#4 (Oct. 22) Photolithgraphy -What is photolithgraphy? -Thin-film patterning using phtolithgraphy -Applications of photolithgraphy -Trends in minimum pattern.

Slides:

Advertisements

Similar presentations

Malaviya National Institute of Technology

Advertisements

(and briefly, Electrodeposition)

Chris A. Mack, Fundamental Principles of Optical Lithography, (c) 2007

CMOS Fabrication EMT 251.

Fabrication pH Electrode Using Lift-Off Method and Electrodeposition Presented by Na Zhang.

CHAPTER 9: PHOTOLITHOGRAPHY.

ECE/ChE 4752: Microelectronics Processing Laboratory

Lithography – Basic Concept

Lecture 14 Taken in part from Chapters Semiconductor Manufacturing Technology by Michael Quirk and Julian Serda.

INTEGRATED CIRCUITS Dr. Esam Yosry Lec. #6.

Vicki Bourget & Vinson Gee April 23, 2014

Photolithography Identify the basic steps of a photolithographic process Define and calculate depth of focus and explain how it is related to resolution.

Photolithography Photolithography is the transfer of patterns, circuits, device structures, etc. to a substrate or wafer using light and a mask.

Fabrication of p-n junction in Si Silicon wafer [1-0-0] Type: N Dopant: P Resistivity: Ω-cm Thickness: µm.

For the exclusive use of adopters of the book Introduction to Microelectronic Fabrication, Second Edition by Richard C. Jaeger. ISBN © 2002.

Design and Implementation of VLSI Systems (EN1600) lecture04 Sherief Reda Division of Engineering, Brown University Spring 2008 [sources: Sedra/Prentice.

EE143 – Ali JaveySlide 5-1 Section 2: Lithography Jaeger Chapter 2 Litho Reader.

Top Side Conductor vacuum deposition Aluminum sputter deposit in Argon plasma CVC 601-sputter deposition tool.

Design and Implementation of VLSI Systems (EN0160) Sherief Reda Division of Engineering, Brown University Spring 2007 [sources: Sedra/Prentice Hall, Saint/McGrawHill,

Lecture #51 Lecture #5 – VLSI Design Review zPhotolithography zPatterning Silicon zProcess steps used are: yStarts with Si wafer yThermal oxidation yPhotoresist.

ACTFEL Alternating Current Thin Film Electroluminescent Lamps.

1 Microfabrication Technologies Luiz Otávio Saraiva Ferreira LNLS

SOIMUMPs Process Flow Keith Miller Foundry Process Engineer.

YoHan Kim  Thin Film  Layer of material ranging from fractions of nanometer to several micro meters in thickness  Thin Film Process 

Device Fabrication Example

1 ME 381R Fall 2003 Micro-Nano Scale Thermal-Fluid Science and Technology Lecture 18: Introduction to MEMS Dr. Li Shi Department of Mechanical Engineering.

NANOSCALE LITHOGRAPHY MICHAEL JOHNSTON 4/13/2015.

Lecture 4 Photolithography.

Lithographic Processes

McGill Nanotools Microfabrication Processes

CS/EE 6710 CMOS Processing. N-type Transistor + - i electrons Vds +Vgs S G D.

Microelectronic Device Fabrication

Chapter 6 Photolithography

NANOMETER SCALE LITHOGRAPHY DANIEL BERNARD – BENJAMEN STROBELAPRIL 29, 2013 EE 4611 – STANLEY G. BURNS NANOMETER SCALE LITHOGRAPHY, ALSO KNOWN AS NANOLITHOGRAPHY,

By Madhushankar 10 Step Patterning. Previous Classes Raw wafer preparation Wafer Fabrication Oxidation.

Semiconductor Manufacturing Technology Michael Quirk & Julian Serda © October 2001 by Prentice Hall Chapter 9 IC Fabrication Process Overview.

Top Down Method Photolithography Basics Author’s Note: Significant portions of this work have been reproduced and/or adapted with permission from material.

Introduction to CMOS VLSI Design CMOS Fabrication and Layout Harris, 2004 Updated by Li Chen, 2010.

Fabrication Technology(1)

Introduction to Wafer fabrication Process

LITHOGRAPHY IN THE TOP-DOWN PROCESS - NEW CONCEPTS

PTC Proposal Seongjin Jang September 09, Submit Application To PTC All the users should submit their process-related information to Process Technology.

Center for Materials for Information Technology an NSF Materials Science and Engineering Center Optical Lithography Lecture 13 G.J. Mankey

ISAT 436 Micro-/Nanofabrication and Applications Photolithography David J. Lawrence Spring 2004.

CORPORATE INSTITUTE OF SCIENCE & TECHNOLOGY, BHOPAL DEPARTMENT OF ELECTRONICS & COMMUNICATIONS NMOS FABRICATION PROCESS - PROF. RAKESH K. JHA.

Lithography in the Top Down Method New Concepts Lithography In the Top-Down Process New Concepts Learning Objectives –To identify issues in current photolithography.

LITHOGRAPHY IN THE TOP-DOWN PROCESS - BASICS

 Refers to techniques for fabrication of 3D structures on the micrometer scale  Most methods use silicon as substrate material  Some of process involved.

CMOS VLSI Fabrication.

Section 2: Lithography Jaeger Chapter 2 EE143 – Ali Javey.

 A PCB is printed circuit board, also known as a printed wiring board. It is used in electronics to build electronic devices. A PCB serves 2 purposes.

Antenna Project in Cameron clean room Wafer preparation, conductor deposition, photolithography.

Equipment and technological processes for manufacturing GaAs MMICs LITHOGRAPHY ONE TALK 3 1.

Photolithography Photolithography is the transfer of patterns, circuits, device structures, etc. to a substrate or wafer using light and a mask.

Photolithography PEOPLE Program.

CMOS Fabrication CMOS transistors are fabricated on silicon wafer

Prof. Jang-Ung Park (박장웅)

Etching Processes for Microsystems Fabrication

Solid State Devices EE 3311 SMU

Manufacturing Process I

Lecture 4 Fundamentals of Multiscale Fabrication

Chapter 1 & Chapter 3.

VLSI System Design LEC3.1 CMOS FABRICATION REVIEW

Silicon Wafer cm (5’’- 8’’) mm

Memscap - A publicly traded MEMS company

Manufacturing Process I

LITHOGRAPHY Lithography is the process of imprinting a geometric pattern from a mask onto a thin layer of material called a resist which is a radiation.

Manufacturing Process I

Photolithography.

Presentation transcript:

#4 (Oct. 22) Photolithgraphy -What is photolithgraphy? -Thin-film patterning using phtolithgraphy -Applications of photolithgraphy -Trends in minimum pattern sizes

What Is Photolithgraphy? Photo + Lithograph Technologies to replicate patterns on a photomask to substrates or thin films on the substrates by using photo-chemical reaction photoresist Photomask Thin film on a substrate

What Is Photoresit A material that changes its solubility to developer by irradiation of light (ultraviolet or X ray) and electron beam Changes: (1) Non-soluble to solvable (positive-type photoresist) (2) Soluble to non-soluble (negative-type photoresist)

Composition of Photoresist Sensitizer

Change of Sensitizer by UV Irradiation Non-soluble Soluble

Purposes and Features of Photolithography Purposes -Fabrication of electron devices such as LSIs -Fabrication of micromachines -Packaging of LSIs and micromachines Features -Minimum size of 1  m or less is achievable -Batch process -Pattern repetition

a Photoresist （ 1  m ） Chromium thin film （ 50 nm) Fused-quartz substrate (1 mm) bab Photomask Fabrication (1) Chromium thin film deposition and photoresist deposition

Electron beam abab Photomask Fabrication (2)

abab Photomask Fabrication (3) Development

abab Photomask Fabrication (4) Etching of chromium thin film

abab Photomask Fabrication (5) Photoresisit removal

Silicon substrate abab Phtolithography of Al Thin Film (1)

SiO 2 thin film(1  m) abab Phtolithography of Al Thin Film (2)

Al thin film （ 1  m) abab Phtolithography of Al Thin Film (3)

Photoresist abab Phtolithography of Al Thin Film (4) Followed by pre-baking at 120 ℃

Mercury lamp Photomask abab Phtolithography of Al Thin Film (5)

Wavelength (nm) Intensity (relative) Emission Spectrum of Mercury Lamp

abab Phtolithography of Al Thin Film (6) Development Followed by post-baking at 120~180 ℃

abab Phtolithography of Al Thin Film (7) Al thin film etching

abab Phtolithography of Al Thin Film (8) Photoresist removal

aba Photoresist Lift-Off of Al Thin Film (1) b

(2) Mercury lamp Photomask abab Lift-Off of Al Thin Film (2)

abab Lift-Off of Al Thin Film (3) Development

abab Lift-Off of Al Thin Film (4)

(5) abab Lift-Off of Al Thin Film (5)

abab Lift-Off of Al Thin Film (6)

Wiring Using Al Thin Films Contact holes

Cross-Section of CMOS LSI

Electron beam scanner Reticle Photomask Stepper Pattern generator Stepper Pattern Size Reduction by Stepper Wafer Design data Contact aligner Projection aligner

Stepper

Trends in Minimum Pattern Size

Inside Clean Room (MIT)

by Richard P. Feynman There's Plenty of Room at the Bottom An Invitation to Enter a New Field of Physics Homework: Read This Article by 11/4