Module 4B7 VLSI Design, Technology & CAD Engineering Tripos Part IIB You can find a pointer to an HTML version of this presentation at :

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Presentation transcript:

Module 4B7 VLSI Design, Technology & CAD Engineering Tripos Part IIB You can find a pointer to an HTML version of this presentation at : David Holburn David Moore

VLSI Design Microcircuit Engineering & Semiconductor Physics You can find a pointer to an HTML version of this presentation at : David Holburn

l 12 lectures in LR6:-  Friday at 12, Tuesday at 10 l Printed handouts (approximately one per lecture)  gaps to be filled in  places where you need to add your own notes l Two examples sheets:-  MOS circuits  Microelectronics technology l Various other notes and leaflets l Exam - start of Easter term l Coursework - later this term l Material on the WWW 4B7 VLSI Design, Technology & CAD

l 5 lectures in LR10 starting Thursday 12th October 2000:-  Lectures 1, 3 and 5: Thursdays at 11, LR10  Lectures 2 and 4:Mondays at 11, LR10  Practical sessionTBA l Printed handouts (approximately one per lecture)  places where you need to add your own notes l Video: From Sand to Silicon  planned for later in the term l Examples sheet and various other notes and leaflets l Material on the WWW M.E.S.P. VLSI Design

Spice Simulator

Coursework l Electrical characterisation of CMOS ring oscillator circuit l Takes place in EIETL/Part I Lab, Weeks 7-8

Coursework l SEM examination of CMOS ring oscillator circuit l Takes place in Electrical Research Lab, Weeks 7-8

Course Activities Visits to IC manufacturers l EEV (Chelmsford) – Charge-coupled imaging devices l Fujitsu (Durham)- Memory/Microprocessor manufacture

Guest Lecture l James Collier from Cambridge Silicon Radio is expected to give a talk an the evolution of their world-beating Bluetooth CMOS chip set … details later...

Case Study - Flash Memory Case study illustrating advanced VLSI design & manufacture l Intel® StrataFlash™ offers:  non-volatility,  reliability, and  smaller form factor. l MultiLevel Cell (MLC) technology stores multiple bits of data on a single memory transistor. l Allows increased densities and decreased cost-per-megabyte l Uses 0.18  m technology

Evolution of the Microprocessor Paper D7: VLSI Design, Technology & CAD Engineering Tripos Part IIB/EIST Part II You can find a pointer to an HTML version of this presentation at :

The First Transistor New York Times “ A device called a transistor, which has several applications in radio where a vacuum tube ordinarily is employed, was demonstrated for the first time yesterday at Bell Telephone Laboratories, 463 West Street, where it was invented.” 23rd December

The First Integrated Circuit 1958, Jack Kilby, a young electrical engineer at Texas Instruments, figured out how to put all the circuit elements - transistors, resistors, and capacitors, along with their interconnecting wiring - into a single piece of germanium. His rough prototype was a thin piece of germanium about one-half inch long containing five separate components linked together by tiny wires.

The Microprocessor 4004: Intel’s first microprocessor The speed of this 1971 device was estimated at 0.06 MIPS (million instructions/s). By comparison, in 2000 Intel's Pentium ran at 133 MHz, contained 5.5 million transistors, & could execute 300 MIPS. Complexity & speed have risen steadily since then! The 4-bit 4004 ran at 108 kHz & contained 2300 transistors.

Intel 8086/8088 and IBM PC 1978: 8086/8088 Microprocessor A pivotal sale to IBM’s new personal computer division made the 8088 the brains of IBM’s new ‘hit product’ -- the IBM PC. This was followed in 1982 by the 80286, on which was based the IBM PC/AT (Advanced Technology) computer.

Intel and The Intel ‘386 (1985) contained 275,000 transistors. It was Intel’s first ‘32-bit’ chip, and was capable of ‘multi-tasking’. The ‘486 (1989, shown) was significantly more powerful, and was the first to offer a built-in math. co-processor, greatly speeding up transcendental functions.

Intel Pentium The Pentium was first introduced in it was designed to allow computers to handle “real-world” data such as speech, sound and images. The latest Pentium II (1997) contained 7.5 million transistors, and is packaged in a unique format.

Scaling - Intel Pentium Origin design used MOSFETs with L=0.8  m  Speed limited to f clk = 66 MHz Shrink minimum dimension to 0.6  m  Raise clock to 100 MHz - 50% more throughput  Lower power consumption  Latest P4 uses L=0.09  m  f clk =3800MHz (internal)! Relative sizes

Moore’s Law l The Intel view of Gordon Moore’s observation. The billion-transistor chip is imminent!

Moore’s Law 1. Chip complexity doubles every process generation 2. Factory cost doubles every factory generation Complexity Pentium ® Pentium ® Pentium ® Pro $5000 $2000 $500 $200 Cost in $M cost complexity

Silicon Technology Intel386™ DX Processor1.5µ 1.0µ 1.0µ 0.8µ 0.8µ 0.6µ 0.6µ 0.4µ 0.4µ 0.25µ 0.25µ Silicon Process Technology Intel486™ DX Processor Pentium ® Processor Pentium ® II Processor

Wafers - 4" to 300 mm

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