Montpellier, November 12, 2003Vaclav Vrba, Institute of Physics, AS CR 1 Vaclav Vrba Institute of Physics, AS CR, Prague CALICE ECal Status Report

Montpellier, November 12, 2003Vaclav Vrba, Institute of Physics, AS CR 2 CALICE ECal TPC ECal HCa l tungsten coil ModuleModule vertical structure Detector slab }

Montpellier, November 12, 2003Vaclav Vrba, Institute of Physics, AS CR 3 Physics prototype – Detector slab (C / W) structure type H Front End electronics Cooling system Aluminum shielding Silicon sensor array sensor pad 1 x 1 cm 2 Vertical cross section

Montpellier, November 12, 2003Vaclav Vrba, Institute of Physics, AS CR 4 Detector Slab Dimensions 8,3 mm Aluminum foil : ~0.1 mm PCB : 2.4 mm Si wafer : mm Carbon fiber : 0.15 mm W plate : 1.4 mm

Montpellier, November 12, 2003Vaclav Vrba, Institute of Physics, AS CR 5 Gluing of Si wafer Choice of the Glue : –Good conductivity –Polymerization at low temperature (Typ. ~ 40° C) –Time of polymerization Some test : –First : PCB on PCB –Second : with real Si wafer EPO-TEK® EE129-4 : Room temp/16 hr cure: ohm-cm Room temp/20 hr cure: ohm-cm Room temp/72 hr cure: ohm-cm

Montpellier, November 12, 2003Vaclav Vrba, Institute of Physics, AS CR 6 A automatic device is use to deposit the conductive glue : X-Y-Z table (400×400×150 mm 3 ) with glue dispensing tool (conductive glue) 270 Gluing and placement (  0.1 mm) of 270 wafers with 6×6 pads About points of glue. Gluing of Si wafer

Montpellier, November 12, 2003Vaclav Vrba, Institute of Physics, AS CR 7 PCB and Front End electronics details : Silicon wafer Composite Tungsten PCB Front End electronics Flexible circuit max 4.5 mm Physics prototype – detector slab PCB : - 14 layers - Thickness 2.4 mm

Montpellier, November 12, 2003Vaclav Vrba, Institute of Physics, AS CR 8 Physics prototype - sensors Wacker 530  m material, ≈ 6 k  cm Topsil 500  m material, 12 k  cm Two Si sensor vendors : ON Semiconductor, Czech Rep. Elma, Russia ON Semiconductor prototype sensors measured and qualified: New design gds file prepared and submitted to ON Semiconductor :

Montpellier, November 12, 2003Vaclav Vrba, Institute of Physics, AS CR 9 Sensors for Physics Prototype One wafer is a Matrix of 6 x 6 pixel of 1 cm 2. Important point : manufacturing must be as simple as possible to be near of what could be the real production for full scale detector in order to : Keep lower price (a minimum of step during processing) Keep lower price (a minimum of step during processing) Low rate of rejected processed wafer Low rate of rejected processed wafer good reliability and large robustness good reliability and large robustness Number of active Wafer needed for the physic prototype : will be produce by Institute of Nuclear Physics - Moscow State University 150 will be produce by Institute of Nuclear Physics - Moscow State University 150 will be produce by Institute of Physics, Academy of Sciences of the Czech Republic - Prague 150 will be produce by Institute of Physics, Academy of Sciences of the Czech Republic - Prague 4” High resistive wafer : ~6 K  cm Thickness : 525 microns  3 % Tile side : Guard ring In Si ~80 e-h pairs / micron  42 ke - /MiP Capacitance : ~25 pF Leakage current : 1 – 5 nA Full depletion bias : ~150 V Nominal operating bias : 200 V

Montpellier, November 12, 2003Vaclav Vrba, Institute of Physics, AS CR 10 Cosmic test bench: general view

Montpellier, November 12, 2003Vaclav Vrba, Institute of Physics, AS CR 11 Physics prototype – test setup for cosmics Cross-section 1 st X-Y line (scintillating fibers) 2 nd X-Y line (scintillating fibers) 4 silicon wafer tested Detector slab 1 mm - Measurement surface : 128  128 mm - Precision : 0.5 mm

Montpellier, November 12, 2003Vaclav Vrba, Institute of Physics, AS CR 12 Physics prototype – test beam setup ECAL general view 3 rd structure (3×1.4mm of W plates) 370 mm 180 mm Silicon wafer 2 nd structure (2×1.4mm of W plates) VME/… HCAL VFE Movable table ECAL Beam monitoring BEAM 1 st structure (1.4mm of W plates) Detector slab 370 mm

Montpellier, November 12, 2003Vaclav Vrba, Institute of Physics, AS CR 13 Critical issues  Integration of mechanics and electronics  Beginning of 2004: slab assemblies for tests with cosmics Outlook and plans  Summer-Autumn 2004: the Physics prototype for e- beam  Summer 2005: common irradiation with HCal with hadron (π,p) beams  cooling