1/20/14 FOR THE BALANCE OF PROJECT REQUIREMENTS & SPECIFICATIONS (THIS NOTE APPLIES TO ALL PHOTO SHEETS). PHOTO. NO.DATE:
pictures_slideshow/article.htm.
Metal Cutting Manufacturing Processes. Outline Metal Cutting Chip Formation Processes ControlConditions Back rake angle Shear angle Chip Formation Continuous.
-Dinesh Somasekhar, Shih-Lien Lu, Bradley Bloechel, Greg Dermer, Konrad Lai, Shekhar Borkar and Vivek De Solid-State Circuits Conference, ESSCIRC.
Foldie-do for Inverses Fold your paper over (top to bottom leaving about an inch at the bottom). f  1 (x) © 2010, Dr. Jennifer L. Bell, LaGrange High.
ASE ASE Flip-Chip Laminate Substrate Design ASE Flip-Chip Laminate Substrate Design Date : 07/15/03 Rev. H.
Approving a Proxy account. Login to Skylite with your fis account Then mouse down until you get to approve and hit enter.
Tensky International Co.,Ltd. Founded : March.2007 Factory Area : m 2 Address : No.1,Lane 137,Sec 3,Jhongshan RD,Hukou Township,Hsinchu County 303,Taiwan(R.O.C)Office:No.135,
Date of download: 10/5/2017 Copyright © ASME. All rights reserved.
European Robotic LABoratory
Sensor Wafer: Final Layout
Insert using Linear Hashing
What Are Preservatives And Additives.
. - t !!l t. - 1f1f J - /\/\ - ' I __.
Warm-Up . 4. Find the average and standard deviation of the following data set: 12, 13, 14 20, 25, 25, 32,27 5. Draw the normal for question 2   6. Use.
قراءة القوائم المالية وفـاء شـريف علي. محلل مالي
Manufacturing Processes
WESLEYAN P-3-1 MAJOR MAINTENANCE FY PINE STREET
Layer Thickness and Map Width
How is sound captured for a CD
Table 1. Label in 24pt Times New Roman.
Find the linearization L(x, y) of the function at the given point
By Ms. Krauser’s 3rd Grade
Warm-up Write the equations of the following graphs
Piecewise Functions.
2.5 Piecewise Functions.
2.5 Piecewise Functions.
.. '.. ' 'i.., \. J'.....,....., ,., ,,.. '"'". ' · · f.. -··-·· '.,.. \...,., '.··.. ! f.f.
LPKF Laser Direct Structuring System
Orthographic Sketch Solution
90-day Action Plan Template
This means that (a + b)2 = a2+ 2ab + b2.
Piecewise Functions.
Spores of strain ATCC 9714 imaged by SEM (A), cryo-EM (B), and 3D-SIM (C and D) with spores labeled with lipid dyes DiO and FM 4-64FX (C) or DiO and spore-specific.
By; Justin Rayle Mark Meyers
Which is not an asymptote of the function
Thing / Person:____________________ Dates:_________________
ARMT Item Specifications
ARMT Item Specifications
Lecture 4 What are Codes? (Section 1.2)
Building pattern  Complete the following tables and write the rule 
Presentation transcript:

PMS Preservation: 1 Year Laser Trim Information Project Name : UP228 Revision: A RD Dept

PMS Preservation: 1 Year Laser Trim Information Project Name : UP228 Revision: A Applied by: YC_Wang Date:2011/06/13 Approved by: Date:

PMS Preservation: 1 Year Contents  Die size, Scribe line definition 755μm × 1000μm Including Scribe Line  L mark coordinates  L mark & Fuse information  L mark width = __10__ uM  L metal layer: __3__with 2um thickness top metal  Metal metal layer: _2__  Trim items and bit arrangement  Fuse coordinates

PMS Preservation: 1 Year Die size, Scribe line definition Notch Chip size : 755μm × 1000μm Including Scribe Line

PMS Preservation: 1 Year Die size, Scribe line definition (1430,920 ) (675,920 ) (0, 0)

PMS Preservation: 1 Year L mark & Fuse information & L mark coordinates (715,865) 80um (695,885)Top

PMS Preservation: 1 Year L mark & Fuse information & L mark coordinates (695, 35) 80um Bottom (715,55)

PMS Preservation: 1 Year Trim items and bit arrangement & Fuse coordinates FIXV (F) 12 fuses Vfb (V) 8 fuses Isource (I) 5 fuses Lgsen (N) 4 fuses Mode (M) 4 fuses osc (F) 5 fuses Fuse X Y FX FX FX FX FX FX FX FX FX FX FX FX FM FM FM FM FM FM FM FV FV FV FV FV FV FV FV FF FF FF FF FF FI FI FI FI FI FN FN FN FN Attention : discontinue ( 不連續 )