An update on Power Pulsing with SDHCAL Kieffer Robert IPN Lyon « CALICE collaboration meeting » May 2011, CERN

Slides:



Advertisements
Similar presentations
Jeudi 19 février 2009 Status of SPIROC chips Michel Bouchel, Stéphane Callier, Frédéric Dulucq, Julien Fleury, Gisèle Martin-Chassard, Christophe de La.
Advertisements

SKIROC New generation readout chip for ECAL M. Bouchel, J. Fleury, C. de La Taille, G. Martin-Chassard, L. Raux, IN2P3/LAL Orsay J. Lecoq, G. Bohner S.
20 Feb 2002Readout electronics1 Status of the readout design Paul Dauncey Imperial College Outline: Basic concept Features of proposal VFE interface issues.
28 August 2002Paul Dauncey1 Readout electronics for the CALICE ECAL and tile HCAL Paul Dauncey Imperial College, University of London, UK For the CALICE-UK.
Development of Readout ASIC for FPCCD Vertex Detector 01 October 2009 Kennosuke.Itagaki Tohoku University.
CALICE ECAL/AHCAL Electronics 5-6 July DESY L.Caponetto, H.Mathez 1 Developments and Planning towards 1 m 3 Technological DHCAL Prototype Didier.
AHCAL Electronics. Status EUDET Prototype Mathias Reinecke for the DESY AHCAL developers EUDET Electronics/DAQ meeting London, June 9th, 2009.
Second generation Front-end chip for H-Cal SiPM readout : SPIROC DESY Hamburg – le 13 février 2007 M. Bouchel, F. Dulucq, J. Fleury, C. de La Taille, G.
C. Combaret TILC april m2 GRPC Acquisition System C. Combaret, IPN Lyon For the EU DHCAL collaboration
AHCAL Electronics. Status Commissioning and Integration Peter Göttlicher for the AHCAL developers CALICE meeting UT Arlington, March 12th, 2010.
C. Combaret 14 jan 2010 SDHCAL DAQ status in lyon C. Combaret, for the IPNL team.
AHCAL – DIF Interface EUDET annual meeting – Paris Oct M. Reinecke.
AHCAL electronics. Status and Outlook Peter Göttlicher for the AHCAL developers CALICE meeting UT Arlington, March 11th, 2010.
AHCAL Electronics. Status and Outlook Mathias Reinecke CALICE collaboration meeting Cambridge, UK March 16th-19th, 2012.
Front End Circuit.. CZT FRONT END ELECTRONICS INTERFACE CZTASIC FRONT END ELECTRONICS TO PROCESSING ELECTRONICS -500 V BIAS+/-2V +/-15V I/O signal.
08/10/2007Julie Prast, LAPP, Annecy1 The DHCAL DIF and the DIF Task Force Julie Prast, LAPP, Annecy.
EUDET FEE status C. de LA TAILLE. EUDET annual meeting 6 oct 08 cdlt : FEE statrus 2 EUDET module FEE : main issues 2 nd generation ASICs –Self triggering.
C. Combaret DIF_GDIF_MDIF_D ASU 6x 24 HR2 ASU USB Hub RPi USB2 DCC SDCC RPi USB 1 hub+Rpi for 4 cassettes 1 DCC for 8 cassettes (1 spare) Trigger.
P. Baron CEA IRFU/SEDI/LDEFACTAR Meeting Santiago de Compostela March 11, A review of AFTER+ chip Its expected requirements At this time, AFTER+
Features of the new Alibava firmware: 1. Universal for laboratory use (readout of stand-alone detector via USB interface) and for the telescope readout.
Organization for Micro-Electronics desiGn and Applications HARDROC 3 for SDHCAL OMEGA microelectronics group Ecole Polytechnique CNRS/IN2P3, Palaiseau.
Vendredi 18 décembre 2015 Status report on SPIROC chips Michel Bouchel, Stéphane Callier, Frédéric Dulucq, Julien Fleury, Gisèle Martin- Chassard, Christophe.
Towards a 1m 3 Glass RPC HCAL prototype with multi-threshold readout M. Vander Donckt for the CALICE - SDHCAL group.
AHCAL Electronics. Status Commissioning Mathias Reinecke for the AHCAL developers HCAL main meeting Hamburg, Dec. 10th, 2009.
L.Royer– Calice LLR – Feb Laurent Royer, J. Bonnard, S. Manen, P. Gay LPC Clermont-Ferrand R&D pole MicRhAu dedicated to High.
SPIROC update Felix Sefkow Most slides from Ludovic Raux HCAL main meeting April 18, 2007.
C. Combaret 27 jan 2010 SDHCAL Power pulsing tests status in lyon C. Combaret, for the IPNL team.
LC Power Distribution & Pulsing Workshop, May 2011 Super-ALTRO Demonstrator Test Results LC Power Distribution & Pulsing Workshop, May nd November.
17-19/03/2008 Frédéric DULUCQ Improvements of ROC chips VFE - ROC.
Semi Digital HCAL Data analysis results Robert Kieffer Institut de Physique Nucléaire de Lyon 10/02/
European DHCAL development European DHCAL development CIEMAT,IPNL,LAL, LAPP,LLR, PROTVINO, SACLAY CIEMAT,IPNL,LAL, LAPP,LLR, PROTVINO, SACLAY Status :
The Prototype Simulation of SDHCAL Ran.Han Gerald.Grenier Muriel.Donckt IPNL.
Julie Prast, Calice Electronics Meeting at LAL, June 2008 Status of the DHCAL DIF Detector InterFace Board Sébastien Cap, Julie Prast, Guillaume Vouters.
M. TWEPP071 MAPS read-out electronics for Vertex Detectors (ILC) A low power and low signal 4 bit 50 MS/s double sampling pipelined ADC M.
CALICE calorimeters Power Issues Kieffer Robert IPN Lyon « Linear Collider Power Distribution and Pulsing workshop » May 2011, LAL
Front-End electronics for Future Linear Collider calorimeters C. de La Taille IN2P3/LAL Orsay On behalf of the CALICE collaboration
MaPMT Readout with boardBeetle: First Experiences Beetle User meeting, Zürich, Stephan Eisenhardt University of Edinburgh  Testbeam experiences:
HARDROC2: First measurements. HR2 status, Hambourg 12 dec 08, NSM 2 HARDROC2 4.3mm 4.5 mm Ceramic: 4.3 mm Plastic (Thin QFP): 1.4 mm 28 mm Hardroc2 submission:
DHCAL Jan Blaha R&D is in framework of the CALICE collaboration CLIC08 Workshop CERN, 14 – 17 October 2008.
14 jan 2010 CALICE/EUDET FEE status C. de LA TAILLE.
An update on Power Pulsing with SDHCAL Kieffer Robert IPN Lyon « CALICE collaboration meeting » May 2011, CERN
HARDROC: Readout Chip for CALICE/EUDET Digital Hadronic calorimeter Nathalie Seguin-Moreau.
HaRDROC performance IN2P3/LAL+IPNL+LLR R. GAGLIONE, I. LAKTINEH, H. MATHEZ IN2P3/IPNL LYON M. BOUCHEL, J. FLEURY, C. de LA TAILLE, G. MARTIN-CHASSARD,
SDHCAL. outline  SDHCAL concept, validation and construction  Test Beam and technological prototype performance  Perspectives and Conclusion  SDHCAL.
SKIROC status CERN – CALICE/EUDET electronic & DAQ meeting – 22/03/2007 Presented by Julien Fleury.
1 Second generation Front-end chip for H-Cal SiPM readout : SPIROC Réunion EUDET France – LAL – jeudi 5 avril 2007 M. Bouchel, F. Dulucq, J. Fleury, C.
June 13rd, 2008 HARDROC2. June 13rd, 2008 European DHCAL meeting, NSM 2 HaRDROC1 architecture Variable gain (6bits) current preamps (50ohm input) One.
AHCAL Electronics. Status of Integration Mathias Reinecke for the DESY AHCAL developers AHCAL main and analysis meeting Hamburg, July 16th and 17th, 2009.
CALICE/EUDET FEE status C. de LA TAILLE. 31 aug 2009 EUDET SC meeting Status of JRA3 Front End Electronics 2 ILC front-end ASICs : the ROC chips SPIROC.
News from the 1m 2 GRPC SDHCAL collection of slides from : Ch.Combaret, I.L, H.Mathez, J.Prast, N.Seguin, W.Tromeur, G.Vouters and many others.
11 may 2010 Performance of 2 nd generation ASICs for CALICE/EUDET C. de LA TAILLE OMEGA-LAL Orsay.
CALICE/EUDET FEE status C. de LA TAILLE. 16 jun 2009 TB meeting FNAL ASICs for CALICE/EUDET 2 First generation ASICs Readout of physics prototypes (ECAL,
AHCAL Electronics. Status Commissioning Mathias Reinecke for the AHCAL developers EUDET electronics and DAQ meeting Paris Palaiseau, Jan. 14th, 2010.
SKIROC status Calice meeting – Kobe – 10/05/2007.
CALICE, Shinshu, March Update on Micromegas TB analysis Linear Collider group, LAPP, Annecy CALICE collaboration meeting 5-7 March 2012, Shinshu,
HARDROC2: Before production in2p3
Test Beam Request for the Semi-Digital Hadronic Calorimeter
Digital Interface inside ASICs & Improvements for ROC Chips
HR3 status.
Iwaki System Readout Board User’s Guide
R&D activity dedicated to the VFE of the Si-W Ecal
Status of the DHCAL DIF Detector InterFace Board
Status of n-XYTER read-out chain at GSI
02 / 02 / HGCAL - Calice Workshop
STATUS OF SKIROC and ECAL FE PCB
SKIROC status Calice meeting – Kobe – 10/05/2007.
HARDROC STATUS 17 mar 2008.
SKIROC status CERN – CALICE/EUDET electronic & DAQ meeting – 22/03/2007 Presented by Julien Fleury.
Stefan Ritt Paul Scherrer Institute, Switzerland
AIMS 1- Build SDHCAL prototype of 1m3 as close as possible to the one
Presentation transcript:

An update on Power Pulsing with SDHCAL Kieffer Robert IPN Lyon « CALICE collaboration meeting » May 2011, CERN

 Intro: SDHCAL  Part I: The power pulsing with HARDROCs  Part II: Beamtest under B CERN  Conclusion Outline

 Absorber: 2 cm thick iron plates sensitive cassette readout board GRPC  Each sensitive cassette contains a readout board stick to a GRPC. 50 millions  Total (barrel + end caps): 50 millions readout channels (1x1cm 2 ) 7.5 μW/channel  HARDROC power dissipation: 7.5 μW/channel (using power pulsing) =>375 W =>375 W for the whole SDHCAL very front end boards.  Detector interface cards located on border sides host FPGAs: these cards will probably need active cooling or the use of specific power pulsed ASICs to operate data transfer tasks.  Absorber: 2 cm thick iron plates sensitive cassette readout board GRPC  Each sensitive cassette contains a readout board stick to a GRPC. 50 millions  Total (barrel + end caps): 50 millions readout channels (1x1cm 2 ) 7.5 μW/channel  HARDROC power dissipation: 7.5 μW/channel (using power pulsing) =>375 W =>375 W for the whole SDHCAL very front end boards.  Detector interface cards located on border sides host FPGAs: these cards will probably need active cooling or the use of specific power pulsed ASICs to operate data transfer tasks. SDHCAL

readout board DIF (detector interface) The readout board hosting 24 chips connected through a daisy chain scheme is controled by a DIF (detector interface) This board is fixed on a 50x33 cm 2 GRPC detector. SDHCAL power pulsing test ASU The active sensitive unit: A non-magnetic metallic cassette contains this assembly. 21/05/11 DIF Redout board 1536 channels

SDHCAL power pulsing principle 21/05/11 Readout architecture common to all calorimeters and minimization of data lines & power  Daisy chain using token ring mode  Open collector, low voltage signals  Low capacitance lines Acquisition DAQIDLE MODE Chip 0 Chip 1 Acquisition DAQIDLE MODEIDLE Chip 2 Acquisition IDLE MODEIDLE Chip 3 Acquisition IDLE MODEIDLE Chip 4 Acquisition IDLE MODEIDLEDAQ 1ms (.5%).5ms (.25%) 1% duty cycle99% duty cycle 198ms (99%) 5 events3 events 0 event 1 event 0 event Chip 0Chip 1Chip 2Chip 3Chip 4 Data bus Courtesy : N.Seguin Moreau LAL

Power Pulsing in HARDROC Power Pulsing in HARDROC ALWAYS ON  Shut down bias currents and reference voltages with vdd: ALWAYS ON POWER PULSED ON/OFF  Bandgap + other ref voltages + master I : POWER PULSED ON/OFF ALWAYS ON  Shut down bias currents and reference voltages with vdd: ALWAYS ON POWER PULSED ON/OFF  Bandgap + other ref voltages + master I : POWER PULSED ON/OFF Power pulsing lines AnlogADCDigital  3 Power pulsing lines used: Anlog, ADC, Digital setting ON/OFF the related slow control shift registers  Each stage can be power pulsed (or not) by setting ON/OFF the related slow control shift registers. Power pulsing lines AnlogADCDigital  3 Power pulsing lines used: Anlog, ADC, Digital setting ON/OFF the related slow control shift registers  Each stage can be power pulsed (or not) by setting ON/OFF the related slow control shift registers. Slow control shift registers Analog power line ADC power line

Power lines sequence Power lines sequence Power analog. (DAQ) Power DAC (DAQ) Power digital (DAQ) Power digital (POD) The Power On Digital manage the LVDS buffers to provide clock signal only when needed. When the StartReadout comes from the daisy chain loop to trigger the data transfer, Power digital line is automatically switched ON by the POD. Idle READOUT 4ms/chip Abs. Max. ACQUISITION Controled by the DIF POD module

Power consomption on HARDROC Power consomption on HARDROC HR2 ON Vdd_pa5.5 mA Vdd_fsbx312.3 mA Vdd_d0,1,27.3 mA Vdd_bandgap1.2 mA Vdd_dac0.84 mA Vddd0.67 mA vddd20.4mA (=0 if 40MHz OFF) Total (noPP)29 mA Total with 0.5% PP 145 µA Pwr_on_a alone26.5mA Pwr_on_dac1.0 mA Pwr_on_d1.0 mA ALL OFF<4µA ILD Requirement:  10 µW/ch with 0.5% duty cycle  200 µA for the entire chip (64 channels) HR2 power consomption measurement:  29 mA x 3.3V ≈ 100 mW => 1.5 mW/ch  7.5 µW/ch with 0.5% duty cycle Power consomption of each digital part Anlog ADCDigital Power consomption setting up the tree power lines: Anlog, ADC, Digital

Power pulsing under testbeam conditions

Power pulsing test beam June 2010: 10 days, SPS H2, parasitic operation Beam conditions: High Rate Aim: PowerPulsing tests using B field. PowerPulsed events: 42 kEvents Non-PowerPulsed events: 74 kEvents Beam Beam 32x48 cm 2 GRPC field B field 3T Magnet A testbeam under B field I Current (Power Pulsing)

First tests with B field Power pulsing cycle Power On Period: 10ms (100 Hz) DutyCycle: 2/10 2 ms Enable Acquisition Trigger for chip readout Injecting on falling edge through a 2pC build in capacitor Scintillator Coincidence « In Spill » Signal & Veto From Acquisition DIF Trigger Power On ASU Busy Trigger

Clock period: Time selection for triggered events: Noise contamination ratio: Noise Signal+Noise 0<EvTime<1.2us 1% 400ns Data time structure no Power Pulsing Time to trigger spectra Time to external trigger in clock counts

First tests with B field Efficiency with power pulsing About 4% efficiency loss! 3T B field Remember my CALICE CASBALANCA

suspicious behaviour power pulsingfiltered out A suspicious behaviour as been pointed out in the time to trigger distribution using power pulsing! First we filtered out these events. Digging into the data to understand Noise Signal+Noise? Signal+Noise ? Time to external trigger in clock counts the classical scheme (right peak) In the HARDROC, there is a double latch procedure applied on the BCid if the reset command is set before start_acquisition command adding 3 clock count to this timing flag: this is the classical scheme (right peak). the first trigge (left peak) On each power cycle, the first trigger is recorded without these 3 clock count because the reset happen after the start_acquisition command (left peak). Digging in the DIF’s FPGA firmware we found the reason of this double peak structure! Two kind of Bcid:

First tests with B field Digging into the data to understand Some trigger have been taken by the DIF during the waking up time. Indeed, in the firmware the trigger veto was removed during all power_on period, but before the 100μs waking time there is no data in the chip to be readed out. => First these no data triggers where thought as inefficient triggers an we lose efficiency. Spatial cut in data 20 cm Cut 13 cm Cut Position X (cm) Position Y (cm) Another firmware faillure: trigger recorded while HARDOC is sleeping Only the triggers taken in the beam area are taken in account as good events for efficiency studies.

First tests with B field Efficiency using Power Pulsing 3T B field Now we can say that: No efficiency loss No efficiency loss is found runing under power pulsing.

First tests with B field Timing of power cycle in the data Trigger taken in the same power-cycle (2ms) Trigger taken in two consecutive power-cycles (10ms) One cycle without trigger (20ms) Two cycles without trigger… Up to 11 power- cycles acquiring during a spill !!! Gaussian fit sigma: ±0.84 ms Power on 2ms

First tests with B field Summary Power pulsing scheme validated in testbeam with SDHCAL prototype, and the data is now well understood. Power consumption matches our goals. Up to now: Next:  Publish a paper about these interesting results.  Go to a large scale prof of power pulsing: maybe on SDHCAL physical protoype in a second period. (SDHCAL under construction: testbeam scheduled June 2011)

Backup slides

First tests with B field Injection with power pulsing Power On T: 100ms DutyCycle 2/ ms Enable Acquisition TriggerTrigger for chip readout Charge injection on falling edge

First tests with B field Injection with power pulsing Power On T: 100ms DutyCycle 2/ ms Enable Acquisition Trigger for chip readout Injecting on falling edge through a 2pC build in capacitor Power On DIF ASU Trigger

POWER PULSING: « AWAKE TIME » PWR ON FSB0 8 µs  All decoupling capacitors removed on bias voltages  PWR ON: ILC like (1ms,199ms)  PP of the analog part:  Input signal synchronised on PWR ON  Awake time= 8 µs DAC output (Vth) Trigger 25 µs PWR ON  Power pulsing of the 10 bit-DAC:  25 µs (slew rate limited) 21/05/1122

First tests with B field Injection with power pulsing

First tests with B field Injection with power pulsing We will use this point Charge: 0.54 pC Eff: 96.4% time stability. To check time stability.

First tests with B field Injection with power pulsing quite constant Suspecting threshold stability, we injected charges with different delays from Power- ON edge. Efficiency is quite constant during the 2ms power cycle. still ongoing Work is still ongoing to understand efficiency loss recorded on beam data.

First tests with B field Preliminary tests using B field B fieldeffect on cluster shape? Is B field having an effect on cluster shape? No Power Pulsing

Preliminary tests using B field no impactefficiency B field has no impact on efficiency. No Power Pulsing

Preliminary tests using B field B fielda bit multiplicity B field increase a bit the multiplicity. No Power Pulsing