Muon trigger upgrades, missing since not aimed towards DOE funding PHENIX upgrades: view presented to DOE R&D $3.5M Construction $16.6M Au-Au p-p 200 Si-Si ++ p-p 500 Au-Au

PHENIX D M Lee

PHENIX D M Lee

PHENIX Institutional Responsibilities D M Lee taskinstitution mechanical support, coolingHYTEC/LANL integration, infrastructureBNL pixel hybrids, sensor/readoutLANL pixel pilotISU pixel assembly, ladder busLANL pixel femSUNY-S/B DCM’sColumbia

Simulations Tasks endcap Implementation of new geometry in PISA Continual update of geometry with evolving mechanical design Ministrip size determination - Detailed simulation of pp capability Detailed simulation of Au-Au capability Vertex tracking code Detailed track matching Integration with barrel and HPD/TPC Overall coordination - UNM, Doug Fields has expressed an interest in helping with the simulation and has a student. He hasn’t defined the level of effort yet. The simulations to date for the end caps have been done by Pat McGaughey and Dave Lee and the new geometry has been done by Hua Pei. Some interest in simulations has been expressed by Pat,Gerd, and Dave. Mechanical Tasks endcap and barrel Overall coordinaton Lee Ladder prototyping cooling test HYTEC Overall structure prototype HYTEC Production liason Lee, HYTEC Ladder assembly - Combined endcap/barrel assembly - Cooling system production Integration with PHENIX/HBD/TPC - Dave Lee has been working with a company, HYTEC, to do the mechanical design of the total support structure and cooling design for the barrel and endcap. They produced a conceptual design based on their work on ATLAS that covered ladder structures, cooling, and the combined barrel and endcap support. D M Lee

Sensor Tasks endcap Overall coordination - Ministrip Design Prototyping - Testing Testing with bump bonded frontend chip Bump bonding - Production liason Electronics endcap Overall coordination Kunde? Frontend ministrip chip design Kunde Prototype Frontend chip fermilab Testing frontend chip Kunde, fermilab Production frontend chip Kunde, fermilab Supporting chip design, pilot chip/chips Test supporting chip Slow control HV design - Readout cable design Power plant DCM liason to Chi Gerd Kunde has established a collaboration with Ray Yarema of FERMILAB to design the frontend chip to bump bond to the sensors. In addition all facilities at FERMILAB are available to us for Q/A, assembly testing, etc. Construction where ? Coordinator Integration electrical and mechanical who? D M Lee

FermiLab Electronics Cost Estimate Chip design/testing – 2 man-years - $275K (includes all overhead costs) Prototype chip fabrication- $40K (small chip), or $80K (large chip) Test board $5K Engineering run (10-12 wafers) $200K 9 Extra wafers using same masks - $45K Production wafer level testing –engineering, tech time, circuit board, probe card - $60K Contingency?? PHENIX Beginning cost basis D M Lee

Fermilab Electronics Schedule Estimate Design specifications completed 10/03 Start design 12/03 Submit prototype 7/04 Prototype testing completed 12/04 Redesign completed for engineering run 1/05 Engineering run back 3/05 PHENIX D M Lee

PHENIX D M Lee

Physicist- mechanical liason, electronic liason, simulation – 3 FTE Electronic Engineer – Fermilab – construction Budget – 2 FTE Electronic Integration Engineer – construction Budget FTE Tech – construction budget – 2 FTE Lab space, Q/A,Assembly Infrastructure – lab space, testing assembly, FNAL, HYTEC, LANL, BNL Institutionals LANL, ISU,Columbia,UofCol,UNM,NMSU?,Ecole Poly?, Saclay?, SUNY-SB, PHENIX LANL Manpower Estimate D M Lee

Construction Project 2 – EndCapsDOE (k$) Mechanical support and cooling (2 endcaps)195 Hybrid pixel layers (2 encaps)4766 Management100 Total5061 Overhead on DOE contribution % contingency2458 Total8849 PHENIX Initial endcap cost estimate D M Lee

PhysicistPhysics AnalysisSilicon Upgrade Barnes2020 Brooks7525 Burward-Hoy100 Kunde40 40 Lee2550 Leitch100 Liu7525 McGaughey50 50 Moss20 Silvermyr100 Sullivan40 vanHecke5050 PHENIX Physicist Manpower Estimate D M Lee