Team 2: Bluetooth Mass Storage Device By Ryan Weaver Preliminary PCB Layout and Design Narrative 1 Yucel ParsakYuri Kubo Scott PillowRyan Weaver.

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Team 2: Bluetooth Mass Storage Device By Ryan Weaver Preliminary PCB Layout and Design Narrative 1 Yucel ParsakYuri Kubo Scott PillowRyan Weaver

Team 2: Bluetooth Mass Storage Device By Ryan Weaver 2 Yucel ParsakYuri Kubo Scott PillowRyan Weaver Connect a host PC via Bluetooth Connect a host PC via USB Transfer data to/from PC via Bluetooth or USB Review of Design Constraints Automatically charge onboard battery via USB Manage file system (browse, select, delete) Manage file system (browse, select, delete)

Team 2: Bluetooth Mass Storage Device By Ryan Weaver PCB Design Constraints 3 Yucel ParsakYuri Kubo Scott PillowRyan Weaver USB (D+/ D- Lines) Bluetooth Module Oscillators Power Supply

Team 2: Bluetooth Mass Storage Device By Ryan Weaver USB 4 Yucel ParsakYuri Kubo Scott PillowRyan Weaver D+/ D- Lines Full Speed Transfer Rate of 12 Mbit/s Susceptible to EMI ( 0.0–0.3V for low and 2.8–3.6V for high) Isolate the D+/ D- traces (Preferred spacing >10 mm) Trace lengths within 2 mm of each other (Preferred length 20–30 mm) Ground plane under D+/ D- traces

Team 2: Bluetooth Mass Storage Device By Ryan Weaver Bluetooth Module 5 Yucel ParsakYuri Kubo Scott PillowRyan Weaver Antenna Influenced by other components and metal 2mm proximity clearance Mounting Stacked above board Mechanical security

Team 2: Bluetooth Mass Storage Device By Ryan Weaver Oscillators 6 Yucel ParsakYuri Kubo Scott PillowRyan Weaver Low-power nature Sensitive to rapidly changing signals Located as close as possible to microcontroller No traces passing within the oscillator circuit (other than VSS or VDD) Grounded guard ring can be used

Team 2: Bluetooth Mass Storage Device By Ryan Weaver Power Supply 7 Yucel ParsakYuri Kubo Scott PillowRyan Weaver DC to DC Converter Minimize ground bounce and noise Keep IC’s GND and ground leads of I/O filter capacitors < 5mm apart Maximize output power and efficiency/ Minimize output ripple voltage Use a GND plane and solder the IC’s GND pin to GND plane High-frequency output noise reduced by a 0.1μF ceramic capacitor in parallel with the output filter capacitor

Team 2: Bluetooth Mass Storage Device By Ryan Weaver Preliminary PCB Layout Overview 8 Yucel ParsakYuri Kubo Scott PillowRyan Weaver

Team 2: Bluetooth Mass Storage Device By Ryan Weaver Yucel ParsakYuri Kubo Scott PillowRyan Weaver Questions?