24 March 2014 The ups and downs of the MaPSA project March

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Presentation transcript:

24 March 2014 The ups and downs of the MaPSA project March

MaPSA-Light Development (1) March + = MPA-wafer Sensor or MPA-MPW 6” or 8” Nov 2013

MaPSA-Light Development (1) March + = MPA-wafer Sensor or MPA-Light-MPW 6” or 8” NEW Sensor-Light 4”

MaPSA-Light Development (2) Try also assembly without requiring compatibility with TSV option, to have a best-case comparison basis March MPA wafer MPA wafer-level Test Sensor wafer Sensor test Sensor UBM, bump, dice MPA TSV Option MPA UBM, dice MaPSA assembly MaPSA test Chip foundry Sensor foundry Assembler 1 (TSV) Assembler 2 (no TSV) Assembler 3 (only TSV) HEP Nov 2013

Chats with TSV-capable companies IPdia – Visit to CERN 15 Jan IMEC – Visit to IMEC 26 Feb Both agreed that $/wafer was a likely TSV processing price – (Si sensor 6” wafer price estimate: 1200 CHF) Both spontaneously proposed alternatives to TSVs for MPA-MPA interconnectivity March

Outer Tracker Layout Evolution March Tilted Barrel is becoming baseline (no need for MPA z-interconnectivity anymore)

MaPSA-Light Development (2) TSV compatibility becomes low priority March MPA wafer MPA wafer-level Test Sensor wafer Sensor test Sensor UBM, bump, dice MPA TSV Option MPA UBM, dice MaPSA assembly MaPSA test Chip foundry Sensor foundry Assembler 1 (TSV) Assembler 2 (no TSV) Assembler 3 (only TSV) HEP NEW

MaPSA-Light Development (3) 8 Substrate Strip sensor Cooling SSA March 2014 MAPSA Nov 2013

MaPSA-Light Development (3) 9 March 2014 NEW PS module completely re-designed to cope with thermal load

MPA and bumps are between sensors ! 10 Strip sensor March 2014 Cooling Pixel Sensor …Plus: Cannot get bumped MPAs from TSMC Because of mixed wire/bump bond requirement - Why not shift constraint to more flexible sensor producer ?

Flipping the MaPSA upside down 11 Strip sensor March 2014 Cooling Pixel Sensor Strip sensor Cooling Extended Pixel Sensor Proposal Nov 2013

MaPSA-Light Development (3) Pixel Sensor is extended to include passive routing edge and wire bond area – Can this be done in 6” and 8” wafer? MPA has an additional I/O bump row – Can bumped 12” MPA-wafer be tested? Assembler does only MPA dicing and flip chipping MPA directly cooled (sensor cooled through MPA) Pix sensor HV connection as in 2S module No material between pix and strip sensor March Proposal Extended Pixel Sensor

Generous Development Sequence March MPA-Light design Req Doc RFQ Study OK MaPSA-Light Report MaPSA Test Production Q Q2Q3Q4Q Sensor-Light design Nov 2013

Slipping Development Sequence March MPA-Light design Req Doc RFQ Study OK MaPSA-Light Report MaPSA Test Production Q Q2Q3Q4Q Sensor-Light design NEW Flipped MPA