EC_ASIC drawing (1) ASIC BASIC FASIC D 68 pi ns ASIC A 68 pi ns ASIC C ASIC E 120 pins ABCDEF 68 pi ns 68 pi ns 68 pi ns 68 pi ns.

Slides:



Advertisements
Similar presentations
Using three IR sensors, SensingBot can sense the front obstacles so it can avoid them. Sensing.
Advertisements

BumperBot uses two contact switches to go through a labyrinth. Bumper.
HK & LVPS for EUSO –TA / -Balloon G. Medina-Tanco, L. Santiago, H. Silva Lopez, F. Trillaud, C. Lopez, J. Rojas, A. De la Cruz, S. Guerrero, G. Leon.
- Grounding - Harness Shielding - PDM Electrical Architecture - DP Electrical Architecture EUSO-BALLOON DESIGN REVIEW, , CNES TOULOUSE Pierre.
EUSO-BALLOON CDR – Agenda (I). Internal interfaces overview Batteries and Low Voltage power Supplies PDM interfaces DP interfaces HK Interfaces List of.
- Battery Pack Technical Specifications - Battery Pack Design Descriptions - Battery Pack Connection Diagram - Battery Pack Architecture EUSO-BALLOON DESIGN.
EUSO BALLOON Battery Power Pack (PWP) RIKEN/UAH Héctor Prieto, Katsuhiko Tsuno, Marco Casolino.
CCD Clocking and Biasing CABAC_0 : Design Test_0 : Design Pierre Antilogus (from a Hervé Lebbolo’s talk) BNL, Raft Electronic Workshop January 25 th 2012.
Upgrade developments in Clermont-Ferrand Romeo Bonnefoy and François Vazeille Tilecal upgrade meeting (CERN, 13 June 2014) ● Handling tools ● Deported.
DESIGN OF THE HATCH OF THE INSTRUMENT BOOTH OF EUSO-BALLOON version v1.2 Writer : SYLVIE DAGORET- CAMPAGNE Final tests and Health tests1
EUSO General Meeting – Huntsville May 2003 FEW WORDS ON AUGER-EUSO Presented by Osvaldo Catalano.
Choosing the right preamplifier/discriminator comparing advantages and drawbacks : NL-277-L (Nanometrics), ASD-8 (Cern) and MAD4 (INFN Italy) Our favorite:
TOPIC-MAKING CONNECTION OF ONE SWITCH AND ONE SOCKET
- Where are the entry points of the instrument - Physical External links - Overview of the External Interfaces - Status - Conclusion EUSO-BALLOON DESIGN.
43.35” (LENGTH OF INNER LIQUID HE RESERVIOR)  CONNECTION CHAMBER: FF 4.75”  FF: FLANGE-TO-FLANGE DISTANCE 10.45” TO 12.45” 6.35” TO 8.35” (JACK -2” TO.
Current ILC work at Fermilab Electrical Engineering Dept.
MP Electronics 2 1IWF-EXP/ÖAW GRAZ  Power budget  Interface electronics: ~1.5 W  Probe electronics (standby): ~1.2 W  Heater power:~70 W  Power loss.
Leo Greiner IPHC testing Sensor and infrastructure testing at LBL. Capabilities and Plan.
Dimensions of the PDM frame: 167mm x 167mm x 28.7mm.
Main Board Status MB2 v1 for FATALIC & QIE 10/06/2015Roméo BONNEFOY - LPC Clermont1 Roméo BONNEFOY François Vazeille LPC Clermont-Ferrand.
EC front unit status. Outline Conclusions from mechanical prototype and actions taken Status of electrical prototype KIT’s work for TA Dev plan (tests)
CaRIBOu Hardware Design and Status
The EC-UNIT P. Barrillon on behalf of JEM-EUSO collaboration EUSO-BALLOON Phase A review 2 nd February 2012, CNES, Toulouse.
The PDM-block M. Casolino on behalf of JEM-EUSO collaboration EUSO-BALLOON Phase A review 2 nd February 2012, CNES, Toulouse.
27 th September 2007AIDA design meeting. 27 th September 2007AIDA design meeting.
AIDA 1 Mezzanine board Contacts for underside connectors Thermal contact pads.
1 Chap. 3 Interface. 2 Interface  Physical connection between node and transceiver  Network interface card (NIC)  Physical connection between transceivers.
1 PreFPIX2 Inner board and test beam triggering Gabriele Chiodini Fermilab - Jan 07, 02.
Positioning fork M. Ciappeti R. Vuillermet 29/09/20111.
TCSP Presentation #3 Team 14 SPOT DASH. Schematics 3 Pages 3 Pages Page 1: Buttons, LEDs, sensors related circuits Page 1: Buttons, LEDs, sensors related.
1 4 PCB: LEFT TOP 115 channels, LEFT BOTTOM (115), RIGHT TOP (106), RIGHT BOTTOM (106). For LEFT TOP board 115 channels we have: 115 smd connectors (AMP.
Testing of ABC  Not to scale! 100nF Edge Sensor wired to A9, A10 ? ABC nF NB graphic is not an exact match with “ABC_Pads_V5.2.pdf”
1/12/2010 R. CIARANFI 1 NEW NINO BOARD FOR RICH OLD AND NEW LOGISTIC NEW BOARD DESCRIPTION NEW MODULARITY 32 CH NEW FORM FACTOR FRONT END AREA AND DAQ.
Flange Plates to be Welded to Beam Flanges.
Specifications Asic description Constraints Interface with PDM board Schedule Summary.
Bottom half – ch 0-5 placed & routed FE PS PROC FIFO TRIG OSC RX/SHAP ADC DAC VME.
Assumptions: Cockcroft-Walton photomultiplier bases are the same for all ECAL sections Digital to analog converters are installed on the distribution boards.
J1 J3 J2 FF0FF1FF2FF3FF4FF5 DM DD System ACE DC  DC The Cartoon Guide to the ZPD.
EUSO BALLOON Battery Power Pack (PWP) RIKEN/UAH Héctor Prieto, Katsuhiko Tsuno, Marco Casolino 1.
Anomalies &/or differences with the configuration Explanations, analyzes, impacts Updates EUSO-BALLOON, Flight review 04/06/2014 Guillaume Prévôt (APC)
RICH2 support and cooling mechanics status update Massimo Benettoni July 30,
Chiho Wang ATLAS TRT Duke University IU, Oct Fuse Box Design & Mounting Chiho Wang Duke University.
Julie Prast, Calice Electronics Meeting at LAL, June 2008 Status of the DHCAL DIF Detector InterFace Board Sébastien Cap, Julie Prast, Guillaume Vouters.
Vessel dimensions GTK assembly carrier Electrical connections Cooling pipes integration Vessel alignment with the beam Next steps Conclusion 3/23/20102electro-mechanical.
Mathias Reinecke CALICE week - Manchester Electronics Integration - Status Mathias Reinecke for the AHCAL developers.
T HE PDM INTEGRATION P. Barrillon (LAL) & G. Prévôt (APC) On behalf of the PDM crew (Simon, Lech, Philippe, Sylvie B) EUSO-SPB/MiniEUSO progress meeting,
1 PST Heater Panel Design The PST heater panels are internally redundant resistive circuits printed onto a Kapton sheet with an aluminum backing. They.
SERVICE TRAINING EXPERT ALPHASTAR 1132 © MAO-SE-TC 1132_SE_EX_Handout_EN_12_  Collision protection switch  Collision protection switch retrofit.
Status of EPS Battery configuration finalized Solar panel layout –finalized Solar panel Substrate is ready for bonding EM – fabricated and Completed the.
Michel DUPIEUX IRAP Progress Meeting LAL 02/03/ EC interface with PDM.
HVPS Configurations JEM EUSO Balloon Pierre Prat 17/09/2012.
Pierre PRAT Progress the Michel DUPIEUX.
Specifications Asic description Constraints Interface with PDM board Planning Summary.
Backplanes for Analog Modular Cameras EVO meeting. March 14 th,
Week 22: Schematic Week 23-Week 27: Routing Gerber files have been available since 9th July 1st prototype: – PCB manufacturer: supervised by KIT – Cabling:
Andrei Nomerotski 1 Flex Status & AID A.Nomerotski, 18 June 2010.
EC electronic status. Outline Reminders History EC-front unit status EC_ASIC status What next ? 2.
Introduction of the EUSO-BALLOON 9th Progress Meeting Naples, November the 9th, 2012 Guillaume Prévôt, Sylvie Dagoret and Peter von Ballmoos 1 EUSO-BALLOON,
The EC-front development plan and planning S. Ahmad, P. Barrillon, D. Cuisy, S. Dagoret, P. Dinaucourt, R. Sliwa, JL. Socha EC design review – LAL – 1.
Baby-MIND Modules & Services
Project 1: 3-D Maze Patience Game (1)
Markus Friedl (HEPHY Vienna)
Calorimeter Mu2e Development electronics Front-end Review
- STT LAYOUT - SECTOR F SECTOR A SECTOR B SECTOR E SECTOR D SECTOR C
EC board for JEM-EUSO Design investigations
Case Design Version 2 P13036 – Notification Alert William Johnson.
HPS Motherboard Electronic Design
boardstack status: schedule
Flex Status A.Nomerotski, 4 May 2010.
Reader Swap out Guide.
Presentation transcript:

EC_ASIC drawing (1) ASIC BASIC FASIC D 68 pi ns ASIC A 68 pi ns ASIC C ASIC E 120 pins ABCDEF 68 pi ns 68 pi ns 68 pi ns 68 pi ns

EC_ASIC top view Fixation holes 15 mm 80 mm 20 mm 159 mm

EC_ASIC drawing (2)

56 mm ~ 8 mm Mechanical structure EC_ASIC (1.6 mm thick) Mechanical structure connectorconnector connectorconnector connectorconnector connectorconnector connectorconnector connectorconnector TOP View 120 pins connector

56 mm ~ 8 mm Mechanical structure EC_ASIC (1.6 mm thick) Mechanical structure Bottom View 68 pins connector from EC_ASIC (3.5 mm) + 68 pins connector from EC_anode (8.5 mm) + EC_anode pcb (1.2 mm)

Side view –estimation Mechanical structure EC_ASIC board CONNECTORS EC_anode ASIC

HK 1 2 BAT_RET (P) 28V_BAT (P) GND_28V (S) GND_3.3V (S) 28V (S) 3.3V (S) GND_M HVPS-1 would have DC/DC converters to isolate the powers GND_M V STATUS ON/OFF 3 DAC 6 Differential signals (LVDS) ( x2 = 18 wires) between HK and HVPS-1 4 differential transmitters 2 differential receivers CS_DAC CS_IO HVPS-1 MISO MOSI SCK MOSI 6 bidirectional signals 6 status signals I/O expander s 4 differential receivers MISO Interrupt SCK Interrupt HVPS-1 - HVPS-2 - HK - PDM-Board Interface Synoptic : 1 st flight version 7 D-Sub 15 F D-Sub 15 M 6 C-W D-Sub 9 F D-Sub 9M BATTERY 3 C-W 6 x 14 HV lines 3 x 14 HV lines STATUS 3 ON/OFF V GND_M HVPS-2 CS_DAC SCK MOSI CS_OUT 6 DAC 6 D-SUB 25 F D-SUB 25 M D-Sub 9 F D-Sub 9M VERSION USED 24 wires PDM_Board Micro-D 9 F Micro-D 9 M 4 differential receivers 4 differential transmitters 4 Differential signals (LVDS) ( x2 = 8 wires) between PDM_Board and HVPS-1 4 SWITCH COMMANDS 2 differential transmitters

Full PDM and potential areas for HVPS 2 possibilities for HVPS: 20 x 115 mm2 29 x 53 mm2 After discussions with Jaceks, APC group and Pierre  27 x 53 mm2 chosed

Reminder of the cables/interfaces/connections HVPS1 HVPS2 15 lines toward HK (15 D-SUB) 9 lines toward PDM board (9 micro-D) 14 x 3 HV cables 14 x 6 HV cables 28 V + gnd battery (9 D-SUB) 25 lines (25 D-SUB)

159 mm 27 mm 53 mm 14 * 3 HV cables 159 mm 27 mm 53 mm HVPS-1 14 * 6 HV cables HVPS-2 3D view of the HPVS NB: 159 mm and 53 mm are the maximum available Better if it is less than that to fit more easily. D-SUB 25 M To HVPS-1 D-SUB 25 F To HVPS-2 D-SUB 15 F To HK D-SUB 9 F To Battery Micro-D 9 M To PDM_Board

Fixation with 2 plates Top view Plate used to fixe the HVPS to the mechanical structure on the side.

~56 mm Lateral view ~120 mm Fixation plate Fixation to the Back part of the PDM mechanical Structure. Fixation of the HVPS To the fixation plate ~27 mm ~53 mm ZONE where to put the holes for the cables

~56 mm ~120 mm ~27 mm ~53 mm ZONE where to put the holes for the cables If HVPSs don’t lay directly on the fixation plate like bellow Other possible zones for cables

~56 mm ~60 mm ~53 mm ZONE where to put the holes for the cables Another (better) option: The plate could have half height and be fixed to the mechanical structure with 6 screws. OR

HVPS1 3CW + DAC + all DC/DCs HVPS2 6CW + Comman ds + DAC EC_anode Flex cables Ballon heater (fixation) EC_HV boards should be oriented like that

HVPS1HVPS2 Positionning of the PDM board on the PDM

FPGA Ballon heater (fixation) Positionning of the PDM board on the PDM with respect to the Balloon mechanic