Abstraction And Technology 1 Comp 411 – Fall /28/06 Computer Abstractions and Technology 1. Layer Cakes 2. Computers are translators 3. Switches and Wires (Read Chapter 1)
Abstraction And Technology 2 Comp 411 – Fall /28/06 Computers Everywhere ∙The computers we are used to Desktops Laptops Embedded processors Cars Mobile phones Toasters, irons, wristwatches, happy-meal toys
Abstraction And Technology 3 Comp 411 – Fall /28/06 Compiler for (i = 0; i < 3; i++) m += i*i; Assembler and Linkeraddi $8, $6, $6 sll $8, $8, 4 CPU Module ALU AB Cells A B CO CI S FA A Computer System ∙What is a computer system? ∙Where does it start? ∙Where does it end? Gates Transistors
Abstraction And Technology 4 Comp 411 – Fall /28/06 Computer Layer Cake ∙Applications ∙Systems software ∙Shared libraries ∙Operating System ∙Hardware – the bare metal Hardware Operating System Libraries Systems S/WApps Computers are digital Chameleons
Abstraction And Technology 5 Comp 411 – Fall /28/06 Computers are Translators ∙User-Interface (visual programming) ∙High-Level Languages Compilers Interpreters ∙Assembly Language ∙Machine Language x:.word 0 y:.word 0 c:.word lw$t0, x addi$t0, $t0, -3 lw$t1, y lw$t2, c add$t1, $t1, $t2 mul$t0, $t0, $t1 sw$t0, y int x, y; y = (x-3)*(y )
Abstraction And Technology 6 Comp 411 – Fall /28/06 Computers are Translators ∙User-Interface (visual programming) ∙High-Level Languages Compilers Interpreters ∙Assembly Language ∙Machine Language x:.word 0 y:.word 0 c:.word lw$t0, x addi$t0, $t0, -3 lw$t1, y lw$t2, c add$t1, $t1, $t2 mul$t0, $t0, $t1 sw$t0, y 0x x x x x x x706d6f43
Abstraction And Technology 7 Comp 411 – Fall /28/06 Why So Many Languages? ∙Application Specific Historically: COBOL vs. Fortran Today: C# vs. Java Visual Basic vs. Matlab ∙Code Maintainability High-level specifications are easier to understand and modify ∙Code Reuse ∙Code Portability ∙Virtual Machines
Abstraction And Technology 8 Comp 411 – Fall /28/06 Under the Covers ∙Input ∙Output ∙Storage ∙Processing Datapath Control
Abstraction And Technology 9 Comp 411 – Fall /28/06 Under the Covers ∙Input ∙Output ∙Storage ∙Processing Datapath Control
Abstraction And Technology 10 Comp 411 – Fall /28/06 Under the Covers ∙Input ∙Output ∙Storage ∙Processing Datapath Control Cathode Ray Tube (CRT) The “last vacuum tube” Now nearing extinction
Abstraction And Technology 11 Comp 411 – Fall /28/06 Under the Covers ∙Input ∙Output ∙Storage ∙Processing Datapath Control Liquid Crystal Displays (LCDs)
Abstraction And Technology 12 Comp 411 – Fall /28/06 Under the Covers ∙Input ∙Output ∙Storage ∙Processing Datapath Control
Abstraction And Technology 13 Comp 411 – Fall /28/06 Under the Covers ∙Input ∙Output ∙Storage ∙Processing Datapath Control
Abstraction And Technology 14 Comp 411 – Fall /28/06 Under the Covers ∙Input ∙Output ∙Storage ∙Processing Datapath Control Intel Pentium III Xeon
Abstraction And Technology 15 Comp 411 – Fall /28/06 Implementation Technology ∙Relays ∙Vacuum Tubes ∙Transistors ∙Integrated Circuits Gate-level integration Medium Scale Integration (PALs) Large Scale Integration (Processing unit on a chip) Today (Multiple CPUs on a chip) ∙Nanotubes?? ∙Quantum-Effect Devices??
Abstraction And Technology 16 Comp 411 – Fall /28/06 open closed Implementation Technology ∙Common Links? ∙A controllable switch ∙Computers are wires and switches open control
Abstraction And Technology 17 Comp 411 – Fall /28/06 Chips ∙Silicon Wafers Chip manufactures build many copies of the same circuit onto a single wafer. Only a certain percentage of the chips will work; those that work will run at different speeds. The yield decreases as the size of the chips increases and the feature size decreases. Wafers are processed by automated fabrication lines. To minimize the chance of contaminants ruining a process step, great care is taken to maintain a meticulously clean environment.
Abstraction And Technology 18 Comp 411 – Fall /28/06 Field Effect Transistors (FETs) ∙Modern silicon fabrication technology is optimized to build a particular type of transistor. The flow of electrons from the source to the drain is controlled by a gate voltage. SourceDrainGate Bulk n+ p I DS = 0 V DS
Abstraction And Technology 19 Comp 411 – Fall /28/06 Chips ∙Silicon Wafers Metal 2 M1/M2 via Metal 1 Polysilicon Diffusion Mosfet (under polysilicon gate) IBM photomicrograph (Si has been removed!)
Abstraction And Technology 20 Comp 411 – Fall /28/06 How Hardware WAS Designed ∙20 years ago I/O Specification Truth tables State diagrams Logic design Circuit design Circuit Layout
Abstraction And Technology 21 Comp 411 – Fall /28/06 How Hardware IS Designed ∙Today (with software) ∙High-level hardware specification languages Verilog VHDL
Abstraction And Technology 22 Comp 411 – Fall /28/06 Reconfigurable Chips ∙Programmable Array Logic (PALs) Fixed logic / programmable wires ∙Field Programmable Gate Arrays (FPGAs) Repeated reconfigurable logic cells
Abstraction And Technology 23 Comp 411 – Fall /28/06 Death of Silicon Diversity ∙In the future will there be more or fewer types of chips? ∙Programmability = Flexibility ∙One chip can be programmed to perform many functions ∙An ultra-flexible architecture might be designed to emulate any function required ∙High-volumes might compensate for wasted area ∙Computers are this ultimate circuit type ∙How many types of chips do we need? Memory chips Logic Chips Potato Chips (credit Anant Agrawal)
Abstraction And Technology 24 Comp 411 – Fall /28/06 Next Time ∙Computer Representations ∙How is X represented in computers? X = text X = numbers X = anything else ∙Encoding Information