RP detectors CTS Sensors now in production, full delivery between February and June 07 Production GUI and DB being finalised Test Procedure being defined with the LAB in Praha New Test LAB in Geneva University…

RP Card 1 st PCB Card with elect. components: functionality tested OK (see Gueorgui/Walter) Production of Kapton cards started Optimization of lamination process on support board to ensure good planarity

Assembly ( with DT2 ): tools Being finalized Manual positioning of the card vs support with XYΘ stage and 3D CMM Different glues under test

Assembly: packaging First exercise of packaging made with the thermo-mechanical mockup

Assembly: Mechanical decoupling Vacuum flange/ detector package decoupler Loading Springs Reference for Detector Package to Pot

Dec Jan Feb Mar Apr May Jun Jul Aug Sep Oct Nov Dec Temperature Cycling of thermomechanical prototype Consolidate design produce drawings Geometrical precision test Mechanical components order CE07 parts fabricate special parts prepare pipework / feedthroughs (incl. leak test) fabricate interface card flanges fabricate pot hats (Vacuum Praha) follow-up / reception Tooling gluing tools bonding tools detector assembly tools pipework bending/testing tools Hybrid lamination Chip mounting/ bonding Testing Sensor mounting/ bonding Testing Detector assembly Metrology Integration in pots Testing (incl. cooling) beam ? availability hybrid PCB/VFAT (tested) availability sensors (tested) availability interface card (tested) Installation in zone holiday period Test Results Thermo- mechanical prototype Full Integrated Module (10 planes + complete electronics). Extended lab tests. Beam test ? Preparation work area end of access to underground areas X-mas closure conceptual tests DT2 D/T TOTEM Internal Review TOTEM Bondlab TOTEM DT2 D DT2 2T TOTEM DT2 T 2T TOTEM Bondlab TOTEM 2T TS/DEM DT2 D/T TOTEM detector  pot insertion tool 1D, 1T Courtesy by C. Joram