Front End Circuit.. CZT FRONT END ELECTRONICS INTERFACE CZTASIC FRONT END ELECTRONICS TO PROCESSING ELECTRONICS -500 V BIAS+/-2V +/-15V I/O signal.

Slides:



Advertisements
Similar presentations
20/Oct./2000 CF IEEE NSS 2000 at Lyon,France 1 An MWPC Readout Chip for High Rate Environment Introduction ASIC Structure & Fabrication ASIC Evaluation.
Advertisements

Local Trigger Control Unit prototype
Specific requirements for analog electronics of a high counting rate TRD Vasile Catanescu NIHAM - Bucharest CBM 10th Collaboration Meeting Sept 25 – 28,
SKIROC New generation readout chip for ECAL M. Bouchel, J. Fleury, C. de La Taille, G. Martin-Chassard, L. Raux, IN2P3/LAL Orsay J. Lecoq, G. Bohner S.
CADMIUM ZINC TELLURIDE (CZT) IMAGER INTRODUCTION : 1.SCIENTIFIC REQUIRMENT 2. DETECTORS USED IN IMAGER 3. ELECTRICAL CIRCUITS (FRONT END ELECTRONICSUSED)
MDT-ASD PRR C. Posch30-Aug-02 1 Specifications, Design and Performance   Specifications Functional Analog   Architecture Analog channel Programmable.
Railway Foundation Electronic, Electrical and Processor Engineering.
Development of novel R/O electronics for LAr detectors Max Hess Controller ADC Data Reduction Ethernet 10/100Mbit Host Detector typical block.
David Nelson STAVE Test Electronics July 1, ATLAS STAVE Test Electronics Preliminary V3 Presented by David Nelson.
6mm 【 Development of Readout Electronics for MPPC 】 We report the read out electronics of MPPC( Multi-Pixel Photon Counter ). MPPC is a new photodetector.
Preliminary Design of Calorimeter Electronics Shudi Gu June 2002.
Oct, 2000CMS Tracker Electronics1 APV25s1 STATUS Testing started beginning September 1 wafer cut, others left for probing 10 chips mounted on test boards.
AIDA design review Davide Braga Steve Thomas ASIC Design Group 9 June 2009.
Second generation Front-end chip for H-Cal SiPM readout : SPIROC DESY Hamburg – le 13 février 2007 M. Bouchel, F. Dulucq, J. Fleury, C. de La Taille, G.
A Readout ASIC for CZT Detectors
CARIOCA (Cern and RIO Current Amplifier). The CARIOCA chip has 8 binary output, therefore DIALOG has 16 PCH as input channels and has up to 8 LCH as output.
Mark Raymond /12/051 Trip-t & TFB Trip-t schematics signals and registers operation SiPM connection TFB block diagram functionality.
27 th September 2007AIDA design meeting. 27 th September 2007AIDA design meeting.
First ideas for the Argontube electronics Shaper, simulations Block Diagram for analog path Delta Code Data Reduction Bus system, Controller Max.
An update on Power Pulsing with SDHCAL Kieffer Robert IPN Lyon « CALICE collaboration meeting » May 2011, CERN
P. Baron CEA IRFU/SEDI/LDEFACTAR Meeting Santiago de Compostela March 11, A review of AFTER+ chip Its expected requirements At this time, AFTER+
Features of the new Alibava firmware: 1. Universal for laboratory use (readout of stand-alone detector via USB interface) and for the telescope readout.
HINP32C Southern Illinois University Edwardsville VLSI Design Research Laboratory Washington University in Saint Louis Nuclear Reactions Group.
Alexei SemenovGeneric Digitizer Generic Digitizer 10MHZ 16 bit 6U VME Board.
A 128-channel event-driven readout ASIC for the R 3 B Tracker TWEPP 2015, Lisbon Lawrence Jones ASIC Design Group Science and Technology Facilities Council.
Valerio Re, Massimo Manghisoni Università di Bergamo and INFN, Pavia, Italy Jim Hoff, Abderrezak Mekkaoui, Raymond Yarema Fermi National Accelerator Laboratory.
DEPT OF MODERN PHYSICS, USTC Electronics System of MC IHEP, Beijing ___________________________________________ Muon Group, USTC, Hefei.
ClicPix ideas and a first specification draft P. Valerio.
Thanushan Kugathasan, CERN Plans on ALPIDE development 02/12/2014, CERN.
FEC electronicsRD-51 mini week, CERN, Sept Towards the scalable readout system: FEC electronics for APV25, AFTER and Timepix J.
HEXITEC ASIC – A Pixellated Readout Chip for CZT Detectors Lawrence Jones ASIC Design Group Science and Technology Facilities Council Rutherford Appleton.
Status of the n-XYTER testing Knut Solvag, Gerd Modzel, Christian Schmidt, Markus Höhl, Andrea Brogna, Ullrich Trunk, Hans-Kristian Soltveit CBM.
Sampling chip psTDC_02 Jean-Francois Genat – Herve Grabas Mary Heinz – Eric Oberla 1/27/ psTDC_02 presentation.
TPC electronics Status, Plans, Needs Marcus Larwill April
SphinX Workshop Wrocław 2007PP SphinX electronic delay times and priorities.
Click to edit Master subtitle style Presented By Mythreyi Nethi HINP16C.
System IC Design Lab. Dongguk University 1 Chip design Chip design KIM,D.H., KWON,Y.,SONG,M.K. Department of Semiconductor Science, Dongguk Univ. for the.
AIDA: test plots Davide Braga Steve Thomas ASIC Design Group 22 September 2009.
M. TWEPP071 MAPS read-out electronics for Vertex Detectors (ILC) A low power and low signal 4 bit 50 MS/s double sampling pipelined ADC M.
1 Carleton/Montreal Electronics development J.-P Martin (Montreal) Shengli Liu & M. Dixit (Carleton) LC TPC Meeting DESY Hamburg, 4 June 2007.
ASIC Development for Vertex Detector ’07 6/14 Y. Takubo (Tohoku university)
An update on Power Pulsing with SDHCAL Kieffer Robert IPN Lyon « CALICE collaboration meeting » May 2011, CERN
CERN PH MIC group P. Jarron 07 November 06 GIGATRACKER Meeting Gigatracker Front end based on ultra fast NINO circuit P. Jarron, G. Anelli, F. Anghinolfi,
R. Kluit Nikhef Amsterdam R. Kluit Nikhef Amsterdam Gossopo3 3 rd Prototype of a front-end chip for 3D MPGD 1/27/20091GOSSIPPO3 prototype.
1 Second generation Front-end chip for H-Cal SiPM readout : SPIROC Réunion EUDET France – LAL – jeudi 5 avril 2007 M. Bouchel, F. Dulucq, J. Fleury, C.
Technical status of the Gossipo-3 : starting point for the design of the Timepix-2 March 10, Vladimir Gromov NIKHEF, Amsterdam, the Netherlands.
A versatile FPGA based photon counter and correlator sudersan dhep meet’16.
NOISE MEASUREMENTS ON CLICPIX AND FUTURE DEVELOPMENTS Pierpaolo Valerio.
Analog Front End For outer Layers of SVT (L.4 & L.5) Team:Luca BombelliPost Doc. Bayan NasriPh.D. Student Paolo TrigilioMaster student Carlo FioriniProfessor.
ASAD Workshop Saclay (CEA Irfu) November 25, AGET circuit: Application Information actar.
The design of fast analog channels for the readout of strip detectors in the inner layers of the SuperB SVT 1 INFN Sezione di Pavia I Pavia, Italy.
End OF Column Circuits – Design Review
OMEGA3 & COOP The New Pixel Detector of WA97
KLOE II Inner Tracker FEE
A General Purpose Charge Readout Chip for TPC Applications
LHC1 & COOP September 1995 Report
ISUAL Imager Stewart Harris.
A micropower readout ASIC for pixelated liquid Ar TPCs
on behalf of the AGH and UJ PANDA groups
CTA-LST meeting February 2015
Iwaki System Readout Board User’s Guide
DCH FEE 28 chs DCH prototype FEE &
HV-MAPS Designs and Results I
A Fast Binary Front - End using a Novel Current-Mode Technique
Status of n-XYTER read-out chain at GSI
كارت هوشمند چيست وچگونه كار مي‌كند؟
TPC electronics Atsushi Taketani
BESIII EMC electronics
SKIROC status CERN – CALICE/EUDET electronic & DAQ meeting – 22/03/2007 Presented by Julien Fleury.
ME instrument and in-orbit performance
Presentation transcript:

Front End Circuit.

CZT FRONT END ELECTRONICS INTERFACE CZTASIC FRONT END ELECTRONICS TO PROCESSING ELECTRONICS -500 V BIAS+/-2V +/-15V I/O signal

1.It is fully data driven charge signal acquisition chip. 2. All Analog and Digital outputs are current driven for 1µs. Each pixel is addressable. 3. Provision of programming for needed parameters of the chip like threshold, shaping time constant and various other parameter. ClkIn and RegIn are Clock and Input for the Shift- registor. 4. The chip requires +2 and -2 volts for operation. 5. Daisy chaining of chips. FEATURES OF ASIC XaIm3.2

SignallevelsRemarks Dvdd+ 2 V Digital positive supply. Dvss- 2 V Digital negative supply. Avdd+2 V Analog positive supply. Avss- 2 V Analog negative supply. Gnd0 V Analog ground. Dgnd0 V Digital ground. Aoutp0 to 200µA Pulse height value of hit channel. Aoutm0 to -200µA Pulse height value of hit channel. Mgo60 µAMagnitude of Mgo determines the no. of hits. Io#15 – Io# µATo get output in digital form use transimpedence amplifier. Logic 1 = 100 µA, Logic 0 = 0µA MaRes p 100 mVResets the ASIC. Reg In+/- 2 VLogic 1 = +2 V, Logic 0 = -2 V Clk in+/- 2 VData at Reg In is sampled at falling edge of clock. Reg Out+/- 2 VLogic 1 = +2 V, Logic 0 = -2 V I/O Interface to Front End Electronics

ASIC control signals SignalDescriptionAdjustement VthrDiscriminator threshold voltage Int. DAC, ext. overriding possible. IfsBias current feedback resistance shaper IfpBias current feedback resistance preamp TrigWbiasBias-current for data-output duration Sha_biasBias-current for shaper Ls_biasRef. voltage for analog output buffer TrigDelBiasBias-current for delay of trigger MbiasBias-current for internal bias generation network Int. DAC. ResWbiasBias-current for internal reset durationExternal overriding possible. Ota_biasBias-current for peak-hold and discriminator MaResPReset of the chip+ 100mV *

Outline of Amplifier channel aout ctout in

Functional Block Diagram

Data acquisition in ASIC at each event  Hit pixel collected charge pulse is amplified & filtered in pre-amp & shaper.  Peak detector detects the peak of the pulse.  If peak value is larger than threshold, trigger signal will be generated.  Hit pixel trigger signal + Analogue peak value + Channel address. (Readout period = 1µs).  The chip resets itself after Readout period.

321 DAISY CHAINING OF ASIC Upto 512 chips can be daisy chained on a common shared bus. Options for us:- 128 individual lines for each ASIC. 128 ASIC daisy chained. 32 ASIC daisy chained, so 4 quadrant.(32 x 4) REG IN REG OUT CLK IN

Sequence of Serial shift register mask back

 Power Rails : DVdd = +2V,DVss = -2V AVdd = +2V,AVss = -2V  Read out = Self triggered & data driven  Analog output = µA  Read out time = 1 µS  Channels = 128  Peaking time = Nominal : 0.5 µS Adjustable : 0.35 µS – 1 µS  Power Dissipation = 3.2 mW / channel  Can be easily daisy chained. ASIC Specifications

M1M2M3Mn ADDR BUS DATA BUS TRIG & MULTI HIT DATA CLOCK ENERGY PULSE