Update on CLICpix design

Slides:



Advertisements
Similar presentations
NxN pixel demonstrator. Time to Digital Converter (2) Tapped delay line –128 cells, 100ps Two hit registers –One per both leading and trailing edge 7.
Advertisements

HCC Analog Monitor HCC Design Review April 24, 2014 Mitch Newcomer Nandor Dressnandt Aditya Narayan Amogh Halergi Dawei Zhang* * Original design work
Timepix Studies: Medipix Collaboration Summary and More Timewalk Plots Alessandra Borgia Marina Artuso Syracuse University Group Meeting – Thursday 20.
20 Feb 2002Readout electronics1 Status of the readout design Paul Dauncey Imperial College Outline: Basic concept Features of proposal VFE interface issues.
5ns Peaking Time Transimpedance Front End Amplifier for the Silicon Pixel Detector in the NA62 Gigatracker E. Martin a,b J. Kaplon b, A. Ceccucci b, P.
NA62 front end Layout in DM option Jan Kaplon/Pierre Jarron.
NA62 front end architecture and performance Jan Kaplon/Pierre Jarron.
FCP130 Fermi CMS Pixel Test Chip
GOSSIPO-2 chip: a prototype of read-out pixel array featuring high resolution TDC-per-pixel architecture. Vladimir Gromov, Ruud Kluit, Harry van der Graaf.
Timepix2 power pulsing and future developments X. Llopart 17 th March 2011.
Power pulsing strategy with Timepix2 X. Llopart 10 th May 2011 Linear Collider Power Distribution and Pulsing workshop Timepix3.
Evaluation of 65nm technology for front-end electronics in HEP Pierpaolo Valerio 1 Pierpaolo Valerio -
MEDIPIX3 TESTING STATUS R. Ballabriga and X. Llopart.
L. Gallin-Martel, D. Dzahini, F. Rarbi, O. Rossetto
L.Royer– Calice DESY – July 2010 Laurent ROYER, Samuel MANEN, Pascal GAY LPC Clermont-Ferrand R&D LPC Clermont-Fd dedicated to the.
Pierpaolo Valerio.  CLICpix is a hybrid pixel detector to be used as the CLIC vertex detector  Main features: ◦ small pixel pitch (25 μm), ◦ Simultaneous.
FEE2006, Perugia Simultaneous Photon Counting and Charge Integrating Readout Electronics for X-ray Imaging Hans Krüger, University of Bonn, Germany University.
VI th INTERNATIONAL MEETING ON FRONT END ELECTRONICS, Perugia, Italy A. Dorokhov, IPHC, Strasbourg, France 1 NMOS-based high gain amplifier for MAPS Andrei.
Building blocks 0.18 µm XFAB SOI Calice Meeting - Argonne 2014 CALIIMAX-HEP 18/03/2014 Jean-Baptiste Cizel - Calice meeting Argonne 1.
Phase-1 Design. i PHC Phase /04/2008 System Overview Clock, JTAG, sync marker and power supply connections Digital output.
PADI status Mircea Ciobanu 11 th CBM Collaboration Meeting February 26-29, 2007, GSI FEE1 PADI.
The design of the TimePix chip Xavier Llopart, CERN MPI-Munich, October 2006.
Fully depleted MAPS: Pegasus and MIMOSA 33 Maciej Kachel, Wojciech Duliński PICSEL group, IPHC Strasbourg 1 For low energy X-ray applications.
Development of an ASIC for reading out CCDS at the vertex detector of the International Linear Collider Presenter: Peter Murray ASIC Design Group Science.
Specifications & motivation 2  Lowering integration time would significantly reduce background  Lowering power would significantly reduce material budget.
1 Development of the input circuit for GOSSIP vertex detector in 0.13 μm CMOS technology. Vladimir Gromov, Ruud Kluit, Harry van der Graaf. NIKHEF, Amsterdam,
DESIGN CONSIDERATIONS FOR CLICPIX2 AND STATUS REPORT ON THE TSV PROJECT Pierpaolo Valerio 1.
Power Pulsing in Timepix3 X. Llopart CLIC Workshop, January
Valerio Re, Massimo Manghisoni Università di Bergamo and INFN, Pavia, Italy Jim Hoff, Abderrezak Mekkaoui, Raymond Yarema Fermi National Accelerator Laboratory.
65 nm CMOS analog front-end for pixel detectors at the HL-LHC
CLICpix2 Design Status Pierpaolo Valerio & Edinei Santin
ClicPix ideas and a first specification draft P. Valerio.
Thanushan Kugathasan, CERN Plans on ALPIDE development 02/12/2014, CERN.
L.Royer– Calice LLR – Feb Laurent Royer, J. Bonnard, S. Manen, P. Gay LPC Clermont-Ferrand R&D pole MicRhAu dedicated to High.
Sensor testing and validation plans for Phase-1 and Ultimate IPHC_HFT 06/15/ LG1.
CMOS MAPS with pixel level sparsification and time stamping capabilities for applications at the ILC Gianluca Traversi 1,2
LC Power Distribution & Pulsing Workshop, May 2011 Super-ALTRO Demonstrator Test Results LC Power Distribution & Pulsing Workshop, May nd November.
CLICpix2 Design Status Pierpaolo Valerio and Edinei Santin
Fermilab Silicon Strip Readout Chip for BTEV
Pixel detector development: sensor
65 nm CMOS technology in High Energy Physics Pierpaolo Valerio CERN
UPDATE ON CLICPIX2 DESIGN Pierpaolo Valerio Edinei Santin
-1-CERN (11/24/2010)P. Valerio Noise performances of MAPS and Hybrid Detector technology Pierpaolo Valerio.
CLICPIX AND MEDIPIX3-TSV PROJECTS Pierpaolo Valerio.
S. Bota – Calorimeter Electronics overview - July 2002 Status of SPD electronics Very Front End Review of ASIC runs What’s new: RUN 4 and 5 Next Actions.
Eleuterio SpiritiILC Vertex Workshop, April On pixel sparsification architecture in 130nm STM technology ILC Vertex Workshop April 2008 Villa.
M. TWEPP071 MAPS read-out electronics for Vertex Detectors (ILC) A low power and low signal 4 bit 50 MS/s double sampling pipelined ADC M.
CERN PH MIC group P. Jarron 07 November 06 GIGATRACKER Meeting Gigatracker Front end based on ultra fast NINO circuit P. Jarron, G. Anelli, F. Anghinolfi,
CBM 12 th Meeting, October 14-18, 2008, Dubna Present status of the first version of NIHAM TRD-FEE analogic CHIP Vasile Catanescu and Mihai Petrovici NIHAM.
R. Kluit Nikhef Amsterdam R. Kluit Nikhef Amsterdam Gossopo3 3 rd Prototype of a front-end chip for 3D MPGD 1/27/20091GOSSIPPO3 prototype.
UPDATE ON CLICPIX2 DESIGN Pierpaolo Valerio Edinei Santin
TIMEPIX2 FE STUDIES X. Llopart. Summary of work done During summer I have been looking at a possible front end for Timepix2 The baseline schematic is.
Medipix3 chip, downscaled feature sizes, noise and timing resolution of the front-end Rafael Ballabriga 17 June 2010.
Oscar Alonso – Future Linear Colliders Spanish Network 2015 – XII Meeting - Barcelona, January 2015 O. Alonso, J. Canals, M. López, A. Vilà, A. Herms.
CMOS Analog Design Using All-Region MOSFET Modeling
Technical status of the Gossipo-3 : starting point for the design of the Timepix-2 March 10, Vladimir Gromov NIKHEF, Amsterdam, the Netherlands.
NOISE MEASUREMENTS ON CLICPIX AND FUTURE DEVELOPMENTS Pierpaolo Valerio.
NEWS FROM MEDIPIX3 MEASUREMENTS AND IMPACT ON TIMEPIX2 X. Llopart CERN.
Pixel structure in Timepix2 : practical limitations June 15, Vladimir Gromov NIKHEF, Amsterdam, the Netherlands.
Low Power, High-Throughput AD Converters
GOSSIPO-3: Measurements on the Prototype of a Read- Out Pixel Chip for Micro- Pattern Gas Detectors André Kruth 1, Christoph Brezina 1, Sinan Celik 2,
End OF Column Circuits – Design Review
Charge sensitive amplifier
LHC1 & COOP September 1995 Report
Jan Soldat, Heidelberg University for the DSSC ASIC design groups
L. Ratti, M. Manghisoni Università degli Studi di Pavia INFN Pavia
Status of n-XYTER read-out chain at GSI
BESIII EMC electronics
Readout Electronics for Pixel Sensors
Readout Electronics for Pixel Sensors
Presentation transcript:

Update on CLICpix design Pierpaolo Valerio

ClicPix ClicPix is a pixel detector developed at CERN using 65 nm CMOS, mainly driven by the requirement for being used in a future linear accelerator (CLIC) The main feature is the small pixel pitch (25 μm), which requires the use of such a downscaled technology. Each pixel includes simultaneous TOA and TOT measurements The chip is meant to operate with bunch trains of 156 ns (with bunch crossings every 0.5ns) with a period of 20 ms (50 Hz) and it has an expected occupancy of approx. 2% to 5%. It implements a number of novel solutions which will be needed in most future projects (data compression, power gating…) A demonstrator of the ClicPix architecture with an array of 64x64 pixels has just been submitted.

Array architecture Analog part of adjacent pixels share biasing lines Digital part is shared between each two adjacent pixels

Analog pixel architecture IKRUM MFB2 MFB1 VFBK DAC CF Vth Vdout CTEST Digital part Idet Vtest Vin gm Vout CL MLEAK Bonding Pad CLEAK IKRUM/2 The frontend uses the Krummenacher architecture, with a single ended preamp, a two stage discriminator and a 4 bits DAC Switches are included to handle pulses of both polarities and to disconnect the test capacitor when it is not used

Analog Pixel Summary Analog circuitry size 14x25 μm Power supply 1.2 V (separated from digital power supplly) Total power consumption 6.5 μW Pad size 10 μm diameter (opening) Most of the analog structures are similar to circuits already tested in a previous test chip Power pulsing is implemented on a per-column basis, switching analog blocks to a “low power” state. Nominally the analog blocks will be on for ~20 μs with a 50 Hz frequency

Analog Pixel Characteristics   Simulations Peaking time 30ns TOA Accuracy < 10 ns Gain 44 mV/ke- Dynamic Range up to 45 ke- Linearity (TOT) < 5% at 45 ke- Equivalent Noise ~60 e- DC Spread (uncalibrated) σ = 160 e-

Analog Pixel Layout Equalization DAC Preamp Discriminator Feedback network Feedback network

Pixel logic Each pixel includes simultaneous TOA and TOT 1hit measurements, with Photon Counting mode for the threshold equalization process The clock is distributed along each column exploiting the delays of buffers to give each pixel a clock signal with a different phase, in order to simplify the clock distribution tree and to avoid a synchronous switch of every pixel in the matrix (which would affect the stability of the power supply). The readout was simulated with a 320MHz clock In order to minimize the area, state machines are implemented in an asynchronous way, using only logic gates The readout is on a per-column basis, distributing the full speed clock to one column at a time A (selectable) compression logic allows skipping pixels which were not hit during the acquisition. A cluster-based and column-based compression is also being implemented

Pixel logic summary Technology 65 nm (High-Vt Standard Cells) Logic size 275 μm2 Acquired Data TOT and TOA Counter Depth (LFSR) 4 bits TOT + 4 bits TOA (or counting, for calibration) Target Clock Speed 100 MHz (acquisition) 320 MHz (readout) Data type Full Frame Zero compression (pixel, super-pixel and column skipping) Acquisition Type Non-continuous Power Saving Clock gating (digital part), Power gating (analog part)

Pixel block diagram To the pixel above Clk Data Analog Frontend Disc_out Compression logic 4 bits TOT Clock divider 4 bits tuning DAC 4 bits TOA Enable logic Mask, TP Data HF Clk Data Analog_bias Readout Load_conf Shutter To the pixel below To the periphery

Clock distribution tree The clock is distributed along each column exploiting the delays of buffers to give each pixel a clock signal with a different phase, in order to simplify the clock distribution tree and to avoid a synchronous switch of every pixel in the matrix (which would affect the stability of the power supply). The readout was simulated with a 320MHz clock Periphery (synchronous clock tree)

Super-Pixel In ClicPix, pixel clustering in 2x8 arrays allows to further compress the data for low occupancies It also reduces the area because some of the electronics can be shared (clock distribution tree, biasing lines) HF Pixel Hit Flags

Readout Architecture Comparison Simulations were done with Geant4 simulating the actual CLIC beam: 512x512 pixels 8 bits/pixel 320MHz readout clock (DDR) Packet-based readout (red line), zero-compression with pixel, superpixel and column skipping (dotted black line) S. Arfaoui

Super-Pixel Layout Analog pixels Pixels and Super-Pixel logic

Power pulsing The specific application of the chip requires a very little duty cycle (the chip will acquire data for 156 ns every 20 ms), leaving the possibility to periodically turn off and on parts of the chip The main contribution to the power consumption is the analog front-end, which would use ~2W/cm2 if run continuously. A power pulsing scheme has been implemented allowing to reduce the average power consumption to less than 50 mW/cm2 (allowing the use of air cooling) In order to make the requirements for the power supply more relaxed, each column can be turned on at a different time to gradually turn on and off the chip Power pulsing is activated by an external signal and it switches the biasing of the structures which use the most power to a low-power state. During this power saving state the analog power can be switched off entirely

Periphery block diagram End of column block Data_in_column clk Data_out_column Analog_bias Clock gating logic To next column Clk_acquisition Data OUT Clk_readout Test_pulse Power_enable Readout Load_conf Shutter Periphery State Machine DACs config registers Power pulsing logic Poweroff Data IN Command register

Periphery and end-of-column A periphery logic with a command register is implemented to control all the features of the chip. This logic generates control signals for the various parts of the periphery and of the pixel array reading serial commands from an external pin During readout columns are read serially, as each column will have data of different lengths due to the zero-compression scheme DACs to generate reference voltages are included. An external absolute voltage reference is needed due to the lack of a band-gap block. Configuration data (e.g. for calibration or acquisition mode) are sent serially to each pixel, one bit per column, in order to reduce the speed of the clock in the array The periphery includes also a block that gates the clock, sending it to the array only when it’s necessary (and during readout only to one column at a time)

Current Status The demonstrator design was submitted on November, 26th The chip is expected to be delivered in January/February, testing will follow.

Thanks for your attention

Backup Slides

Premplifier schematic

Preamplifier The preamplifier is a single ended one stage common source amplifier, with a cascoded input to increase the gain (equal to 50 dB). The input transistors use a Deep n-well layout to minimize the noise injection from the power supplies. A metal-to-metal capacitor (using the three routing metals as plates) is included as a test capacitor of 10 fF (the vaue was chosen to be able to inject charges that cover the dynamic range of the counters with an input voltage lower than 1 V). Two switches are used to switch the voltage at one end of the test capacitor to inject charge into the system (they are controlled by the digital circuitry) The nominal biasing current of this block is 1.5 μA During the power pulsing “off” state, the biasing current is switched to a lower value with muxes placed at the bottom of each column

Feedback network schematic

Feedback network The feedback network uses a Krummenacher architecture, using only high-Vt transistors. A 3.2 fF metal to metal capacitor is used as a feedback capacitor, providing a gain of approx. 44 mV/ke-. Peaking time is ~30 ns The nonimal value of Ikrum (8 nA) was chosen to set the dynamic range of the TOT measurement, so that the counter will saturate at about 45 ke-. The front-end behaves slightly differently according to the polarity of the input pulse The compensation capacitor is a PMOS with source and drain terminals connected together Dummy transistors are included for mismatch-sensitive structures

TOT linearity The frontend has a linear TOT throughout all its the dynamic range (amplitude saturates with much lower charges) Uncertainty in the TOT count (mainly due to mismatch of the Ikrum mirror) is limited to one LSB of the counter Pulse length (us)

ENC (as a function of input C) The capacitances of the pad and the frontend are already included as part of the extracted parasitics The frontend show a linear increse of the rms noise by increasing the detector/bonding capacitance electrons

Time walk The time walk is reduced for high input charges Low charge inputs can produce pulses with a TOT count of 0. The TOT LSB is 2.8 ke-. The TOA can be corrected by using the TOT information. Two or three bins are enough to have a 10 ns resolution for all input pulses but those the with a TOT of 0. Delay (ns)

Polarity effect The front-end produces pulses with a different shape for different input polarities The effect is due to having a small compensation capacitor (for area issues) Pulses with different polarities but same energy will give different TOT measurements. This can be compensated by changing the Ikrum value

Front-end stability Open-loop Bode diagram was simulated (including parasitics) opening the circuit at the input of the preamplifier Phase margin is approx. 50 deg

Effect of Ikrum on TOT The plot shows the effect of Ikrum on the TOT for a 5 ke- pulse. TOT (ns)

Discriminator schematic

Discriminator The discriminator is a two stage open loop amplifier and it’s able to swing its output from 0.2V to 1 V with a 0.5 mV input swing. The delay of the discriminator is less than 5 ns, while the total current used is 4 μA. Switches are used to make sure that the output of the discriminator works in the same way regardless of the polarity of the input pulse. A third stage, a digital inverter, is included in the digital part of the pixel to further increase the gain and adapt the logic levels. The total simulated threshold mismatch sigma (due to both the discriminator and the DC output of the preamplifier) is 7.2 mV (equal to 160 e-). A calibration DAC is used to unbalance the currents flowing in the two branches of the first stage to compensate for the mismatch.

Calibration DAC schematic

Calibration DAC The calibration DAC is a 4 bit binary weighted current DAC. The LSB is 14 nA and it is sized to correct for a ±3 sigma variation in threshold. The NMOS high swing cascode output stage is included to control the voltage at the output nodes of the current mirrors of the DACs, as the nodes to inject the current in have a large voltage swing.

Threshold variation due to DAC output The plot is obtained by making a DC sweep of the discriminator input and checking when its output trips

Equalization DAC INL 10-3 INL of the DAC was simulated using Montecarlo simulations with mismatch models (Montecarlo runs with process variations are not possible with TSMC PDK). INL (LSB)

End-of-column block diagram Data_in_column Fast_or clk Data_out_column Poweroff Clock gating logic Compression Logic (flag) Bit counter From previous column Token To next column Pixel counter Clk_acquisition From previous column To next column Clk_readout Cluster counter Done reading Readout

End-of-column functionality One end-of-column per each two columns (as they share the digital part) The functionalities of the block are managing the clock gating, keep track of the data during readout and provide the array with configuration data. The readout of the chip is done serially, one “double column” at a time. Each pixel shifts the data to the next one making the counters work as a long shift register, using a fast readout clock (320 MHz) The counters are connected together (and to the pixels directly above and below) to act as a single shift register during the data readout phase. Each end-of-column has a state machine that counts the number of pixels being read out (with multiple counters, taking into account skipped pixels and skipped clusters) to be able send a start-reading signal to the next column