THEMIS SCM CDR MC VASSAL - 3D PLUS CETP 04/08/ Preamplifiers in 3D Technology EM manufacturing Part list and component Lot Acceptance Tests FM manufacturing Schedule Preamplifier Integration in 3D PLUS Technology

THEMIS SCM CDR MC VASSAL - 3D PLUS CETP 04/08/ Preamplifier Design & Characteristics The Amplifier module Electrical characteristics: 77 dB Gain Bandwidth 0.2mHz to 6 KHz low noise Feedback Mechanical characteristics: 2 amplification levels 3 radiation shielding levels PGA Dimensions: 20 x 20 x 15 (mm) Weight : 15 g Amplifier Module Layout

THEMIS SCM CDR MC VASSAL - 3D PLUS CETP 04/08/ Preamplifier Design & Characteristics The Regulator module Electrical characteristics: Input : +/- 10V Output : V, -6.6V Resistor network for Calibration Mechanical characteristics: 1 power supply regulator layer 1 calibration layer 2 radiation shielding layers PGA Dimensions: 20 x 20 x 14 (mm) Weight : 12 g Regulator Module Layout

THEMIS SCM CDR MC VASSAL - 3D PLUS CETP 04/08/ Engineering Models EM flowchart Steps 1Flex assembly 2Flex electrical test at T amb (R&R) 3Precap visual inspection of flex before stacking -> by 3D PLUS 4Module manufacturing 5Module electrical test at T amb (R&R) 6Module screening 7Varnishing For the THEMIS mission, 3D PLUS had to manufacture : 1 Regulator Engineering Model 3 Amplifier Engineering Models The EM manufacturing is finished, the 4 modules were delivered to CETP in March Main steps of EM manufacturing are :

THEMIS SCM CDR MC VASSAL - 3D PLUS CETP 04/08/ Engineering Models Flex Assembly & Test Flex typesTestCommentsSteps Functional 1 st amplifier level 2 nd amplifier level Power supply regulator input of calibration Continuity / Static / Dynamic Continuity / Static Continuity With bare die & adjustment With bare die Without bare die 3 Adjustment, before and after GT 2 Before and after GlobTop* 1 Connectic Visual inspection1 Shielding Continuity1 Flex assembly Test procedure : Ref. THEPA_QUAL_11 written by CETP Tests took place at 3D PLUS with CETP support * The Glob Top consists in covering wire bonding with resin to protect them. Power supply level All tests are recorded in 3D PLUS data base (date, nb of parts, kind of test, operator, part FAIL or PASS…)

THEMIS SCM CDR MC VASSAL - 3D PLUS CETP 04/08/ Engineering Models Manufacturing & Test Module manufacturing according to PID Test procedure : Ref. THEPA_QUAL_13 written by CETP Tests took place at 3D PLUS with CETP support Module screening : Stabilization bake, 72 hrs at +125°C 10 Thermal cycles –55°C / +125°C Electrical test at 3 temperatures : - 40°C, Tamb, + 65°C Final visual inspection with dimensional measurement The test board is placed in an oven for temperature tests

THEMIS SCM CDR MC VASSAL - 3D PLUS CETP 04/08/  The EM modules are compliant with specification (mechanically & electrically) Engineering Models Conclusion  The EM manufacturing allowed us : To validate the design To validate the tools To finalise the test procedures

THEMIS SCM CDR MC VASSAL - 3D PLUS CETP 04/08/ FM Part List Some components were procured by CETP and others by 3D PLUS according to 3D PLUS procedure ref: 3DPA0350. DescriptionTypeOriginpackageQuantity Passives ResistorCHP0505VishaySMC references Resistor networksRMK33NVishayBare dies10 references Ceramic Capacitor CEC2EurofaradSMC references CNC7EurofaradSMC reference VJ0805VishaySMC reference Tantalium CapacitorTAJBVishayType E1 reference Actives Ampli OpLM108ANSCBare die1 reference NPN Tansistor2N2222AMotorolaBare die1 reference PNP Transistor2N2907AMotorolaBare die1 reference Zener diode1N4100MSCBare die1 reference Dual JFET U404U404SiliconixBare die1 reference Dual JFET U422U422SiliconixBare die1 reference Current regulator diodeCR047SiliconixBare die1 reference DescriptionOriginQuantity Printed Circuits 1st Amplifier levelCICOREL1 reference 2 nd Amplifier levelCICOREL1 reference Power supply regulatorCICOREL1 reference Input of calibrationCICOREL1 reference Shielding levelsCICOREL3 references Connectic CICOREL CIBEL 2 references 30 references 7 references 9 references

THEMIS SCM CDR MC VASSAL - 3D PLUS CETP 04/08/ FM Part List Components used in EM modules will be also used in FM modules, at the exception of 3 references: LM108A, 1 resistor and 1 capacitor. DescriptionTypeOriginpackageQuantityLast delivery Passives ResistorCHP0505VishaySMC references02/05/2004 Resistor networksRMK33NVishayBare dies10 references02/05/2004 Ceramic Capacitor CEC2EurofaradSMC references03/08/2004 CNC7EurofaradSMC reference01/14/2004 VJ0805VishaySMC referenceCETP Stock Tantalium CapacitorTAJBVishayType E1 referenceCETP Stock Actives Ampli OpLM108ANSCBare die1 reference03/22/2004 NPN Tansistor2N2222AMotorolaBare die1 reference12/15/2003 PNP Transistor2N2907AMotorolaBare die1 reference12/15/2003 Zener diode1N4100MSCBare die1 reference12/15/2003 Dual JFET U404U404SiliconixBare die1 referenceCETP Stock Dual JFET U422U422SiliconixBare die1 referenceCETP Stock Current regulator diodeCR047SiliconixBare die1 referenceCETP Stock DescriptionOriginQuantityDelivery date Printed Circuits 1st Amplifier levelCICOREL1 reference01/15/ nd Amplifier levelCICOREL1 reference01/15/2004 Power supply regulatorCICOREL1 reference01/21/2004 Input of calibrationCICOREL1 reference01/15/2004 Shielding levelsCICOREL3 references01/26/2004 Connectic CICOREL CIBEL 2 references01/21/ references 7 references 9 references The first lot, received in December was rejected at visual inspection

THEMIS SCM CDR MC VASSAL - 3D PLUS CETP 04/08/ Lot Acceptance Test For all components the following tests are performed : Visual Inspection Solderability test, Lead Integrity and Lead Finish Adhesion Lot Acceptance Test  Electrical test at Tamb  1000hrs life test at 125°C (under polarization)  Electrical tests at –55°C, Tamb, +125°C  Drift calculation at Tamb LAT are performed in partnership with LCIE, according to 3D PLUS Procedure 3DPA LAT report : Component typeNbr of partstests atStatusResultsComments Bare die* U42220 parts + 2 ref. T0, 240 hrs, 1000 hrs Closed20 PASS, 0 FAILLot accepted U40420 parts + 2 ref.Closed20 PASS, 0 FAILLot accepted CR04720 parts + 2 ref.Closed20 PASS, 0 FAILLot accepted 2N2222A20 parts + 2 ref.Closed19 PASS, 1 FAILLot accepted** 2N2907A20 parts + 2 ref.Closed20 PASS, 0 FAILLot accepted 1N parts + 2 ref.Closed20 PASS, 0 FAILLot accepted LM108A20 parts + 2 ref.Open-Tests 1000 hrs: 05/19/04 10 Resistor network10 parts + 1 ref. T0, 500 hrs, 1000 hrs Open- Tests 500 hrs: 05/14/04 Tests 1000 hrs: 06/19/04 CMS 21 Resistors & Capacitors 10 parts + 1 ref. T0, 500 hrs, 1000 hrs Open- * Bare die are mounted in a TO39 package to facilitate tests ** 1 Fail after 240 hrs. The procedure 3DPA0350 (based on standard ESCC-Q-60-05) authorized 1FAIL for 20 parts

THEMIS SCM CDR MC VASSAL - 3D PLUS CETP 04/08/ FM manufacturing For the THEMIS mission, 3D PLUS has to manufacture : 7 Regulator Flight Models (5 FM, 1 spares, 1 LAT) 19 Amplifier Flight Models(15 FM, 3 spares, 1 LAT) Steps 1Flex assembly 2Flex electrical test at T amb (GoNoGo) 3Precap visual inspection of flex before stacking 4Module manufacturing 5Module electrical test at T amb (GoNoGo) 6Module screening Stabilization bake 72 hrs at +125°C Thermal cycles (x10) –55°C / +125°C Electrical test at T amb before burn-in with R&R Burn-in 168 hrs at +125 °C Electrical test at 3 temperatures after Burn-in Parameters drift calculation at T amb & P.D.A. Calculation Final visual inspection with dimensional measurement (3 modules) 7Varnishing 8Module Lot Acceptance Test 9Material review 10End Item Data Package

THEMIS SCM CDR MC VASSAL - 3D PLUS CETP 04/08/ FM Schedule Flex Assembly & Tests Module Assembly & Tests Screening LAT module Pre Cap Inspection FM delivery to CETP The key dates during FM manufacturing are : To : 04/05/0407/23/04End of JuneWeek 2109/30/04 EIDP