HPD Development Project is DONE! The Future is Quality assurance Database management Alignment Production of cookies and mounts Electronics interfacing.

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Presentation transcript:

HPD Development Project is DONE! The Future is Quality assurance Database management Alignment Production of cookies and mounts Electronics interfacing Test beams Installation

Custom Pixel Design: 19 ch (towers) and 73 ch (short stacks) Higher pin-out density: Glass feedthrus replace with ceramic from Kyocera Alignment to 50  m: manufacturer tolerances tightened, new measurement procedures Improved rise time: Thinner silicon: 200  m replaces 300  m Guard ring and drain structure: 3 iterations as Canberra improves design lower leakage current, higher breakdown voltage, better uniformity for edge pixels Surface aluminization and edge traces: Reduce negative crosstalk reduce resistance between n+ contacts, surface resistance 300  /sq => 1.7  /sq, Anti-reflective coating: Reduce positive crosstalk from reflected light This has been a development project This has been a development project ( the diode) n+ contact n+ p+ 2 side-contacts (200nm thick Al) Bump-bonded vacuum feedthru n bulk (200  m thick) AR (14 nm sputtered Si) Metal (25 nm AL) Barrier (25 nm SiO 2 )

This has been a development project This has been a development project (the tube) Larger active area: Less room for HV connection, possible field distortions HV coax cable : Reliability and compatibility with RBX Minimize gap: Improve tube components Gold-plated pins: Enables us to use ZIF sockets - questions of gold diffusion Design and produce electronic interface boards RBX mountings and cookies must be rubber insulated FIBERS RBX HPD RBX Cookie HV Cable Electronics Interface Board

Total DC crosstalk B=0 B=1.5 T Bare silicon 18% 7% Aluminized 29% 16% Al with AR 12.4% 4.3% Positive crosstalk from backscatter can be focussed by B-field B=0 Al B=1.5T Al B=1.5T Al+AR

Contract F 359 /EP/ CMS is finalized for $1.5M (2.43 MCHF) Negotiations included Higher cost/tube = 3325 euros only 19-ch version (484 tubes) keep 11% QE more expensive diodes additional coatings + traces by DEP includes shipping DDU via TIB (Schenker Int’l) Bank guarantee removed 60 day provisional acceptance period after receipt 30 day payment from CERN after prov. accept. Financial liability signed (NEU lawyers) MCHF (letter from Hanlon) Money in Team Account at CERN = MCHF Letter of Intent received by DEP last Friday They have 4 tubes to send us UNDER CONTRACT

Other contract details of interest..and lots more bla bla...

Tube Delivery Schedule One production station = 30 tubes/month Letter of Intent received by DEPOct 12, 2001 Spare Tubes (20) Dec 20 ‘01 Spare Tubes (30) March 1 ‘02 HB- (72) May 12 ’02 HE- (72) Aug 23 ‘02 HB+ (72)Nov 3 ‘02 HE+ (72)Jan 28 ‘03 HO (146) June 23 ‘03

Specifications are finalized in Contract

Specifications are finalized in Contract...continued

Evaluate 500 tubes, automated procedure, complete web-accessible database QUALITY ASSURANCE Evaluate 500 tubes, automated procedure, complete web-accessible database Vendor Tests (DEP) => leakage current per pixel vs bias => initial HV bake-out => QE, dark count => pulse width DC Test Station (Minnesota) => boundary scans, uniformity, leakage current, optical crosstalk => diode capacitance and interpixel resistance => HV and bias gain curves, threshold, linearity, breakdown => alignment and registration AC Test Station (Minnesota) => one p.e. curves: dark current, resolution, vacuum check High Rate Tests (FNAL and Minnesota) => risetime and pulse shape => rate dependent effects => capacitive crosstalk and AC uniformity Lifetime Studies (Minnesota) => Total integrated charge => High Voltage stability and bake-out => Radiation Damage

Quality Assurance Test Procedure is also specified in the contract

Quality Assurance Test Procedure - cont.