06/02/02CERN - LARG meeting1 CALIBRATION BOARD STATUS  Status of the DMILL chips used on the calib. boards  Low Offset Op Amps: Offset measurements 

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Presentation transcript:

06/02/02CERN - LARG meeting1 CALIBRATION BOARD STATUS  Status of the DMILL chips used on the calib. boards  Low Offset Op Amps: Offset measurements  Schedule for the fabrication of 2 calib boards (128 channels)

06/02/02CERN - LARG meeting2 DMILL CHIPS STATUS (For 2 « 128 channels » calib boards)  Low Offset Op. Amps:  130/board with a few uV offset after compensation: 364 available with initial offsets< ± 200 uV  Calogic:  Need of 12 for 2 boards: 40 chips in PQFP100 available  16 bits DAC, Spac Slave V3: 1/board. Expected in the last DMILL run which was unsucessfull. Only one wafer correct. Ceramic packaging (Week 7) of a few samples to test them as soon as possible  TTC Rx: 1/ board  Delay chips: 2/board

06/02/02CERN - LARG meeting3 OP. AMP: OFFSET before compensation Reception of 593 Op. Amps 19 OA out of working or with offset >10 mV Cuts ± 150 uV: 309/574= 53.8 % Cuts ± 200 uV: 364/574= 63.4 % Selection of OA with initial offset < 200 ± uV to be compensated to a few uV:

06/02/02CERN - LARG meeting4 CALIB 128: SCHEDULE (1) 8 channels prototype with DMILL analog and digital chips, before two « 128 channels calib boards »:  Printed Board: - Design ready the 18th of February (Week 8)  Fabrication of 3 printed boards: - 2 weeks (Week 10)  Soldering: - 1 week => 3 eight channels prototypes ready for test mid of March (Week 11).

06/02/02CERN - LARG meeting5 CALIB 128: SCHEDULE (2) 2 « 128 channels » calibration boards:  Design of the printed board as soon as the layout of the 8 channels prototype is finished  End of March (Week 14): Layout finished and all the files (layout, list of materials) ready for the call for tenders  As 52 days are mandatory after the call for tenders, the fabrication can ’t begin before the mid of june.  2 boards ready for test in september