Cyber-Physical Systems in EU Programmes ARTEMIS-IA Brokerage Event, Amsterdam, NL January Werner Steinhoegl Complex Systems & Advanced Computing European Commission - DG CONNECT – A3
Outline 1.Introduction 2.Achievements 3.The Future – What is planned? 4.ECSEL calls: Observations/Hints 2
Electronic Components and Systems: Innovation boosters for Products and Services 3
Europe in the ECS value chain 4
Three dimensions of digital industrial value creation 5 1.Products with "ICT inside" Smart anything everywhere in our products and services Infinite opportunities for product innovation 2.Digital transformation of processes Next generation of production systems are digital: From logistics and product design to shop floor automations and CRM Build on CPS/IoT, digital design, robotics, big data Increased resource efficiency and productivity – need for re-skilling Re-shoring: move production close to customer 3.Radical/disruptive changes in business models Blurring the boundaries between products and services Reshuffling value chains
What needs to be done? 1.Wide-spread adoption and best use of digital technologies across industrial sectors 2.Leadership in digital platforms for industry 3.Filling the skills gap and preparing the workforce for change 4.Providing the best framework conditions for attracting private investment in industry in Europe 1.Wide-spread adoption and best use of digital technologies across industrial sectors 2.Leadership in digital platforms for industry 3.Filling the skills gap and preparing the workforce for change 4.Providing the best framework conditions for attracting private investment in industry in Europe 6
Benefits of Partnerships - ICT Joint Technology Initiatives ECSEL (Electronic Components and Systems for European Leadership) 1,215 b€ from EU (250m€ in ) 3,6 b€ (out of which 1,2 b€ from Member States) from industry partners and other sources Contractual PPPs 5G 700m€ indicatively earmarked in H2020 (125m€ in WP ) Photonics 700m€ (156m€ in WP ) Robotics 700m€ (157m€ in WP ) High Performance Computing 700m€ (157m€ in WP ) Factories of the Future (ICT part) 450m€ (102m€ in WP ) Green Vehicles (ICT part) 80m€ (20m€ in WP ) NEW!!! Big Data 500m€ ( not in WP )
EU has become world leader in highly reliable safety-critical systems Strategic programme effort of ARTEMIS and WP business ecosystem created around CESAR- tool platform for professional systems design Now in CRYSTAL: industrialisation, large scale take-up Some detailed successes: AUTOSAR embedded ICT platform for the car used by all EU, most US, many other manufacturers Three most successful SMEs (total 2003 – 2013): Revenue growth: 13 M€/yr 65M€/yr (average growth 18 %/yr) Jobs: 200 530 employees EU investment in FP7: ~13M€ in total
New Innovation Schemes - Characteristics Built around pan-EU networks of competence centres Provide expertise and skills Broker/facilitator Technology Transfer Dissemination / Multiplier Critical mass of experiments Industrial – focus: SMEs/mid-caps Cross value chain Flexible partnerships (50-250M€) Sharing lessons learnt – not IPRs Flexible implementation Open Calls for new experiments Cascading funds to third parties 9 Typical project structure (IP/large IA)
Key Initiatives 10 under the PPP Factories of the Future Smart Anything Everywhere under Components and Systems Competence centres: RTOs, university and innovation centres Similar initiatives also under PPPs Photonics 21 and SPARC
Outline The Future 11
Photonics 12 Cyber-Physical Systems ECSEL - CPS (Joint Technology Initiative) driven by ARTEMIS Low power Computing Internet of Things CPS in Manufacturing Following ARTEMIS-IA Agenda Robotics… 5G Big Data EPoSS IA SRA AENEAS SRA EFFRA SRA Cloud ITEA: Software Intensive Systems ITEA: Software Intensive Systems Societal Challenges Member States Initiatives
What we ask for (1) Servers, micro-server and highly parallel embedded computing systems based on ultra-low power architectures Integration of HW and SW into working prototypes Low-power, low-cost, high-density, secure, reliable, scalable Cross-layer programming approaches to exploit the full potential of heterogeneous parallel architectures Multi-dimensional optimisation (performance, energy, response time…) Programming approach per application class, easy for programmers Scalable market approach ICT 4 ICT4 - Customised and low power computing
What we ask for (2) Reference architectures and platforms across several sectors and application domains Use-case driven Industrial consensus building, pre-normative activities, reference implementations, proof-of concept demonstrations and validation in key application domains Small proposals Application experiments bringing together all actors along the value chain experiments clustered in large scale projects driven by networks of European centres of excellence Open calls Large proposals ICT 4 ICT4 - Customised and low power computing
Internet of Things/Connected Smart Objects – a cross-cutting activity in Horizon 2020 ICT 30 - Internet of Things and Platforms for Connected Smart Objects – Cutting across several LEIT-ICT areas (smart systems integration, cyber- physical systems, smart networks, big data) – Bringing together different generic ICT technologies and their stakeholder constituencies – 51 M€, call 2 of WP (closure: April 2015) – Research and Innovation Actions (100% funding) & Coordination and Support Action – Large Projects – Mechanism of open competitive calls up to 30% of total budget 15
CPS in ECSEL – Some observations/hints 16 1.Opportunity to cooperate 2.More competition – less protection 3.Important to understand the two sub-calls: RIA and IA 1.Separate budgets (IA=innovation action is higher) 2.Different maturity of technology (RIA: TRL 2-5, whereas IA: TRL 4-8) 4.Think strategic when you set up your project: 1.Eco-system, platforms, value chains 2.Context of your planned work 3.Consider new actors 4.Use of results, impact
THANK YOU Digital Agenda for Europe – Components and Systems: DG CONNECT (Communications Networks, Content and Technology): Horizon 2020 on the web: Info Day Work Programme 2015: computing-internet-things-and-platforms-smart-objects-ict