SEMICONDUCTOR TECHNOLOGY -CMOS- Fire Tom Wada 2017/4/24

What is semiconductor and LSIs Huge number of transistors can be integrated in a small Si chip. The size of the chip is roughly the size of nails. Currently, 10M transistors can be integrated. 1000 times integration comparing to 20 yrs ago. The cost of the chip is roughly same. All electronic equipments are powered by LSIs. PCs, Cellular phones, 3D graphics, Internet. 2017/4/24

PC mother board Large Scale Integration 2017/4/24

SONY PLAYSTATION 2 MAINBOARD Rendering LSI Graphics LSI High Speed Memory Direct RDRAM 2017/4/24

Mobile Phone Mainboard Memory, Logic, Analog 2017/4/24

Key device is LSI INTEL Pentium III module 2017/4/24

This is a packaged LSI -Pentium III 300MHz Cache LSI- 20 mm 15 mm 2017/4/24

Si chip is molded in the package. 2 million transistor Chip is connected to the pins thru wires. 2017/4/24

6 inches Si wafer 2017/4/24

8 inches Si wafer Hundreds of Chips on a Si Wafer 2017/4/24

Several hundreds of chips are fabricated on a wafer simultaneously. 2017/4/24

Chip photo - Motion Estimation Chip for HDTV camera - 9.1 mm Your small finger’s nail size. 200M transistors. 8.6 mm 2017/4/24

Scanning Electron Microscope photo - Cross-section of the LSI - 2017/4/24 0.5 micron

Structure Of CMOS LSI Isolation Si Substrate Well Structure Latch Up PN-Isolation, Local oxidation Si Substrate Bulk, epitaxial , SOI Well Structure N-type well in P-type Substrate Latch Up PNP Bipolar Transistor and NPN Bipolar Transistor Fabrication Process Technology 2017/4/24

Cross-section of the LSI Metal wiring Poly-silicon Poly-silicon N+ N+ P+ P+ P-type MOS transistor N-type MOS transistor N-type well P-type Si substrate Si wafer 2017/4/24

Advanced Process Development Multi-level Metalization Module （BEP) 65nm Transistor module （FEP) Lithography(VUV, EPL) Mask Fine Cu interconnect SiGe/Metal gate Low κ interdielectric High κ Gate insulator CMPplanarization Low Resistance Ultra shallow junction Low Resistance Contact with High Aspect ratio Low stress Shallow Trench Isolation 2017/4/24

LSI integration trend - Moore’s law - 10B DVD-RAM Digital HDTV receiver DVD player DVD recorder 1B DVD-ROM 100M 10M The number of transistors are increasing by 58% per year. - Moore’s Law - Number of transistors on a chip Wide-TV, PHS phone 1M 100K 0.8 0.5 0.3 0.18 0.13 10K CHANNEL LENGTH (MICRON) Source: SEMATEC 1K 2017/4/24 81 83 85 87 89 91 93 95 97 99 01 03 05 07 09

Communications and Consumer Products Drive Semiconductor 45% Cellular Phones Digital Camera 40% Set-Top Box DVD Player 35% Internet Game Consoles Smart Cards/Kiosks 30% Application Market Growth Smart Appliance-Phone Advanced Desktop PC and Workstation 25% CAGR % (1997-2002) Multimedia PC Automotive Applications/GPS 20% Portable Computing Switching & LAN 1st Generation 15% Video Camera HDTV 2nd Generation 3rd Generation 10% Car Radio Color TV 5% Semiconductor Industry 0% 0% 5% 10% 15% 20% 25% 30% 35% 40% 45% 50% 55% SC Content (As % of Equipment Cost) Sources: Applied Materials Corporate Marketing estimates, Dataquest 2017/4/24

FABRICATION PROCESS ISSUES 2017/4/24

Ultra Clean Room 2017/4/24

Basic LSI process SEM photo of Logic LSIs lithography etching cleaning Layer Deposition SEM photo of Logic LSIs M1 M2 M3 M4 M5 M6 M7 lithography etching cleaning 2017/4/24

A Projection Light Source Lens Mask Lens Si Wafer Stage A A A A A A A A A A A A A A A A A A A A A A A A A Stage Y X Projection 2017/4/24

Packaging & Test Testing Wafer Test Wafer scribing Chips Assembly Flow Remove Process defect Chips Wafer Testing Functional Test，DC Test Pre Test Final Test I scribing Functional Test，DC/AC Test Chips Burn-In Mounting Ex.)Vcc:7V，Temp.:125℃, 24～42hrs Assembly Flow Bonding Final Test II Shipping Test Functional Test(at Speed)，DC/AC Test Enclosing Sample marking 2017/4/24

Large Scale Integration NMOS , PMOS and Wiring All Logic Function can be made Memory Element Can be made Billions of Transistors and wiring make LSI! 2017/4/24

CMOS NOT (Inverter) 2017/4/24

CMOS NAND と NOR A B f 1 A B f 1 2017/4/24

Classification Of LSI Logic LSI: Micro Processor, Digital Signal Processor (DSP), FPGA Memory LSI: RAM (DRAM, SRAM), ROM (Flash Memory) Analog LSI: ADC, DAC, Filter, Amplifier Micro Processor (PC’s central processing Unit) Perform Digital computation according to the program in Memory Integration in 7000 times in 25 years, (Moor’s Law) Clock Speed : 700 times in 25 years Memory LSI:　 Dynamic Random Access Memory: Main memory for Computer, 4-times density in 4 years Static Random Access Memory : work memory for mobile equipments Flash Memory : Nonvolatile memory , Digital Camera Storage Analog LSI: Used for interface, high speed RF interface, Analog to Digital Conversion, Digital to Analog Conversion 2017/4/24

Analog to Digital Conversion Sample the analog wave Convert to Digital format in Binary Same as f(t) to An Continuous time Discrete time ADC LSI 2017/4/24

Chip photo 1 SoC Flash Memory 2017/4/24

Chip photo 2 Mobile Digital TV receiver 2017/4/24

Final Report Task Please make a report on DSP or FPGA device and System design using the device in English or Japanese. Evaluation: 30% on device 30% on system 40% on design using the device Please submit a report to wada@ie.u-ryukyu.ac.jp no later than January 31st. 2017/4/24