CPAC/NeSSI Workshop May 6, 2004 (Times are PST) Best Western University Tower Hotel, Seattle, Washington, USA AMPM 08:00 Welcome – M. Koch (CPAC Dir.) 08:10 NeSSI: A high level overview; Background of GenIINeSSI: A high level overview; Background of GenII spec including the 7 elements spec including the 7 elements - R. Dubois – Dow A Case Study defining a Pipe to Pixel™ solution for process analytical. (J. Gunnell – “ringmaster”) 08:30 Introducing the design challenge: the SampleIntroducing the design challenge: the Sample System: substrates/components/design tools - Jeff Gunnell - ExxonMobil 08:40 Celerity – Nelson UrdanetaCelerity – 08:55 CIRCOR – Robert ShermanCIRCOR 09:10 Parker – Steve DoeParker 09:25 Swagelok – John WawrowskiSwagelok 09:40 Break (“Begreifen” – hands on) 10:25 Transducer/Component selection & the CPAC webTransducer/Component selection & the CPAC web site toolsite tool. Dave Veltkamp - CPAC 10:35 SAM hardware overview – J. Mosher - HoneywellSAM hardware overview 10:50 ConnI/OPC Conn. Tutorial – R. Kondor –Matrikon 11:00 Maintenance facilitation & remote support viaMaintenance facilitation & remote support via enterprise wide connectivity enterprise wide connectivity – J. Gunnell – EMCC 11:20 AppLI – Software for SAM – I. Cardenas – AntelopeAppLI – Software for SAM 11:50 Gen III microAnalytical Vision – R. Dubois - DowGen III microAnalytical Vision 12:05 LUNCH (CPAC provides) (time to play with Antelope) 01:00 Overview of CPAC – Mel KochOverview of CPAC 01:10 Overview/update of the DOE Project –Overview/update of the DOE Project & Participation in DOE program – J. Mosher – Honeywell 01:20 Serial Communication Comparison Matrix & SelectionSerial Communication Comparison Matrix & Selection – J. Mosher – Honeywell CiA IEEE standardCiA IEEE standard 02:00 Gen II/III DOE prototype features – R. Dubois - DowGen II/III DOE prototype features 02:15 Foundation Fieldbus – Mike Clark – SAITFoundation Fieldbus 02:30 Break 02:45 ProfiBus – M. Bryant – ProfiBus Trade Org.ProfiBus 03:30 ProfiBus Interfaces for NeSSI™: A. Tesch, SoftingProfiBus Interfaces for NeSSI™: 03:40 Defining the software/hardware interfaces betweenDefining the software/hardware interfaces between transducer, network & SAM transducer, network & SAM – J. Mosher - Honeywell Connecting to legacy analyzers… 04:10 “Part I” & OPC – J. Gunnell - EMCC“Part I” 04:25 “Part II” – J. Mosher - Honeywell“Part II” 04:35 End

PRESENTATION NOTES: Serial Communication Matrix and Reason for Selection – J. Mosher (Honeywell) Compare key features, benefits and drawbacks of common industrial buses and their applicability for a “NeSSI- bus” miniature, modular for use with electrically hazardous applications. A potential intrinsically safe CANbus system is now under consideration by CAN in Automation (CiA) and NIST IEEE This will be covered at this time. Gen II/III DOE Prototype Features – R. Dubois (Dow) Recap of objectives and key design features of the 12 industrial prototypes, co-funded by the US DOE will be covered. Those components which are commercially available and those which are still missing will be noted at this time. Defining the software/hardware interfaces between transducer, network & SAM – J. Mosher (Honeywell) Discussion of the resources and methods of implementing the network and the electronic configuration documents and controls within SAM