Icecube DOM Main Board Status and Development Plans R. Minor October 2003

Icecube DOM MB Status and Development April – today –Rev 2 test and development (22 boards) Oct – Nov ’03 –Rev 3 fabrication and test (16 boards) Nov ’03 – Mar ’04 – Rev 4 fabrication and test (60 boards) March – June ’04 –Rev 5 for deployment (420 boards) Schedule

Icecube DOM MB Status and Development Rev 3 status –October – December ‘03 –First 4 cards due Oct 22, 12 more to follow 5 days after approval Changes from Rev 2 address memory performance at temperature and signal quality issues Testing at LBNL will include manual tests and STF testing Temp cycling of bare and loaded boards –+65, -40degC 10 cycles –First 4 cards to UW, later to LBNL –8 cards to UW, 8 cards to LBNL

Icecube DOM MB Status and Development Rev 4 plans –November – March ‘04 Design modifications as indicated by Rev 3 tests and internal review Final parts selection for reliability 60 cards to be fabricated “Qualification test” at UW –Longer term temperature tests –String operation tests –Some boards used for development at LBNL

Icecube DOM MB Status and Development Rev 5 plans –Initial production review November ‘03 Based on Rev 3 and Rev 4 tests Earlier than usual to allow long-lead parts purchasing –Production readiness review - January ‘04 Based on initial Rev 4 tests Qualification testing Vendor qualifications Fabrication process approval

Icecube DOM MB Status and Development Rev 5 Production (March – June ’04) –Full production and Q/A procedures in place –All parts as selected for reliability –ATWD production run including qualification tests –Any differences between Rev 4 and Rev 5 require formal Engineering Change Procedure and re- qualification testing –Fabrication begins March ‘04 –Testing begins April ’04 –Delivery April - June ‘04