D. Cheng Feb 11, 2014 QXF Instrumentation Trace Update

Design Status 2/11/2014D. Cheng2 OL SQXF trace is ~80% complete – Design elements in place; spacing and locations to be finalized IL SQXF trace is ~15% complete Schedule estimate – Week of 2/17: Negative mask order to be placed – Week of 2/24: Negative mask received – Week of 3/10: Receive traces (HQ trace fab. may possibly bump this date) – Week of 3/17: QA’d traces ready for use

Material Status 2/11/2014D. Cheng3 LARP order has not been placed – Material requires 10 week lead time for order – May 2014 delivery, at the earliest, if ordered this month CERN has sent us 5m (600 mm wide) of their material for at least 3 sets of traces to start with – GTS #DEVL (same as one of LARP’s options) – 304L + Adhesive AS Apical AV

Outer Layer Lead End 2/11/2014D. Cheng4 VTB02 VTB04 VTB05a VTB03 VTB07a

Outer Layer Return End 2/11/2014D. Cheng5 VTB05b VTB07b VTB06

Production Status 2/11/2014D. Cheng6 Practice SQXF traces can be fabricated normal – But LBNL trace fabrication expert will be retiring 3/31 Options for the future (production) – LBNL tech training (on-going) – Possible return of expert (after mandatory separation) – Outside vendor qualifications*

Additional Slides 2/11/20147D. Cheng

Coil IL 2/11/20148D. Cheng

Reference: LARP Coil Instrumentation Traces 2/11/2014D. Cheng9 StainlessLaminate Adhesive* Polyimide (Apical AV) Additional Kapton** TQ/LQ304 / 25 µm15 µm25 µm- HQ Coils / 25 µm15 µm25 µm- HQ Coils / 25 µm15 µm25 µm HQ Coils / 25 µm15 µm25 µm50 µm HQ Coils / 25 µm15 µm25 µm LHQ304 / 25 µm15 µm25 µm50 µm *Modified cross-linked epoxy system, AS 1084 ** Joined by single strip of 3M VHB F-9460PC (More info in 9/23/13 presentation)

QXF Coil Instrumentation Trace Options 2/11/2014D. Cheng10 StainlessLaminate Adhesive* Polyimide Thickness Notes Apical AV304 / 25 µm15 µm50 µmCurrently used in LARP coils; extensive 4 K data Apical NP304 / 25 µm15 µm50 µmHigher strength version of AV; not as much published data for 4 K; currently what vendor has quoted Kapton MT304 / 25 µm15 µm50 µmHigh thermal conductivity polyimide, ~3x that of Kapton HN-equivalent at RT; 20% more expensive; only available in large quantities ($45k min. order) *Modified cross-linked epoxy system, AS 1084

Instrumentation Trace Fabrication Process 2/11/2014D. Cheng11 Design and print artwork (negative mask) Cut trace laminated material to length Cover conductive laminate with resist Expose resist under negative mask with UV light Wash the uncured resist from laminate Etch laminated material with cured resist pattern – Conductive layer covered by resist remains Remaining resist washed off by stripping agent

Instrumentation Trace Impreg. Preparations 2/11/2014D. Cheng12 Electrical QA Perforate polyimide layers Install during coil impregnation

Coil Processing: Impregnation Does CTD 101K epoxy exhibit acceptable radiation hardness? – What are the requirements? – What is the real data? Technical challenges for impregnation using Cyanate Ester blends (or other materials) must be overcome for long coils Instrumentation traces – Do laminated polyimide trace materials pose problems for impregnation? – Trace behavior (bubbles) on inside bore after testing cycle have continued April 9, 2013 D.W. Cheng - LARP CM20/HiLumi, Napa, CA 13 Bubbles on inside bore of LQS03 after magnet test Inside bore of HQ02a during assembly (Coil 15 was previously tested in HQ mirror)

April 9, 2013 D.W. Cheng - LARP CM20/HiLumi, Napa, CA 14