ITC-irst Researchers 217 Post docs 13 PhD students20 250 MM area FCS – Physics & Chemistry of Surfaces and Interfaces MIS – Microsystems IT area SRA –

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Presentation transcript:

ITC-irst Researchers 217 Post docs 13 PhD students MM area FCS – Physics & Chemistry of Surfaces and Interfaces MIS – Microsystems IT area SRA – Automated Reasoning Sytems SSI – Interactive Sensory Systems TCC – Cognitive and Communication Technologies

MIS Microsystems Head of Department: Mario Zen The department designs and realises silicon microsystems, especially: silicon particle detectors; sensors for bio-medical and environmental applications; micro-electro-mechanic systems (MEMS) for industrial and consumer applications; electro-optic microsystems for vision and non- destructive measurements.

Low temperature Wafer Bonding MEMS Technological fabrication modules Silicon anisotropic etching with TMAH solution Composite suspended membranes Lithography with thick film of photoresist Gold Electrodeposition

Clean Room Fabrication: the Lab. covers an area of 500 sqm (250 of which are in class 10) Furnaces 11 horizontal furnaces (diffusion,LPCVD depositions, Si3N4, Polysilicon, TEOS, BPSG and LTO) Implanter “Varian E 220 medium current” Lithographic Sector : Mask Aligner A “Karl Suss MA 150 BSA” and Resist processing systems “SVG 8600” and “EVG 150”. Etching Sector: Wet etching and Dry etching (Aluminium, Silicon dioxide Silicon nitride, Polysilicon etching) Metalization: Varian 3180 sputtering and Ulvac EBX-16C evaporator Dicing Disco DAD 2H-6T Testing HP 4062UX + EG2001CX - custom modified for double-side wafer Karl Suess PM8 - custom modified for double-side wafer testing

Lithographic Sector Mask Aligner A “Karl Suss MA 150 BSA” Resist processing systems “SVG 8600” and “EVG 150”.

Etching Sector Dry etching Aluminium, SiO 2, Si 3 N 4 and Poly Wet etching

Metalization Varian 3180 sputtering Ulvac EBX-16C evaporator

Furnaces Furnaces 11 horizontal furnaces diffusion,LPCVD depositions, Si3N4, Polysilicon, TEOS, BPSG and LTO

Ion Implanter Varian E 220 medium current

Inspection Sector Olympus MX50 microscope Leitz MPV-SP Interferometer for thickness control. 4 point Napson RT8-8 for resistivity control. Plasmos SD 2300 Ellipsometer for refraction index control

Packaging Sector Ultrasonic Gold Ball Bonder (K&S 4124). Disco DAD 2H-6T

testing Automatic wafer-level tester cassette-to-cassette, double-side testing, automatic sorting & inking, HP 4062UX + EG2001CX - custom modified for double- side wafer testing Manual Probe Station Karl Suess PM8 Electro-optical test system

New Equipments Now in clean room PECVD STS for nitride and oxide deposition Tegal 6510 dry etch system for metal and poly&nitride Plan for the next tree years Stepper wafer bonder dry etch system for metal deep RIE Boron deposition from solid source