04.09.2003EP/ED group meeting1 ALICE PIXELS DETECTOR.

Slides:

Advertisements

Similar presentations

Pixel Chip Testing S. Easo, RAL Current Status of the Pixel Chip Testing. Plans for an LHCb Test Setup at CERN.

Advertisements

1 Pixel Bus Development Atsushi Taketani RIKEN/RBRC 1.Who is working 2.Over view of pixel bus 3. Manufacture process 4. Issues 5. Development / Production.

Hybrid pixel: pilot and bus K. Tanida (RIKEN) 06/09/03 Si upgrade workshop Outline Overview on ALICE pilot and bus Requirements Pilot options Bus options.

ITS-week CERN December 3, 2001 Michel Morel CERN EP/ED.

Muon EDR: Chamber design M2/3 R1/2 16/04/20031T.Schneider/LHCb Muon EDR 1.General description - AW read out -Cathode pad read out -HV supply 2.Details.

ITS TGeo geometry Status and challenges By Bjørn S. Nilsen The Ohio State University.

General needs at CERN for special PCB’s Philippe Farthouat CERN.

SPD general meeting Pixel bus and Pilot MCM Integration CERN October 8, 2002.

LBNL Michal Szelezniak, Eric Anderssen, Leo Greiner, Thorsten Stezelberger, Joe Silber, Xiangming Sun, Chinh Vu, Howard Wieman UTA Jerry Hoffman, Jo Schambach.

1 CARRIER BUS LAYOUT(a) ± 193 mm ladder1ladder mm mm Pixel chip Michel Morel EP/ED 09/ x 425µ 256 x 50µ Decoupling capacitors

Ladder QA Status. Ladder QA Summary Ladder Remarks 1XXXXXXXXOOOOOXOO left : short (via-GND) right chip3 : cannot mask 2OOOOOOOOOOOOOOO.

VELO upgrade electronics – HYBRIDS Tony Smith University of Liverpool.

WP7&8 Progress Report ITS Plenary meeting, 23 April 2014 LG, PK, VM, JR Objectives 2014 and current status.

A multi-chip board for X-ray imaging in build-up technology Alessandro Fornaini, NIKHEF, Amsterdam 4 th International Workshop on Radiation Imaging Detectors.

1 CARRIER BUS LAYOUT(a) ± 193 mm ladder1ladder mm mm Pixel chip Michel Morel EP/ED 09/ x 425µ 256 x 50µ Decoupling capacitors

SVX4 chip 4 SVX4 chips hybrid 4 chips hybridSilicon sensors Front side Back side Hybrid data with calibration charge injection for some channels IEEE Nuclear.

Fabian Hügging – University of Bonn – February WP3: Post processing and 3D Interconnection M. Barbero, L. Gonella, F. Hügging, H. Krüger and.

17/06/2010UK Valencia RAL Petals and Staves Meeting 1 DC-DC for Stave Bus Tapes Roy Wastie Oxford University.

M. Szelezniak1PXL Sensor and RDO review – 06/23/2010 STAR Hardware Prototyping Status.

Thomas Jefferson National Accelerator Facility Page 1 IPR October Independent Project Review of 12 GeV Upgrade Jefferson Lab October 18-20,

The ALICE Silicon Pixel Detector Gianfranco Segato Dipartimento di Fisica Università di Padova and INFN for the ALICE Collaboration A barrel of two layers.

PHENIX Silicon Pixel Detector Construction, Operation, and the first Results Atsushi Taketani RIKEN Nishina center RIKEN Brookhaven Research Center Outline.

1 Module and stave interconnect Rev. sept. 29/08.

Multilayer thin film technology for the STS electronic high density interconnection E. Atkin Moscow Engineering Physics Institute (State University) –

FEV Boards status N. Seguin-Moreau on behalf of

GigaTracker Working Group meeting Status of the GTK_carrier /03/2015.

L. Greiner 1IPHC meeting – September 5-6, 2011 STAR HFT LBNL Leo Greiner, Eric Anderssen, Thorsten Stezelberger, Joe Silber, Xiangming Sun, Michal Szelezniak,

ALICE DCS Workshop 28/29 May 2001 Vito Manzari, INFN Bari SSD (Silicon Strip Detector) SDD (Silicon Drift Detector) SPD (Silicon Pixel Detector) Detector.

First, let’s review the structure and use of a breadboard.

SALTRO TPC readout system Presented by Ulf Mjörnmark Lund University 1.

The SPD geometry in AliRoot Alberto Pulvirenti University & INFN Catania In collaboration with: Domenico Elia (INFN Bari) Outline:  Implementation  Volumes.

M. Alfonsi LNF/INFN Cagliari 5 May 2006 M1R1 mechanical requirements  Space constraint Frame and pannel Pads readout and trigger sectors Gas inlet and.

Pixel hybrid status & issues Outline Pixel hybrid overview ALICE1 readout chip Readout options at PHENIX Other issues Plans and activities K. Tanida (RIKEN)

CERN Rui de OliveiraTS-DEM TS-DEM Development of Electronic Modules Rui de Oliveira CERN State of the art technologies for front-end hybrids.

WP6 status report A. Di Mauro (CERN) ITS plenary meeting

Low Mass Rui de Oliveira (CERN) July

SPD CFSS screening/Harness RB24-RB26 /ALICE Week A. Pepato – INFN PD 1 CFSS and ES electrical screening for SPD Harness RB24-RB26 Electrical.

13 January 2004V. Manzari - Quark Matter Oakland1 The Silicon Pixel Detector (SPD) for the ALICE Experiment V. Manzari/INFN Bari, Italy for the.

MFT WG5: ladder disk and global assembly Stéphane BOUVIER & Sébastian HERLANT MFT WG7: Mechanics and Thermal studies Jean-Michel BUHOUR & Emili SCHIBLER.

Solid State Detectors for Upgraded PHENIX Detector at RHIC.

Vessel dimensions GTK assembly carrier Electrical connections Cooling pipes integration Vessel alignment with the beam Next steps Conclusion 3/10/20102.

AIDA ASIC review Davide Braga Steve Thomas ASIC Design Group 11 February 2009.

The Development of the Fabrication Process of Low Mass circuits Rui de Oliveira TS-DEM.

Leo Greiner IPHC1 STAR Vertex Detector Environment with Implications for Design and Testing.

DETECTOR PIXEL CHIP MCM PIXEL BUS COOLING TUBE PIXEL BUS AND PILOT MCM CONNECTIONS (1) SDM comp LASER DIODE Space reserved (15mm) for connections.

CERN SPD meeting, 4/06/2002V. Manzari for Bari SPD-Group1 Half-stave assembly Gluing procedure & glue characteristics Status of dummy components.

Pixel Atsushi Taketani RIKEN RIKEN Brookhaven Research Center 1.Overview of Pixel subsystem 2.Test beam 3.Each Components 4.Schedule 5.Summary.

Vessel dimensions GTK assembly carrier Electrical connections Cooling pipes integration Vessel alignment with the beam Next steps Conclusion 3/23/20102electro-mechanical.

WP7&8 Progress Report ITS Plenary meeting, 10 June 2014 LG, PK, VM, JR.

Integration of the MVD Demonstrator S. Amar-Youcef, A. Büdenbender, M. Deveaux, D. Doering, J. Heuser, I. Fröhlich, J. Michel, C. Müntz, C. Schrader, S.

Rene BellwiedSTAR Tracking Upgrade Meeting, Boston, 07/10/06 1 ALICE Silicon Pixel Detector (SPD) Rene Bellwied, Wayne State University Layout, Mechanics.

Module Radiation Length. Goals Estimate the expected radiation length of a module, based on the design and measurements on as-built modules Determine.

Atsushi Taketani 2005/06/03 VTX meeting 1 PIXEL BUS status 1.Circuit design 2.Design rule and design 3.Schedule.

Assembly, construction and testing of the ALICE Silicon Pixel Detector V. Manzari / INFN Bari, Italy for the SPD Project in the ALICE Experiment INFN and.

Low Mass Alice Pixel Bus Rui de Oliveira TE/MPE/EM 6/9/20161Rui de Oliveira Alice worshop.

Update on the activities in Milano M. Citterio and N. Neri on behalf of INFN and University of Milan SuperB Meeting: SVT Parallel Session.

Development of the readout electronics in Lund for the ILD TPC Vincent Hedberg, Leif Jönsson, Anders Oskarsson, Björn Lundberg, Ulf Mjörnmark, Lennart.

RIKEN/CERN pixel electronics/bus R&D plans Johann M. Heuser RIKEN - Radiation Laboratory PHENIX Silicon Upgrades Meeting 10 April 2003.

Status of the TPC readout electronics

Hybrid Pixel R&D and Interconnect Technologies

ALICE-MFT-WP5-FPC- vidyo

SVT front-end electronics

Minutes of the GTK carrier Design Review meeting

Pixel Module Interfaces Mauro Citterio On behalf of INFN Milano

Roberto Dinapoli CERN-CEM II,Montpellier For the ALICE Collaboration

Electronics for the E-CAL physics prototype

ATL-IC-ES new version available - approval starts

Ecal Front End Electronics

Silicon pixel detectors and electronics for hybrid photon detectors

Presentation transcript:

EP/ED group meeting1 ALICE PIXELS DETECTOR

EP/ED group meeting2 SECTOR Pixel bus Pilot MCM

EP/ED group meeting3 SECTOR

EP/ED group meeting4 PIXEL_BUS & PILOT MCM (right side) PIXEL BUS MCM Signals Analogue power Analogue ground 300µ digital power Digital ground Pixel readout chip Pixel detector Detector bias

EP/ED group meeting5 Pixel bus (version B) cross section Glue 5µ Kapton 8µ 1) AGND 50µm 2) VDDA 30µm 3) Horizontal signals 10µm 4) Vertical signals 10µm 5) VDD 15µm 6) GND 50µm 7) TOP layer10µm Aluminium 0.3 Ni/Au 1µ Copper

EP/ED group meeting6 300µm AGND VVDA SIGNALS GND VDD PIXEL BUS PROTOTYPE

EP/ED group meeting7 PIXEL BUS PROTOTYPE

EP/ED group meeting8 1 2 READOUT CHIP PIXEL DETECTOR Aluminium Polyimide CARBON FIBER SUPPORT 1 GND 50µ 2 VDD 50µ 3 SIG 1 10µ 4 SIG 2 10µ 5 SIG 3+ smd pad 10µ Glue COOLING TUBE Note: the drawing is not to scale SMD COMPONENTS HALF STAVE CROSS SECTION

EP/ED group meeting9 PIXEL_BUS & PILOT MCM (right side) 8mm PIXEL BUS MCM 8 ANAPIL PILOT CHIP GOL 100mm LASER+2 PIN DIODE 15mm Bonding pads Kapton extender’s soldering pads

EP/ED group meeting10 PIXEL_BUS & PILOT MCM (left side) 8mm MCM ANAPIL PILOT CHIP GOL 100mm LASER+2 PIN DIODE PIXEL BUS Kapton extender’s soldering pads 15mm Bonding pads

EP/ED group meeting11

EP/ED group meeting12 ALUMIUM GND Al VDD Cu GND Cu VDD PIXEL_BUS PIXEL_EXTENDER PIXEL_BUS AND EXTENDERS CONNECTIONS

EP/ED group meeting13 Ceramic carrier chip CHIP PACKAGE 1.27mm

EP/ED group meeting14 MCM Ceramic carrier chip CHIP PACKAGE

EP/ED group meeting15

EP/ED group meeting16

EP/ED group meeting17

EP/ED group meeting18

EP/ED group meeting19

EP/ED group meeting20 Status: PIXEL BUS. Pixel bus mirror version: tested and approved.. Pixel bus prototype (Cu & Al): in production 09/2003. Pixel bus prototype (Al): start production 10/2003. Final production at CERN (150 pieces): start 01/2004 PILOT MCM. Fr4 prototype: tested and approved.. Ceramic prototype : in production 10/2003. Final production at Sensorex: start end 2003