Summary of Winding Pack Thermal Results K. Freudenberg
Model and Mesh Color Scheme Purple = winding cable Red = Cu Cyan = winding insulation Blue = glue/insulation Magenta = Stainless steel Green = insulation
Top Connection Bottom Connection Scenario Options Break at inner tee comer (cases B,C) Direct copper connectivity across top (cases B,C) Copper connection at inner tee comer (cases A,D) Electrical Insulation/glue across top (cases A,D)
Properties and loading Initial Temperature = 80 K. The pulse is represented by heat generation (7.58 E7 W/m 3) and is applied for 1 sec. Temperature of cooling tube plate is set to 80 K Model is allowed to cool for 15 minutes before next pulse. Max expected loading is applied corresponding to 2 Tesla case. Max Load = J/m 3
Temperature profile after 15 mins Baseline (Case A ) (Case D ) Auto Scaled Case D Note: contours have the same scale, gray areas are higher than K.
Temperature profile after 15 mins (Case B ) (Case C ) Note: contours have the same scale, gray areas are higher than K. Auto Scaled Case C
Case B (Effect of tee “heat sink”) Case F (Tee Removed) Case B Note: contours have the same scale, gray areas are higher than K.
Temperature profile after 15 mins (Case E ) Maximum temperatures after 15 minutes Baseline (Case A )
Baseline (Case A) Time History over 15 mins t = 1 sec Immediately after pulse t = 3 minutes t = 9 minutest = 15 minutes
Baseline (Case A) Ratcheting Temperature after 10 cycles (t = 2.5 hrs) Nodal Temperature for Winding Pack Nodal Temperature for Tee Model Approaches steady state after 4 cycles
Case B: Time History Profile (ratcheting) Nodal Temperature for Winding Pack Nodal Temperature for Tee Model Approaches steady state after 3 cycles
Case C: Time History Profile (ratcheting) Nodal Temperature for Winding Pack Nodal Temperature for Tee Model approaches steady state after 2 cycles
(Little thermal Variation along length of coils due to increased coil conductivity in that direction) Case D (typical for all cases)
Closure For low conductivity glue/insulation, expect steady state at around K. If glue can be more conductive (i.e. less contact resistance) the value can be dropped to around K. Breaking the cladding at the lower corner of the tee does not have an appreciable effect on the temperature profile as shown by cases B and C. It raised the winding pack temperature slightly (1 degree). Removing the tee (i.e. floating winding pack) tends to cause slightly (1 degree or so) higher winding pack temperatures at least during the first pulse/cool down. All cases studied thus far achieve a steady state within 4 cycles. Recommend going with case B, trying to improve thermal conductivity of crimped connections. This eliminates the b-stage electrical break in the chill plate and eliminates one bent corner.