Rapid Assemblers: From Analog to Digital Additive Manufacturing Computational Synthesis Lab Hod Lipson, Jonathan Hiller Mechanical & Aerospace Engineering.

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Presentation transcript:

Rapid Assemblers: From Analog to Digital Additive Manufacturing Computational Synthesis Lab Hod Lipson, Jonathan Hiller Mechanical & Aerospace Engineering Computing & Information Science Cornell University

Conclusions Digital Materials –Comprise lattice of physical voxels –High precision, work with incompatible materials –Tunable properties Rapid Assemblers –Assembles millions of prefabricated components into a integrated active structure –Parallel (laser printer) –Serial (inkjet printer)

Printable Robots

Model 1

Model 2

With Max Lobovsky

With Larry Bonassar, Daniel Cohen

Zinc-air Batteries Zinc-Air

IPMC Actuators

With Evan Malone

Gershenfeld, 2005

Digital Materials

70010,00025,00080,000187,000363,0001,000,0004,500,000

Challenges How to make voxels How to assemble billions of voxels How to simulate and design voxel-based systems

Key Challenges How to fabricate voxels How to assemble billions of voxels How to simulate and design in voxel space

Printing Digital Materials Parallel Assembly

Material Feeder Build Chamber

Fabricator

With Jonathan Hiller

Spheres

3D Circuits

Printing Digital Materials Rapid Serial Assembly

VoxJet

Accelerated x4

Voxels Tunable Material Properties

Tiles

Modeling - COMSOL

Simulating: Relaxation

Tile Precision

Dithering Materials

Tuning Elastic modulus

Tuning CTE

Auxetic Materials

Spheres

Precision x 0.5 x 0.1

Smart Voxels Future Directions

500 µm

Electrical conductivity

3D Micro-fluidics

Heterogeneous Tissue Engineering

Gershenfeld, 2005

From Analog to Digital

Conclusions Digital Materials –Comprise lattice of physical voxels –High precision, work with incompatible materials –Tunable properties Rapid Assemblers –Assembles millions of prefabricated components into a integrated active structure –Parallel (laser printer) –Serial (inkjet printer) New functionality –Desktop manufacturing of complex, 3D integrated active devices, without special tooling

Jeff I. Lipton Daniel L. CohenEvan Malone Jonathan Hiller