Institute of Applied Microelectronics and Computer Engineering College of Computer Science and Electrical Engineering, University of Rostock WIRE WIDENING Bjoern Konieczek

Institute of Applied Microelectronics and Computer Engineering College of Computer Science and Electrical Engineering, University of Rostock Slide 2 Problem – Electromigration

Institute of Applied Microelectronics and Computer Engineering College of Computer Science and Electrical Engineering, University of Rostock Possible Solution – Wire Widening -Current density is obtained as ratio of current and cross-section area -Most process technologies assume constant thickness of printed interconnects -Wire width exerts direct influence on current density

Institute of Applied Microelectronics and Computer Engineering College of Computer Science and Electrical Engineering, University of Rostock Influence on the Design -Electromigration mostly effects supply lines

Institute of Applied Microelectronics and Computer Engineering College of Computer Science and Electrical Engineering, University of Rostock Conclusion Slide 5 -Wire widening  more robust wires in terms of electromigration -Increases impact of negative effects on the wires -Designer has to take care of this higher impact of negative effects

Institute of Applied Microelectronics and Computer Engineering College of Computer Science and Electrical Engineering, University of Rostock THANK YOU FOR YOUR ATTENTION

Institute of Applied Microelectronics and Computer Engineering College of Computer Science and Electrical Engineering, University of Rostock Sources Slide 7 Anurag Seth, „Electromigration in Integrated Circuits – Workshop on Reliability and Physical Verification”, IIT Delhi, 12 Dec 2009 Prof. Dr. Ing. Dirk Timmermann, Unpublished Handout of Lecture „Hochintegrierte Systeme I“, University of Rostock, 2009 The International Technology Roadmap for Semiconductors, 2005