Electronic Packaging/CAE Labs National Tsing Hua University. Electronic Packaging/CAE Labs National Tsing Hua University. Electronic Packaging/CAE Labs National Tsing Hua University. Electronic Packaging/CAE Labs National Tsing Hua University. Parametric Study of Flip Chip Analysis Electronic Packaging Lab. of NTHU 國立清華大學動機系電子構裝實驗室

Electronic Packaging/CAE Labs National Tsing Hua University. Electronic Packaging/CAE Labs National Tsing Hua University. Electronic Packaging/CAE Labs National Tsing Hua University. Electronic Packaging/CAE Labs National Tsing Hua University o C 125 o C Accelerated Thermal Cycling Typical Conditions: 1hr/cycle Long duration time; -40 o C to 125 o C, 1000 cycles Implicit Transient problem Material nonlinear/Creep/Temperature dependent, Eutectic Solder (63Sn/37Pb) T m =183 o C FR4 T g is around 130 o C 20 o C 100 o C ( o C) = ( o C) Flip Chip (6mm x 6mm) 1/8 Finite Element Model (26,262 Solid-3D Elements) Electronic Packaging Lab. of NTHU 國立清華大學動機系電子構裝實驗室

Electronic Packaging/CAE Labs National Tsing Hua University. Electronic Packaging/CAE Labs National Tsing Hua University. Electronic Packaging/CAE Labs National Tsing Hua University. Electronic Packaging/CAE Labs National Tsing Hua University. Parametric study results for underfill fillet height Electronic Packaging Lab. of NTHU 國立清華大學動機系電子構裝實驗室

Electronic Packaging/CAE Labs National Tsing Hua University. Electronic Packaging/CAE Labs National Tsing Hua University. Electronic Packaging/CAE Labs National Tsing Hua University. Electronic Packaging/CAE Labs National Tsing Hua University. Parametric study results for silicon die thickness Electronic Packaging Lab. of NTHU 國立清華大學動機系電子構裝實驗室

Electronic Packaging/CAE Labs National Tsing Hua University. Electronic Packaging/CAE Labs National Tsing Hua University. Electronic Packaging/CAE Labs National Tsing Hua University. Electronic Packaging/CAE Labs National Tsing Hua University. Parametric study results for PWB thickness Electronic Packaging Lab. of NTHU 國立清華大學動機系電子構裝實驗室

Electronic Packaging/CAE Labs National Tsing Hua University. Electronic Packaging/CAE Labs National Tsing Hua University. Electronic Packaging/CAE Labs National Tsing Hua University. Electronic Packaging/CAE Labs National Tsing Hua University. Parametric study results for underfill CTE Electronic Packaging Lab. of NTHU 國立清華大學動機系電子構裝實驗室

Electronic Packaging/CAE Labs National Tsing Hua University. Electronic Packaging/CAE Labs National Tsing Hua University. Electronic Packaging/CAE Labs National Tsing Hua University. Electronic Packaging/CAE Labs National Tsing Hua University. Paametric study results for Young'smodulus of PWB (in-plane direction) Electronic Packaging Lab. of NTHU 國立清華大學動機系電子構裝實驗室

Electronic Packaging/CAE Labs National Tsing Hua University. Electronic Packaging/CAE Labs National Tsing Hua University. Electronic Packaging/CAE Labs National Tsing Hua University. Electronic Packaging/CAE Labs National Tsing Hua University. Parametric study results for Young's modulus of PWB (out-of-plnae direction) Max. Von Mises strain (E-03) underfill silicon die Young's modulus of PWB (out-of-plane direction, GPa) solder ball Electronic Packaging Lab. of NTHU 國立清華大學動機系電子構裝實驗室

Electronic Packaging/CAE Labs National Tsing Hua University. Electronic Packaging/CAE Labs National Tsing Hua University. Electronic Packaging/CAE Labs National Tsing Hua University. Electronic Packaging/CAE Labs National Tsing Hua University. Parametric study results for PWB CTE (in-plane direction) Electronic Packaging Lab. of NTHU 國立清華大學動機系電子構裝實驗室

Electronic Packaging/CAE Labs National Tsing Hua University. Electronic Packaging/CAE Labs National Tsing Hua University. Electronic Packaging/CAE Labs National Tsing Hua University. Electronic Packaging/CAE Labs National Tsing Hua University. Reliability of  BGA vs. Flip Chip Source: Electronic Packaging and Production, June, 1997 Electronic Packaging Lab. of NTHU 國立清華大學動機系電子構裝實驗室