Testing of ABC130 1

100  Not to scale! 100nF Edge Sensor wired to A9, A10 ? ABC nF NB graphic is not an exact match with “ABC_Pads_V5.2.pdf” – revision needed Analogue MUX pads here??? PROVISIONAL

SAMTEC Standard Probe card ends in 0.1” pitch header: add mezzanine PCB to adapt to hybrid compatible SAMTEC ABC130 “Baby” Sensor (optional) HV Propose companion single chip PCB with identical SAMTEC pinout. This takes one ABC130 and (optionally) a “baby” strip sensor SAMTEC Driver PCB

Functional Test Currents – Shunts and LDOs on and off??? Digital Test Vectors Analogue MUX – DACs, references, ??? Three Point Gain Driver needs extra circuitry over that needed for hybrids – Address & Enable lines – Route analogue signals to DVM – Analogue switches ???

5 Planning for ABC130 Hybrids – without HCC ABC130 and HCC submissions being done sequentially Results in ABC130 arriving ~3(?) months before HCC Should plan for ABC130 evaluation without HCC First at single chip level – followed by hybrid and then module Important to confirm that ABC130 works as expected when attached to a sensor Propose using an FPGA in place of HCC Acts as a ‘blank canvas’ – program to suit required configuration Aim for modular system providing seamless migration from wafer probing up to module level Speeds up evaluation of ASIC(s) at all levels of testing as DAQ changes are minimised Will impact upon hybrid layout – not realistic to add FPGA to a hybrid First hybrids will be exclusive of HCC All ABC130 – HCC connectivity will now be brought to edge of hybrid Will firstly hook up to FPGA which is mounted external to hybrid to access digital I/O Followed by HCC on plug-in For Plug-in candidate FPGA device identified – Xilinx Spartan 3AN series (XC3S50AN) Single chip solution offering integrated configuration memory, 2 x DCMs, 50 diff I/O, LVCMOS

6 Testing ABC130s at different stages – without HCC HSIO DAQ FPGA Wafer Probing Driver Board Module Test Driver Board designed to connect directly to Wafer probe card Hybrid test panel (hybrids tested individually) Module test frame without FPGA plug-ins FPGA plug-ins come later (if required) If using Driver board would require 2 off for a module Hybrids on Panel Provides both digital and analogue functionality – required for wafer probing

7 Testing modules – without HCC Hybrid To DAQ (only required if plug-ins used) Samtec SFMH series 50 pin connector (1.27mm pitch) 40 x 60mm Samtec FTSH series 50 pin connector Symmetric Module Future proof - replace Spartan with HCC HCC Drawn to scale to show that 2 plug-ins can fit adjacent to a module Driver board(s) connect directly to frame (bypass plug-ins)