INTEGRATED CIRCUITS Dr. Esam Yosry Lec. #9. NPN Transistor Fabrication  Introduction  NPN Fabrication-Simple Flow  AMI Bipolar Transistor Process 

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Presentation transcript:

INTEGRATED CIRCUITS Dr. Esam Yosry Lec. #9

NPN Transistor Fabrication  Introduction  NPN Fabrication-Simple Flow  AMI Bipolar Transistor Process  Bipolar Fabrication –Masking Layers  Typical Bipolar Resistor Technology

Introduction ( Chip Fabrication Cycle)

NPN Transistor (BJT) Fabrication Example Emitter Base Collector

Bipolar Transistor

Bipolar Transistor Fabrication – Simple

AMI Bipolar Transistor Process Oxide P+substrate P-Epi Layer The beginning wafer is a P-epitaxial layer On a P+ substrate that is oxidized.

AMI Bipolar Transistor Process N-Tub Collector Oxide P-Epi Layer N-Tub Field Oxide Collector Field Oxide P-Epi Layer N-Tub Field Oxidation

AMI Bipolar Transistor Process N-Tub Field Oxide P-base Collector Field Oxide P-Epi Layer P-Base Formation P+ N-Tub Field Oxide P-base Collector Field Oxide P-Epi Layer P+ Contact Formation

AMI Bipolar Transistor Process N+P+ N-Tub Field Oxide P-base Collector N+ Field Oxide P-Epi Layer N+ Emitter and Collector Contact Formation N+P+ N-Tub Field Oxide P-base Collector N+ Field Oxide P-Epi Layer Oxide Contact Apertures Oxide

Bipolar Fabrication – Masking Layers Mask No.Physical LayerAMI NameGDS Level No. 1N-type WellN_WELL1 2Field OxideACTIVE3 3P-type BasePBASE2 4P+ S-D Ion ImplantP_PLUS_SELECT11 5N+ S-D Ion ImplantN_PLUS_SELECT12 6Contact OpeningsCONTACT14 7First MetalMETAL 115 8Vias between MetalVIA16 9Second MetalMETAL Bond Pad OpeningsGLASS18

Typical Bipolar Resistor Technology N-Tub Field Oxide P-base Field Oxide P-Epi Layer P-Base Resistor Formation N+P+ Top view of The resistor P+N+

Thanks Many thanks to Prof. Hany Fikry and Prof Wael Fikry for their useful materials that help me to prepare this presentation.