David L. Winter Nevis FVTX FEE Concept PHENIX FVTX Review 19 February 2007.

Slides:



Advertisements
Similar presentations
Programmable Interval Timer
Advertisements

Token Bit Manager for the CMS Pixel Readout
E-link IP for FE ASICs VFAT3/GdSP ASIC design meeting 19/07/2011.
ESODAC Study for a new ESO Detector Array Controller.
A Gigabit Ethernet Link Source Card Robert E. Blair, John W. Dawson, Gary Drake, David J. Francis*, William N. Haberichter, James L. Schlereth Argonne.
20 Feb 2002Readout electronics1 Status of the readout design Paul Dauncey Imperial College Outline: Basic concept Features of proposal VFE interface issues.
July 10, 2008 PHENIX RPC review C.Y. Chi 1 RPC Front End Electronics On chamber discriminator  The strips  The CMS discriminator chips  The discriminator.
IO Controller Module Arbitrates IO from the CCP Physically separable from CCP –Can be used as independent data logger or used in future projects. Implemented.
Detector Array Controller Based on First Light First Light PICNIC Array Mux PICNIC Array Mux Image of ESO Messenger Front Page M.Meyer June 05 NGC High.
Manfred Meyer & IDT & ODT 15 Okt Detectors for Astronomy 2009, ESO Garching, Okt Detector Data Acquisition Hardware Designs.
Time Division Multiplexing School of Physics and Astronomy Department of Particle Physics Elissavet Papadima 29/5/2014.
Electronics for PS and LHC transformers Grzegorz Kasprowicz Supervisor: David Belohrad AB-BDI-PI Technical student report.
Leo Greiner IPHC testing Sensor and infrastructure testing at LBL. Capabilities and Plan.
SODA: Synchronization Of Data Acquisition I.Konorov  Requirements  Architecture  System components  Performance  Conclusions and outlook PANDA FE-DAQ.
U N C L A S S I F I E D FVTX Detector Readout Concept S. Butsyk For LANL P-25 group.
Gerd J. Kunde - LANL1 The FVTX Technology  Outline Overall Picture Silicon Detector –Geometry, Layout, Process Readout Chip –FNAL Chips, New Chip PHX.
Understanding Data Acquisition System for N- XYTER.
Leo Greiner IPHC meeting HFT PIXEL DAQ Prototype Testing.
1 DAQ for FVTX detector Implementation Mark Prokop Los Alamos National Laboratory.
PHENIX upgrade DAQ Status/ HBD FEM experience (so far) The thoughts on the PHENIX DAQ upgrade –Slow download HBD test experience so far –GTM –FEM readout.
LNL 1 SLOW CONTROLS FOR CMS DRIFT TUBE CHAMBERS M. Bellato, L. Castellani INFN Sezione di Padova.
Frontend of PHENIX Si pixel K. Tanida (RIKEN) FEM/DAQ meeting for PHENIX upgrade (10/24/02) Outline Overview of PHENIX Si pixel detector ALICE1 chip readout.
HBD FEM the block diagram preamp – FEM cable Status Stuffs need to be decided….
Leo Greiner IPHC DAQ Readout for the PIXEL detector for the Heavy Flavor Tracker upgrade at STAR.
LANL FEM design proposal S. Butsyk For LANL P-25 group.
11th March 2008AIDA FEE Report1 AIDA Front end electronics Report February 2008.
1 PreFPIX2 Inner board and test beam triggering Gabriele Chiodini Fermilab - Jan 07, 02.
Michal Szelezniak – LBL-IPHC meeting – May 2007 Prototype HFT readout system Telescope prototype based on three Mimostar2 chips.
Features of the new Alibava firmware: 1. Universal for laboratory use (readout of stand-alone detector via USB interface) and for the telescope readout.
Leo Greiner PIXEL Hardware meeting HFT PIXEL detector LVDS Data Path Testing.
Xiangming Sun1PXL Sensor and RDO review – 06/23/2010 STAR XIANGMING SUN LAWRENCE BERKELEY NATIONAL LAB Firmware and Software Architecture for PIXEL L.
FVTX Electronics (WBS 1.5.2, 1.5.3) Sergey Butsyk University of New Mexico Sergey Butsyk DOE FVTX review
Serial Data Link on Advanced TCA Back Plane M. Nomachi and S. Ajimura Osaka University, Japan CAMAC – FASTBUS – VME / Compact PCI What ’ s next?
Optical Readout and Control Interface for the BTeV Pixel Vertex Detector Optical interface for the PCI board –1.06 Gbps optical link receiver –Protocol.
NUMI Off Axis NUMI Off Axis Workshop Workshop Argonne Meeting Electronics for RPCs Gary Drake, Charlie Nelson Apr. 25, 2003 p. 1.
Nevis FVTX Update Dave Winter FVTX Silicon Meeting 13 July 2006.
FPGA firmware of DC5 FEE. Outline List of issue Data loss issue Command error issue (DCM to FEM) Command lost issue (PC with USB connection to GANDALF)
March 9, 2005 HBD CDR Review 1 HBD Electronics Preamp/cable driver on the detector. –Specification –Schematics –Test result Rest of the electronics chain.
December 14, 2006Anuj K. Purwar1 Design proposal for Read Out Card (ROC) Anuj K. Purwar December 14, 2006 Nevis Meeting.
LHCb front-end electronics and its interface to the DAQ.
1 07/10/07 Forward Vertex Detector Technical Design – Electronics DAQ Readout electronics split into two parts – Near the detector (ROC) – Compresses and.
Valerio Re, Massimo Manghisoni Università di Bergamo and INFN, Pavia, Italy Jim Hoff, Abderrezak Mekkaoui, Raymond Yarema Fermi National Accelerator Laboratory.
Sept. 7, 2004Silicon VTX Workshop - Brookhaven National Laboratory, Long Island, New York Prototype Design of the Front End Module (FEM) for the Silicon.
KLM Trigger Status Barrel KLM RPC Front-End Brandon Kunkler, Gerard Visser Belle II Trigger and Data Acquistion Workshop January 17, 2012.
Sensor testing and validation plans for Phase-1 and Ultimate IPHC_HFT 06/15/ LG1.
BTeV in PHENIX: Pixel Readout Chip Basics David Christian Fermilab December 5, 2005.
FVTX Electronics (WBS 1.5.2, 1.5.3) Sergey Butsyk University of New Mexico Sergey Butsyk DOE FVTX review
Connector Differential Receiver 8 Channels 65 MHz 12 bits ADC FPGA Receive/buffer ADC data Format triggered Events Generate L1 Primitives Receive timing.
A Super-TFC for a Super-LHCb (II) 1. S-TFC on xTCA – Mapping TFC on Marseille hardware 2. ECS+TFC relay in FE Interface 3. Protocol and commands for FE/BE.
High Speed Digital Systems Lab Spring/Winter 2010 Project definition Instructor: Rolf Hilgendorf Students: Elad Mor, Ilya Zavolsky Integration of an A/D.
STAR Pixel Detector readout prototyping status. LBNL-IPHC-06/ LG22 Talk Outline Quick review of requirements and system design Status at last meeting.
LKr readout and trigger R. Fantechi 3/2/2010. The CARE structure.
.1PXL READOUT STAR PXL READOUT requirement and one solution Xiangming Sun.
Rutherford Appleton Laboratory September 1999Fifth Workshop on Electronics for LHC Presented by S. Quinton.
Readout controller Block Diagram S. Hansen - CD-1 Lehman Review1 VXO Ø Det Links to 24 SiPM Front End Boards Clock Event Data USB ARM uC A D Rd Wrt 100Mbit.
29/05/09A. Salamon – TDAQ WG - CERN1 LKr calorimeter L0 trigger V. Bonaiuto, L. Cesaroni, A. Fucci, A. Salamon, G. Salina, F. Sargeni.
MADEIRA Valencia report V. Stankova, C. Lacasta, V. Linhart Ljubljana meeting February 2009.
The Data Handling Hybrid
The Jülich Digital Readout System for PANDA Developments
Evidence for Strongly Interacting Opaque Plasma
96-channel, 10-bit, 20 MSPS ADC board with Gb Ethernet optical output
NA61 - Single Computer DAQ !
Read Out and Data Transmission Working Group
RPC Front End Electronics
New DCM, FEMDCM DCM jobs DCM upgrade path
sPHENIX DOE-SC CD-1/3a Review WBS 1.5.3: CalElec Digitizers
Digitally subtracted pulse between
SVT detector electronics
The LHCb Front-end Electronics System Status and Future Development
TELL1 A common data acquisition board for LHCb
Presentation transcript:

David L. Winter Nevis FVTX FEE Concept PHENIX FVTX Review 19 February 2007

D. Winter: Nevis FVTX FEE Concept 2 Outline Overview Detailed descriptions: –Daughterboard –Relay & Interface –Receiver –Examples Readout issues Test setup at Nevis Summary

19 February 2007 D. Winter: Nevis FVTX FEE Concept 3 Design Overview Key Features: Reduction of signal lines at the wedge Copper carries signals from wedges to nearby rack Two data paths provided between IR and backend –Relay card: fast unidirectional fiber carrying all events to Lvl1 –Interface card: not-quite-as-fast duplex fiber for slow control (including timing signals) and data (potentially Lvl1 accepted at the front end) PLD VR Pulser VR BiDir Serial PLD VR Pulser VR BiDir Serial PLD VR Pulser VR BiDir Serial PLD VR Pulser VR BiDir Serial Relay Board Interface Board Lvl1 Trigger Receiver Control, Timing Level1 accept Data Enclosure IR Rack Room 4 planes (x 48) 4 (1 per plane) 1 per endcap High BW Fiber (Lower BW) Fiber

19 February 2007 D. Winter: Nevis FVTX FEE Concept 4 Assumptions for signal/channel counts Each plane consists of 48 wedges Each wedge read out by 12 (1 st plane) or 26 (planes 2-4) FPHX chips LVDS signals required by each FPHX –2 Data Output: 120 total (plane 1), 6 LVDS signals that can be shared by FPHX chips: –Shift Data In, Shift Data Out, Shift Control, Beam Clock (BCO) In, Data Clock In, Reset 3 Required non-LVDS signals that can be bused: –Pulse inject, Digital voltage in, Analog voltage in Total Number of connections per wedge: –2x26(or 12) + 9 = 61 (33 for plane 1) These numbers do not include connections not directly related to readout, such as sensor bias voltages, etc Total number of strips per wedge: –128*26(or 12) = 3328 (or 1536 for plane 1)

19 February 2007 D. Winter: Nevis FVTX FEE Concept 5 Wedge Daughterboard 1:1 Wedge to DB ratio –Could consider 2:1 or 4:1 if deemed necessary LGA-based daughterboard –Nominally 3cm X 3cm –Size dominated by connectors (LGA, to-wedge connection, routing on board) Wedge-LGA connection via kapton HDI(s) Requires rad-tolerant FPGA –E.g.: 256-pin BGA Actel A3PE600 FPGA provides calibration pulses –Derived from output of logic pins –Amplitude determined by small (~6) resistor array. Provides power to digital and analog portions of FPHX Duplex LVDS communication with Relay –Eg. Twinax, Firewire, etc. –300 Mbps link to Relay –No external serialization necessary (no serdes) –1+1 for Tx/Rx both control & data –Headroom for additional data lines if necessary PLD VR Pulser VR BiDir Serial PLD VR Pulser VR BiDir Serial PLD VR Pulser VR BiDir Serial PLD VR Pulser VR BiDir Serial

19 February 2007 D. Winter: Nevis FVTX FEE Concept 6 Relay Outside enclosure but inside IR (~10m from FVTX) 48:1 ratio of DB to Relay (per endcap) –Assumes 1 DB per wedge –DB-Relay via duplex LVDS line (eg. Firewire) Provides high-bw unidirectional link to Lvl1 trigger hardware –High-speed serdes + fiber Data/Control path with Interface via duplex LVDS pairs (eg. twinax) PLD VR Pulser VR BiDir Serial PLD VR Pulser VR BiDir Serial PLD VR Pulser VR BiDir Serial PLD VR Pulser VR BiDir Serial Relay Board Lvl1 Trigger High BW Fiber High density twinax example

19 February 2007 D. Winter: Nevis FVTX FEE Concept 7 Interface Located outside enclosure but inside IR (~10m from FVTX) –Co-located with relay boards 1 Interface gathers 4 relays Merges data from relays for single transmission to receiver Connected via duplex fiber to receiver (rack room) –Receives and relays control & timing signals upstream PLD VR Pulser VR BiDir Serial PLD VR Pulser VR BiDir Serial PLD VR Pulser VR BiDir Serial PLD VR Pulser VR BiDir Serial Relay Board Interface Board Lvl1 Trigger High BW Fiber (Lower BW) Fiber

19 February 2007 D. Winter: Nevis FVTX FEE Concept 8 Receiver Provides duplex fiber communication to front end for both control and data Receives standard PHENIX timing signals, reset, Lvl1 accept On-board memory buffer for data Events are pipelined, in time order –Application of Lvl1 accept straightforward –Option to allow BCO window around Lvl1 accept Handles passing data to the archiving backend PLD VR Pulser VR BiDir Serial PLD VR Pulser VR BiDir Serial PLD VR Pulser VR BiDir Serial PLD VR Pulser VR BiDir Serial Relay Board Interface Board Lvl1 Trigger Receiver Control, Timing Level1 accept Data High BW Fiber (Lower BW) Fiber

19 February 2007 D. Winter: Nevis FVTX FEE Concept 9 DB Example: Test interface to FPIX Some Key Features: Based around Altera Cyclone FPGA Option for time-ordering pixel data (relevant only for FPIX, not FPHX) Option for 4-line readout (default is 1-line) Includes 15-bit counter to implement timed commands and timestamps FIFO buffers non-immediate commands (128 deep) FPIX Pulser Logic Phase Follower Logic Deserializer 6-bit Pulser Inject BCO Data Lines 80 MHz Clock Data Clk VDDD VDDA Shift Control Shift In Command Interpreter Shift Out Regulated power Serdes Optical Transceiver Packet Logic

19 February 2007 D. Winter: Nevis FVTX FEE Concept 10 Receiver Example Optical Tx/Rx Serdes PCI Register Logic Memory 32-bit 33/66 MHz PCI Bus DMA Beam Clock Lvl1 Accept Routing and Tx Logic Reset Prototype under development Currently implemented test board

19 February 2007 D. Winter: Nevis FVTX FEE Concept 11 Communication between Interface and Receiver Develop(ed) packet protocol for fiber link between current interface and receiver –Protocol not specific to fiber communications, though, could adapt to copper communications as well Control commands: –Immediate commands to be executed by interface upon receipt Examples: Firefighter reset, interface reset, read timer, etc. –Interface commands queued in FIFO, executed in order of receipt Examples: read/set interface CSR, pulse chip –FPIX API commands (also queued) passed on to FPIX control input Pixel (FPIX) data: –Packets correspond to hits with same BCO –New packets started as new BCOs are detected in data stream

19 February 2007 D. Winter: Nevis FVTX FEE Concept 12 Level1 Accept The Level1 trigger rejection, dropping unwanted data, can take place at multiple points in the readout We count BCO and BCO-N (where N represents the Level1 latency) at the Receiver, the Interface and DBs in the detector –Note: this implies that we extend the BCO counter to 12 or more bits (easy to do) When we get a Level1 accept, buffer the BCO of accepted events, which can be matched against the time-ordered data at each of the 3 levels In the Receiver, we would also count Level1 accepts and buffer the event number along with the desired BCO.

19 February 2007 D. Winter: Nevis FVTX FEE Concept 13 Power Issues Only place where power dissipation is a concern in within the enclosure Power needs of the wedge, common to any design –Digital and Analog voltage to FPHX chips –Single FPIX draws ~ 0.2 A –FPHX has 1/22 channels, assume 26 chips draw 2.5V = 1.25 W per wedge –Regulation of voltage near chips: V input Additional power needs as a result of presence of DB –PLD: ~ 0.1 – 0.75 W (depends on many factors) Basically a small addition to existing dissipation

19 February 2007 D. Winter: Nevis FVTX FEE Concept 14 Level1 Trigger Current Level1 typically takes 12 ± 1 clock ticks (1 tick = 106 ns) from interaction to arrival of Level1 accept at FEMs –This latency could be extended to 40, though it involves retiming of many (all?) systems Taking into account time for Level1 decision tasks (LL1 calculation, GL1 decision, etc.) this leaves approximately 4 clock ticks to deliver FVTX data to Level1 hardware –~4 hits/chip (central AuAu?) translates to ~5000 hits/plane -> assuming 16 bits/hit: 79kbits/plane / 4 ticks -> 186 Gbps/plane bandwidth required Relaxing the requirement of 4 clock ticks may be in order… –Furthermore: do all bits need to be sent? Relay Board Lvl1 Trigger High BW Fiber

19 February 2007 D. Winter: Nevis FVTX FEE Concept 15 Key Features Large degree of flexibility (both in topology and board count) Intelligence placed at the wedge –Large reduction of signals –Repackage hits from native format to slightly more compressed format –Uses FPIX command interface (same as future FPHX) –Adds small extra power dissipation to existing system Rest of intelligence near, but not immersed in rad environment (eg. Rack on magnet) –Data needing to be shipped fast (LVL1) copied to high-speed link –Space required ~< 6U crate + power bus Receiver writes accepted events directly to PC memory –BUT: not a feature integral to this design –Pipelining of events from endcaps –Lvl1 accept consists of matching accepted event list with data event list –Drop events with clock older than current Lvl1

19 February 2007 D. Winter: Nevis FVTX FEE Concept 16 FPIX-based Prototype Implementation “2 nd Gen” Interface board Provides control in/out to FPIX Data out from FPIX Provides pulser signal Supplies regulated digital and analog power Option for 1- or 4-line readout Option for timeordering of hits (relevant for FPIX, not PHX) Includes 15-bit counter to implement timed commands and timestamps PCI Receiver 32-bit 33 MHz PCI card 256 kB SRAM on-board User interaction via PCI registers Provides 3 channels: control out, control in, data in Dataflow governed by ABC register architecture (one set of ABC per channel) –A : physical RAM address (in PC) of next DMA transfer –B : physical RAM address (in PC) of next user access –C: info for address wrapping boundaries FPIX Test Board From FNAL Interface board PCI Receiver

19 February 2007 D. Winter: Nevis FVTX FEE Concept 17 Test system at work Able to perform tests without requiring full phenix timing system Threshold and pulse height scan of FPIX response (similar to noise measurements performed by Sergey) Measure gains and offsets of each pixel channel Turn-on curve As function of threshold (fixed pulse height) Row Column Row Column

19 February 2007 D. Winter: Nevis FVTX FEE Concept 18 Summary Concept consists of multiple boards –Intelligence at the wedge (DBs) –Relay & Interface to manage control/date from of DBs –Remote Receiver simply inserts data into backend Level1 accept can take place at multiple points Concept emphasizes –Reduction of signal lines at the wedge –Simplicity, flexibility Toughest issue is Level1 trigger constraints –How much data needed in what time? –How to accomplish this? Simple prototypes in the spirit of this readout have been implemented and have been used to perform simple tests and studies

19 February 2007 D. Winter: Nevis FVTX FEE Concept 19 Backup Slides

19 February 2007 D. Winter: Nevis FVTX FEE Concept 20 Notes on bits, clocks, data rates, and readout lines Data format needs to take into account addressing of wedges, planes, BCOs, etc. –From the DB: 16 bit header to contain extended BCO 16 bit hits: 5 bit chip id, 7 bit channel id, 3 bit ADC, 1 bit “reserved” –From the Relay: 16 bit header: ~6 bit wedge id, 3 bit plane id Data clock out of FPHX: 200 MHz How many readout lines are needed? Need to truncate the readout for high-occupancy events … Communication from DB to Relay = 300Mbps

19 February 2007 D. Winter: Nevis FVTX FEE Concept 21 Strawman Cost Estimate (DB/Relay) ComponentQuantityPrice/UnitTotal Altera Cyclone FPGA1$30.00 Oscillator1$10.00 resistors (assorted)20$0.05$1.00 Voltage Regulator 1.5V (digital)1$ uF Capicitors20$0.05$ uF Capacitors10$0.10$1.00 Wafer Connector-96 pair1$10.00 twinax connector – 4 pair1$5.00 eprom – EPCS141$8.00 SERDES TI TK3101 $28.00$0.00 Optical Driver $25.00$0.00 JTAG Connector1$1.00 PC Board:4 layer, tooling, testing1$ Board Assembly1$25.00 Total $ ComponentQuantityPrice/UnitTotal Actel FUSION PLD1$30.00 Voltage Regulator 1.5V (digital) LT19631$5.00 Voltage Regulator 2.5V (Silicon-Digital) LT19631$5.00 Voltage Regulator 2.5V (Silicon-Analog) LT19631$ uF Capicitors10$0.05$ uF Capacitors5$0.10$0.50 LGA Connector1$1.00 Connector-Signal, Power1$2.00 PC Board- double sided, tooling and testing1$2.50 Board Assembly1$10.00 Firewire cable w/ connectors 10m1$40.00 resistors, assorted10$0.05$0.50 Total $102.00

19 February 2007 D. Winter: Nevis FVTX FEE Concept 22 Strawman Cost Estimate (Interface/Receiver) ComponentQuantityPrice/UnitTotal Altera Cyclone FPGA1$30.00 Oscillator1$10.00 resistors (assorted)10$0.05$0.50 Voltage Regulator 1.5V (digital)1$ uF Capicitors10$0.05$ uF Capacitors5$0.10$0.50 eprom – EPCS141$7.50 TI TLK3101 SERDES1$28.00 optical transciever1$ MB Memory1 $0.00 GLINK1 $0.00 RG45 Connector11.00$1.00 Optical receiver1 $0.00 Header Connector- JTAG11.00$1.00 PC Board:4 layer, tooling, testing1$ Board Assembly1$25.00 Total $ Component Quantit y Price/Uni tTotal Altera Cyclone FPGA1$30.00 Oscillator1$10.00 resistors (assorted)20$0.05$1.00 Voltage Regulator 1.5V (digital)1$ uF Capicitors10$0.05$ uF Capacitors5$0.10$0.50 wafer connector – 4X4 pair1$5.00 TI TLK3101 SERDES1$28.00 optical transciever1$25.00 Duplex Fiber optic cable1$50.00 eprom – EPCS141$8.00 JTAG Conector1$1.00 PC Board-4 layer, tooling, testing1$ Board Assembly1$25.00 Total $314.00

19 February 2007 D. Winter: Nevis FVTX FEE Concept 23 DCM vs. DCM-less Current concept of the Receiver mates directly into PC (EvB) on PCI bus –Implements PCI protocol in FPGA code, but this could replaced (bridge chip, eg.) if absolutely necessary Has provided a flexible platform in its current form for quick development of tools to interact with FPIX chip Future generations would format data into packets and frames, like any other PHENIX subsystem –If it must be retargeted to deliver payload to standard DCMs, we do not anticipate any major challenges

19 February 2007 D. Winter: Nevis FVTX FEE Concept 24 Fiber communications: Packet Protocol Packets consist of one or more 32-bit words Packets contain 16-bit header + one or more 16-bit data words Two flavors of packets: control and pixel data Control packets are all one 32-bit word long Pixel data packets with odd numbers of data words are padded with 16-bit 0 word (guaranteeing packets are multiples of 32-bit words) Ctrl Header Optional Data Pixel Header Pixel Data Upper 2 bits of header = 11 2 Three types of control packets –Interface commands –Immediate commands –FPIX API commands Format of header depends on which type Data also depends on type –Interface: 16 bits of data –FPIX API: 13-bit FPIX command Header –Upper 2 bits of header = 10 2 –Bits 12-8: 5-bit chip id –Bits 7-0: 8-bit BCO Data –Upper bit of data word = 0 2 –Bits 14-3: 12-bit pixel addr –Bits 2-0: pixel adc …

19 February 2007 D. Winter: Nevis FVTX FEE Concept 25 Packets, PCI Card, & Physical RAM Receiver uses ABC registers to read or write packets between the physical RAM of the CPU and the onboard RAM ABC registers implement memory as a ringbuffer Transfers take place using DMA Control packets are echoed back to user –Written out via channel 0 –Echoed back to channel 1, with data field replaced with timestamp of when command was executed (if command doesn’t request data to be returned) Useful when correlated with “Execute next command at specified time” immediate command